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Infineon Technologies S29GL512T10TFI010
- Part No.:
- S29GL512T10TFI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512T10TFI010.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,125
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Product details
Overview
S29GL512T10TFI010 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal single-bit ECC, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). Used in boot code storage for industrial controllers requiring deterministic XIP execution.
For engineers reviewing the S29GL512T10TFI010 datasheet, S29GL512T10TFI010 pinout, S29GL512T10TFI010 application, or S29GL512T10TFI010 equivalent, key selection criteria include verified 100,000 program/erase cycles, 20-year data retention, TSOP-56 and BGA package compatibility, and support for CFI-compliant firmware update architectures.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations without external microcontroller intervention.
The hardware ECC engine corrects single-bit errors on-the-fly during read, while the status register and RY/BY# pin provide real-time operation monitoring. Sector protection includes volatile (lock bits) and non-volatile (ASP) methods, plus a 2048-byte OTP array with four lockable SSR regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full boot image + firmware partition in industrial HMI systems |
| Random access time | 100 ns at –40°C to +85°C - enables sub-10 MHz CPU wait-state-free XIP execution |
| Page access time | 15 ns - accelerates sequential instruction fetch in cached code regions |
| Write buffer size | 512 bytes - reduces average programming time by >60% vs. single-word writes |
| Erase endurance | 100,000 cycles per sector - supports field firmware updates over 10+ years of operation |
| Data retention | 20 years at +85°C - meets long-lifecycle requirements for infrastructure control systems |
| Operating voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - allows direct interfacing with 1.8 V/3.3 V logic without level shifters |
Pinout & Package
Package: 56-pin TSOP (Type I, 14 mm × 20 mm), RoHS-compliant, lead-free, JEDEC MO-142 standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb decoding (byte/word mode) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; operates in ×8 or ×16 mode via BYTE# pin |
| CE#, OE#, WE# | Chip Enable, Output Enable, Write Enable | Asynchronous control signals enabling standard SRAM-like timing interface |
| RY/BY# | Ready/Busy output | Open-drain status indicator for embedded program/erase completion detection |
| RESET# | Hardware reset input | Active-low signal forcing device into reset state; required for power-on initialization |
| VCC, VIO, GND | Power supplies | Separate core (VCC) and I/O (VIO) rails allow mixed-voltage system integration |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO = 1.65 V to VCC - eliminates level translators when interfacing with 1.8 V FPGAs or 3.3 V MCUs |
| Embedded Algorithm Controller (EAC) | Self-contained program/erase logic - removes host CPU overhead and guarantees timing compliance |
| Hardware ECC engine | Single-bit error correction on read - prevents silent data corruption in safety-critical boot code |
| Advanced Sector Protection (ASP) | Volatile and non-volatile lock bits per 128-KB sector - enables secure bootloader partitioning |
| One-Time Programmable (OTP) array | 2048-byte SSR with password-protected SSR3 - stores cryptographic keys or calibration data permanently |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and real-time control logic in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency. Use Value: Deterministic startup within 500 ms and immunity to power interruption during field firmware updates due to suspend/resume capability. | Use Scenario: Holding certified boot loader and sensor fusion firmware in automotive camera ECU modules compliant with AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Secure, high-reliability boot memory with OTP-based key storage and ECC-protected code integrity verification. Use Value: Meets ISO 26262 ASIL-B requirements through hardware ECC, 100K-cycle endurance, and -40°C to +105°C operational stability. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound devices requiring regulatory traceability and long-term data integrity. IC Role / Device Role / Timing Role: Dual-role memory storing both executable firmware and calibrated sensor parameters in separate protected sectors. Use Value: 20-year data retention at +85°C ensures device lifetime compliance without periodic reprogramming or battery-backed SRAM. | Use Scenario: Storing field-upgradable protocol stacks and hardware configuration profiles in 5G remote radio units operating in uncontrolled outdoor enclosures. IC Role / Device Role / Timing Role: High-density, radiation-tolerant configuration memory supporting hot-swap firmware updates via CFI-compliant command set. Use Value: 512-byte write buffer enables <100 ms firmware patch application, minimizing service downtime during network maintenance windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI010 | Same density and pinout, but uses older 65-nm process; 110 ns tACC vs. 100 ns | Lacks Versatile I/O (VIO fixed to VCC); no 1.65 V–VCC flexibility | Select only if legacy design reuse requires identical timing margins and lower cost is critical |
| MX29GL512FHI-10G | Macronix part with 100 ns tACC, same TSOP-56 package, but no hardware ECC or OTP array | Requires external ECC implementation; lacks SSR-based secure key storage | Choose when cost sensitivity outweighs need for integrated security and error resilience |
Compared with S29GL512S10TFI010 and MX29GL512FHI-10G, the S29GL512T10TFI010 delivers superior reliability via on-die ECC and secure provisioning via OTP, while maintaining full pin compatibility and tighter timing for demanding XIP use cases.
Availability
S29GL512T10TFI010 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T10TFI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-T family targets high-reliability embedded systems needing deterministic boot performance, combining XIP speed with data storage density - optimized for industrial automation, automotive ECUs, and telecom infrastructure.
FAQ
Does S29GL512T10TFI010 support both ×8 and ×16 data bus modes?
Yes. The device automatically configures its data bus width based on the BYTE# pin state: asserted low for ×16 mode (DQ0–DQ15 active), high for ×8 mode (DQ0–DQ7 active). This dual-mode capability simplifies migration between 8-bit and 16-bit host processors without PCB redesign.
What is the function of the SSR (Secure Silicon Region) and how is it protected?
The SSR is a 2048-byte OTP array divided into four lockable regions (SSR0–SSR3). SSR0 is factory-locked; SSR3 supports password-based read protection. Once locked, SSR contents cannot be modified or read without the correct password, enabling secure storage of cryptographic keys or calibration data.
How does the hardware ECC operate during normal read cycles?
The ECC engine performs single-bit error correction transparently during every read operation. If a single-bit error is detected in a 512-byte sector, it is corrected before data is presented on DQ lines. No software intervention or additional timing overhead is required - correction occurs within the specified tACC window.
Can S29GL512T10TFI010 be used in systems requiring AEC-Q100 Grade 2 qualification?
No. S29GL512T10TFI010 is rated for Industrial grade (–40°C to +85°C). For AEC-Q100 Grade 2 (–40°C to +105°C), the automotive-qualified variant S29GL512T10TFI020 must be used - it shares identical functionality and pinout but undergoes additional stress testing and lot traceability per automotive standards.
S29GL512T10TFI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512T10TFI010 FAQ
1.How can I place an order for S29GL512T10TFI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10TFI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10TFI010 reliable?
The price and inventory of S29GL512T10TFI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10TFI010 is usually 5 days.
3.What payment methods are accepted for S29GL512T10TFI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10TFI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10TFI010?
S29GL512T10TFI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10TFI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10TFI010?
For technical support, including S29GL512T10TFI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10TFI010 requirements.
6.How does Aetrix verify that S29GL512T10TFI010 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10TFI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10TFI010 meets industry standards.
7.What is the process for return or replacement of S29GL512T10TFI010?
All S29GL512T10TFI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10TFI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10TFI010 part is unused and in its original packaging.
Return procedure for S29GL512T10TFI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T10TFI010 Tags
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