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Infineon Technologies S29GL512T10GHI020
- Part No.:
- S29GL512T10GHI020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-VFBGA
- Datasheet:
-
S29GL512T10GHI020.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,037
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Product details
Overview
S29GL512T10GHI020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating at 2.7–3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). Used in boot code storage for industrial PLCs and firmware storage in network edge routers.
For engineers reviewing the S29GL512T10GHI020 datasheet, S29GL512T10GHI020 pinout, S29GL512T10GHI020 application, or S29GL512T10GHI020 equivalent, key selection factors include verified 100,000 program/erase cycles, 20-year data retention, TSOP-56 and BGA package options, Versatile I/O (1.65 V–VCC), and CFI-compliant interface for legacy embedded boot systems.
Technical Context
This device implements an asynchronous parallel interface with byte/word-selectable data bus (×8/×16), supporting execute-in-place (XIP) execution and data storage roles. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, while status register, data polling, and RY/BY# pin provide three concurrent status monitoring methods.
The architecture includes dedicated address space overlays (ASOs) for Device ID/CFI, Status Register, Data Polling, SSR (OTP), ECC status, and sector protection control. Sector-level locking uses both volatile (temporary) and non-volatile (permanent) methods, with four 2048-byte OTP regions-SSR0 factory-locked, SSR3 password-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - sufficient for full boot firmware + configuration storage in resource-constrained industrial controllers |
| Access Time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution without external cache in real-time deterministic systems |
| Page Access (tPACC) | 15 ns - accelerates sequential instruction fetch during boot initialization |
| Write Buffer Size | 512 bytes - reduces effective programming time by up to 4× vs. single-word writes in firmware update routines |
| ECC Support | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot paths |
| Endurance & Retention | 100,000 program/erase cycles / 20-year data retention - meets long-lifecycle requirements for deployed infrastructure equipment |
| Operating Voltage | VCC = 2.7–3.6 V, VIO = 1.65–VCC - allows interoperability with mixed-voltage SoC interfaces without level shifters |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint. Compatible with automated SMT placement and reflow profiles per J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 512 Mb linear addressing; A0 selects byte/word mode when x16 configured |
| DQ0–DQ15 | Data I/O (x16) | Bidirectional 16-bit data bus; operates as DQ0–DQ7 in x8 mode; supports Versatile I/O voltage range (1.65 V–VCC) |
| CE#, OE#, WE# | Chip Enable, Output Enable, Write Enable | Asynchronous control signals; CE# active-low enables device; OE#/WE# control read/write direction and timing windows |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: low = operation in progress; high = ready - used for polling-free interrupt-driven firmware flow |
| RESET# | Hardware Reset Input | Active-low asynchronous reset that halts ongoing program/erase and returns device to read mode within 100 ns |
Key Features
| Feature | Design Value |
|---|---|
| 45-nm MIRRORBIT™ Technology | Enables higher density and lower power vs. older floating-gate NOR; reduces die size by ~40% versus 65-nm predecessors |
| Uniform 128-KB Sectors | Allows precise firmware partitioning (e.g., bootloader, OS image, config) with independent erase control and protection |
| Suspend/Resume Commands | Permits interruption of long erase (up to 1 s) or program (up to 20 ms) operations to service high-priority reads |
| Advanced Sector Protection (ASP) | Combines software lock bits and hardware write-protect pins to prevent accidental overwrite in field-deployed units |
| CFI Parameter Table | Provides standardized JEDEC-compliant identification and timing data at known address - simplifies auto-detection in bootloader code |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Stores boot loader, real-time OS kernel, and motion control firmware in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP capability; provides deterministic <100 ns instruction fetch latency for hard real-time loop execution. Use Value: 20-year data retention ensures firmware integrity over equipment lifetime without scheduled refresh; 100,000-cycle endurance supports field firmware updates every 3 months for 25 years. | Use Scenario: Holds boot code and safety-monitor firmware for radar ECU in Level 2+ ADAS systems certified to ISO 26262 ASIL-B. IC Role / Device Role / Timing Role: Safety-critical boot memory with hardware ECC and sector lock; operates across –40°C to +105°C (AEC-Q100 Grade 2). Use Value: Internal single-bit ECC eliminates uncorrectable boot failures; ASP prevents corruption during vehicle power cycling or EMI events. |
| Network Edge Router Configuration | Medical Imaging System BIOS |
Use Scenario: Stores startup configuration, routing tables, and secure boot keys in carrier-grade edge routers requiring zero-downtime firmware upgrades. IC Role / Device Role / Timing Role: Dual-role memory: executes boot code via XIP and stores runtime configuration in protected sectors. Use Value: 512-byte write buffer enables sub-100 ms firmware patch writes; suspend/resume allows background config updates without interrupting packet forwarding. | Use Scenario: Hosts BIOS and diagnostic self-test firmware in FDA-cleared MRI and CT scanner control modules. IC Role / Device Role / Timing Role: Certified boot memory with traceable lifecycle; OTP array secures calibration keys and regulatory compliance flags. Use Value: Factory-locked SSR0 stores immutable regulatory signatures; password-protected SSR3 holds site-specific calibration parameters, preventing unauthorized recalibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI020 | Same density and core specs, but uses 64-ball LAE BGA (9 mm × 9 mm); lacks TSOP option | Preferred for space-constrained PCBs where board area is critical and thermal profile permits BGA reflow | Select when footprint reduction outweighs TSOP's ease of prototyping and repairability |
| MX29GL512FHT2I-90G | Macronix part with 90 ns tACC (vs. 100 ns), same 512 Mb density, no integrated ECC, requires external error handling | Suitable for cost-sensitive consumer gateways where ECC is managed in software or omitted | Choose only if system-level ECC is already implemented and tighter timing margin is required |
Compared with S29GL512S10TFI020, the TSOP-56 package of S29GL512T10GHI020 eases manual rework and test probe access; versus MX29GL512FHT2I-90G, its on-die ECC reduces firmware complexity and improves boot reliability in safety-aware systems.
Availability
S29GL512T10GHI020 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, network edge routers, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T10GHI020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The GL-T family targets high-reliability embedded systems needing deterministic boot performance, long-term data integrity, and seamless integration with legacy parallel bus microcontrollers and SoCs.
FAQ
Is S29GL512T10GHI020 compatible with legacy 3.3 V parallel NOR interfaces?
Yes. It supports full VCC = VIO operation at 3.0 V ±10%, matching standard 3.3 V logic levels. Its Versatile I/O feature also allows VIO as low as 1.65 V, enabling direct connection to 1.8 V or 2.5 V microcontroller buses without level shifters - confirmed in datasheet Section 8.4 and AC timing Table 11-1.
Does this device support true execute-in-place (XIP) operation?
Yes. With 100 ns random access time and asynchronous read capability, it enables direct CPU instruction fetch from flash without copying to RAM. The block diagram (Figure 1) and Product Overview (Section 1) explicitly state XIP compatibility, and timing specifications validate sub-100 ns access under industrial temperature conditions.
What is the function of the SSR (One-Time Programmable) array?
The 2048-byte SSR contains four lockable regions (SSR0–SSR3) for permanent storage of security keys, calibration data, or regulatory flags. SSR0 is factory-locked and immutable; SSR3 supports password-based read protection. This is documented in Sections 2.5 and 3.3 of the datasheet and used in medical and automotive applications for tamper-resistant data storage.
How does automatic ECC work during read operations?
Hardware ECC runs transparently on every read: single-bit errors are corrected in real time, and the corrected data is output without CPU intervention. A status bit in the ECC Status ASO (Section 2.7) indicates correction occurrence. No software driver or additional latency is required - this is implemented entirely in analog/mixed-signal circuitry per datasheet Section 5.3 and Figure 5-1.
S29GL512T10GHI020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-VFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-FBGA (9x7)
S29GL512T10GHI020 FAQ
1.How can I place an order for S29GL512T10GHI020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10GHI020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10GHI020 reliable?
The price and inventory of S29GL512T10GHI020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10GHI020 is usually 5 days.
3.What payment methods are accepted for S29GL512T10GHI020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10GHI020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10GHI020?
S29GL512T10GHI020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10GHI020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10GHI020?
For technical support, including S29GL512T10GHI020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10GHI020 requirements.
6.How does Aetrix verify that S29GL512T10GHI020 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10GHI020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10GHI020 meets industry standards.
7.What is the process for return or replacement of S29GL512T10GHI020?
All S29GL512T10GHI020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10GHI020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10GHI020 part is unused and in its original packaging.
Return procedure for S29GL512T10GHI020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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