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Infineon Technologies S29GL512T10TFA010
- Part No.:
- S29GL512T10TFA010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512T10TFA010.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,823
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Product details
Overview
S29GL512T10TFA010 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It integrates hardware ECC for single-bit error correction, supports 128-KB uniform sector erase, and includes a 512-byte programming buffer - deployed in industrial-grade embedded boot code storage and firmware update storage for microcontroller-based systems.
For engineers reviewing the S29GL512T10TFA010 datasheet, S29GL512T10TFA010 pinout, S29GL512T10TFA010 application, or S29GL512T10TFA010 equivalent, key selection criteria include verified 100,000 program/erase cycles, industrial temperature range (–40°C to +85°C), TSOP-56 package compatibility, and CFI-compliant interface for legacy host controller integration.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages autonomous program and erase operations, including suspend/resume capability and status reporting via Status Register, Data Polling, or RY/BY# pin.
The versatile I/O feature enables VIO operation from 1.65 V to VCC, decoupling I/O voltage from core supply. Internal hardware ECC operates transparently during read cycles, correcting single-bit errors without software intervention and flagging uncorrectable multi-bit errors via ECC status ASO.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full boot image + application firmware in resource-constrained industrial controllers |
| Random access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution from flash without external cache penalty |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch in burst-read scenarios |
| Programming buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| Erase endurance | 100,000 cycles per sector - supports field firmware updates over 10+ years in deployed equipment |
| Data retention | 20 years at +85°C - ensures long-term reliability in sealed industrial enclosures |
| Operating temperature | –40°C to +85°C (Industrial grade) - qualified for use in factory automation and motor drive control units |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm, 0.5 mm pitch, JEDEC standard MO-142AC.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address inputs | 21-bit address bus supporting full 512 Mb linear addressing (byte/word mode) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 or ×16 mode per configuration pins |
| CE#, OE#, WE# | Chip Enable, Output Enable, Write Enable | Standard asynchronous control signals; CE# active-low enables device; OE#/WE# control read/write direction |
| RY/BY# | Ready/Busy output | Open-drain status indicator - low during embedded program/erase, high when ready |
| VCC, VIO, GND | Power supplies | VCC = 2.7–3.6 V core supply; VIO = 1.65–VCC I/O supply; separate pins allow mixed-voltage host interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | Single-bit error correction with automatic detection and status flagging - eliminates need for external error-handling logic in safety-critical boot paths |
| 512-byte write buffer | Enables 512-byte buffered programming in one command - cuts typical firmware update time by >60% vs. byte-by-byte writes |
| Uniform 128-KB sectors | 128-KB erasable blocks with independent protection - allows granular firmware partitioning (e.g., bootloader vs. application) |
| Advanced sector protection (ASP) | Volatile and non-volatile lock modes per sector - prevents accidental overwrite during field upgrades or debug sessions |
| CFI parameter table | Standardized JEDEC JESD68 query structure - enables automatic driver initialization and runtime configuration on diverse host platforms |
Applications
| Industrial PLC Firmware Storage | Automotive ECU Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers with no external RAM caching. IC Role / Device Role / Timing Role: Primary non-volatile code storage with XIP-capable 100 ns random access - directly executed by ARM Cortex-M7 MCU. Use Value: Eliminates need for SRAM shadow copy; reduces BOM count and power consumption while maintaining deterministic startup timing. | Use Scenario: Holding certified bootloader and diagnostic firmware in Tier-1 automotive engine control units requiring AEC-Q100 compliance. IC Role / Device Role / Timing Role: Secure, ECC-protected boot memory with 128-KB sector locking - isolates bootloader from application updates. Use Value: Meets ISO 26262 ASIL-B requirements for fault detection and recovery via hardware ECC and sector-level write protection. |
| Medical Imaging System Configuration | Telecom Base Station FPGA Bitstream |
Use Scenario: Retaining calibration tables and device-specific configuration parameters across power cycles in portable ultrasound units. IC Role / Device Role / Timing Role: Non-volatile parameter store with OTP array (SSR0–SSR3) - factory-locked SSR0 holds serial ID; password-protected SSR3 stores encryption keys. Use Value: Ensures traceability and cryptographic integrity without external secure element, reducing design complexity and cost. | Use Scenario: Loading FPGA configuration bitstreams at power-on in 5G remote radio units with strict boot-time constraints. IC Role / Device Role / Timing Role: High-speed parallel configuration memory - 15 ns page access enables sub-100 ms FPGA initialization from cold start. Use Value: Achieves faster system readiness than SPI flash alternatives, meeting telecom SLA requirements for rapid service restoration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI010 | Same density and pinout, but rated for –40°C to +105°C (Industrial Plus) and uses LAE BGA package instead of TSOP-56 | Required where extended thermal margin is needed in enclosed power electronics enclosures | Select when board layout allows BGA and ambient exceeds +85°C during operation |
| MX29GL512FHI-10G | 512 Mb parallel NOR, 100 ns tACC, but lacks integrated ECC and OTP array; uses different command set and CFI implementation | Suitable for cost-sensitive designs where ECC is handled in software or external logic | Choose only if existing driver stack supports Macronix command protocol and ECC is implemented externally |
Compared with S29GL512S10TFI010, the S29GL512T10TFA010 offers TSOP-56 compatibility and lower thermal grade - ideal for space-constrained industrial boards needing proven manufacturability. Versus MX29GL512FHI-10G, it delivers hardware ECC and OTP security features out-of-box, reducing firmware validation effort for safety-critical deployments.
Availability
S29GL512T10TFA010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot memory, and medical imaging system configuration requiring stable component supply and long-term lifecycle support.
Supply support for S29GL512T10TFA010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and industrial memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-T family targets high-reliability embedded systems requiring XIP-capable parallel NOR flash with integrated ECC, sector protection, and extended temperature operation - designed specifically for industrial control, automotive, and medical applications demanding data integrity and long-term stability.
FAQ
Does S29GL512T10TFA010 support both ×8 and ×16 data bus modes?
Yes. The device automatically detects bus width via the BYTE# pin state at power-up: BYTE# high configures ×16 mode (DQ0–DQ15 active); BYTE# low selects ×8 mode (DQ0–DQ7 active). This dual-mode capability allows reuse across 8-bit and 16-bit host interfaces without hardware redesign.
What is the function of the SSR (One-Time Programmable) array?
The 2048-byte SSR array contains four lockable regions (SSR0–SSR3). SSR0 is factory-locked and holds unique device identifiers; SSR3 supports password-protected read access for storing cryptographic keys. Once locked, regions cannot be reprogrammed - enabling secure device authentication and firmware binding.
How does the Ready/Busy# (RY/BY#) pin behave during erase operations?
RY/BY# goes low at the start of any embedded erase operation and remains low until completion, including internal verification and ECC checking. It returns high only after the entire sector erase sequence finishes successfully or aborts with error - providing precise hardware-synchronized status for interrupt-driven host control.
Is the CFI parameter table accessible without issuing commands?
Yes. The Common Flash Interface (CFI) table resides at fixed address offsets (0x0055, 0x0056, etc.) and is readable using standard asynchronous read cycles after issuing the CFI Query command (0x98). No special timing or voltage sequencing is required - enabling plug-and-play driver initialization on x86, ARM, and RISC-V hosts.
S29GL512T10TFA010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512T10TFA010 FAQ
1.How can I place an order for S29GL512T10TFA010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10TFA010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10TFA010 reliable?
The price and inventory of S29GL512T10TFA010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10TFA010 is usually 5 days.
3.What payment methods are accepted for S29GL512T10TFA010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10TFA010 transactions.
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4.How is shipping managed for S29GL512T10TFA010?
S29GL512T10TFA010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10TFA010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10TFA010?
For technical support, including S29GL512T10TFA010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10TFA010 requirements.
6.How does Aetrix verify that S29GL512T10TFA010 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10TFA010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10TFA010 meets industry standards.
7.What is the process for return or replacement of S29GL512T10TFA010?
All S29GL512T10TFA010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10TFA010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10TFA010 part is unused and in its original packaging.
Return procedure for S29GL512T10TFA010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T10TFA010 Tags
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