My Inquiry
My Account
Infineon Technologies S29GL512T10TFI013
- Part No.:
- S29GL512T10TFI013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512T10TFI013.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:990
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL512T10TFI013 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit error correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers requiring fast XIP execution and reliable firmware retention.
For engineers reviewing the S29GL512T10TFI013 datasheet, S29GL512T10TFI013 pinout, S29GL512T10TFI013 application, or S29GL512T10TFI013 equivalent, key selection criteria include verified 100,000 program/erase cycles, 20-year data retention, OTP array with four lockable SSR regions, CFI compliance, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 configurable data bus and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages autonomous program and erase operations, including automatic ECC generation and verification per 512-byte sector.
The versatile I/O feature enables independent VIO supply (1.65 V to VCC), allowing interfacing with mixed-voltage systems. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods, while the 2048-byte OTP array includes factory-locked SSR0 and password-protected SSR3 for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full boot image + firmware + parameter storage in industrial controllers |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution without external cache in real-time systems |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot initialization |
| Write buffer size | 512 bytes - reduces effective programming time by up to 4× vs. single-word writes |
| ECC capability | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical designs |
| Endurance & retention | 100,000 program/erase cycles / 20-year data retention - meets long-lifecycle requirements for telecom infrastructure |
| Operating voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - supports interoperability with 1.8 V, 2.5 V, and 3.3 V logic families |
| Temperature grade | Industrial (–40°C to +85°C) - qualified for deployment in uncontrolled ambient environments like base station cabinets |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142 variant with gull-wing leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb linear addressing (byte/word aligned) |
| DQ0–DQ15 | Data I/O | Configurable ×8 (DQ0–DQ7) or ×16 (DQ0–DQ15) bidirectional data path with tristate control |
| CE# | Chip enable | Active-low device select; tCE = 100 ns max - defines minimum chip selection window for burst reads |
| OE# | Output enable | Active-low read strobe; tOE = 25 ns - controls data valid timing relative to address setup |
| WE# | Write enable | Active-low write strobe; initiates command latching or data programming sequence |
| RY/BY# | Ready/Busy output | Open-drain status indicator - low during embedded operations, high when ready for next command |
| RESET# | Hardware reset | Active-low asynchronous reset that halts all operations and returns device to read mode |
| VCC, VIO, GND | Power supplies | Separate core (VCC) and I/O (VIO) rails enable mixed-voltage system integration |
Key Features
| Feature | Design Value |
|---|---|
| 512-byte programming buffer | Enables single-command multi-word programming, reducing host CPU overhead and improving firmware update throughput |
| Hardware ECC engine | Corrects single-bit errors on-the-fly during read, eliminating software ECC latency and memory bandwidth penalty |
| Uniform 128-KB sectors | Supports deterministic erase timing (245 KBps) and simplifies partitioning for bootloader, kernel, and filesystem segments |
| Suspend/Resume commands | Allows interruption of long erase or program operations to service higher-priority read requests - critical for real-time responsiveness |
| Four-lock OTP array (SSR0–SSR3) | Provides secure storage for calibration data, MAC addresses, or cryptographic keys with graded access control (factory-locked SSR0, password-protected SSR3) |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader, real-time OS kernel, and motion control firmware in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency to meet deterministic scan cycle deadlines. Use Value: 20-year data retention and 100,000-cycle endurance ensure firmware integrity across 15+ year equipment lifespans without field reprogramming. | Use Scenario: Holding boot code and sensor fusion firmware for radar/EPS ECUs in vehicles certified to AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Certified industrial-plus flash serving as primary boot device with hardware ECC to meet ASIL-B functional safety requirements. Use Value: Internal ECC and sector-level protection prevent silent corruption during voltage transients common in automotive 12 V systems. |
| Telecom Base Station Configuration | Medical Imaging System Parameter Storage |
Use Scenario: Storing FPGA configuration bitstreams, RF calibration tables, and protocol stack binaries in 5G macrocell baseband units. IC Role / Device Role / Timing Role: High-reliability parallel flash interfaced to ARM Cortex-A series processors via static memory controller with wait-state-free operation. Use Value: 15 ns page access time accelerates FPGA reconfiguration sequences, reducing cell site downtime during OTA updates. | Use Scenario: Retaining DICOM metadata templates, gamma correction LUTs, and regulatory audit logs in FDA-cleared MRI/PET console systems. IC Role / Device Role / Timing Role: Secure, tamper-resistant non-volatile memory with OTP-locked SSR regions for storing immutable calibration signatures. Use Value: Factory-locked SSR0 and password-protected SSR3 satisfy IEC 62304 traceability and data integrity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI010 | Same density and package, but uses older 65-nm process; 110 ns tACC vs. 100 ns; no OTP array | Lacks SSR-based secure storage; unsuitable for applications requiring locked calibration data | Select only if cost sensitivity outweighs need for OTP security and faster access |
| MX29GL512FHI-10G | Micron equivalent with identical 512 Mb density, 100 ns tACC, and CFI compliance; different pinout (64-ball FBGA only) | Requires PCB redesign due to incompatible 64-ball LAE BGA footprint vs. 56-pin TSOP | Choose only when migrating to space-constrained designs where BGA is preferred over TSOP |
Compared with S29GL512S10TFI010, the S29GL512T10TFI013 delivers faster access, built-in ECC, and secure OTP - making it superior for safety- and security-critical deployments. Versus MX29GL512FHI-10G, it offers drop-in compatibility in TSOP layouts but trades off board-area efficiency for ease of assembly and thermal management.
Availability
S29GL512T10TFI013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and telecom base station configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T10TFI013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and mission-critical applications.
The GL-T family targets high-reliability embedded systems needing XIP-capable flash with robust data integrity, extended temperature operation, and integrated security features - specifically designed for boot code and firmware storage where failure is not an option.
FAQ
Is S29GL512T10TFI013 compatible with legacy S29GL512P devices?
No. The S29GL512T uses a revised command set and enhanced EAC architecture versus the P-series. While pin-compatible in TSOP packages, differences in status register layout, OTP access protocols, and suspend behavior require firmware updates and validation before substitution.
Does this device support byte-write operations without erasing the full sector?
Yes. The device supports single-word and multiple-word programming within an already-erased sector without requiring additional sector erase. However, each word can be rewritten only after its containing sector has been erased - no in-place overwrite capability exists.
What is the function of the RY/BY# pin during power-up?
During power-on reset, RY/BY# remains low until internal voltage regulators stabilize and the device completes initialization (~100 μs). It transitions high only after the device enters read mode and is ready to accept commands - serving as a hardware-ready signal for the host processor.
Can the OTP array be reprogrammed after initial lock?
No. Once SSR0–SSR3 are locked (via SET_LOCK command), the corresponding OTP regions become permanently read-only. SSR0 is factory-locked and cannot be unlocked; SSR3 supports password-based read protection but no reprogramming - consistent with one-time programmable design intent.
S29GL512T10TFI013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512T10TFI013 FAQ
1.How can I place an order for S29GL512T10TFI013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10TFI013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10TFI013 reliable?
The price and inventory of S29GL512T10TFI013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10TFI013 is usually 5 days.
3.What payment methods are accepted for S29GL512T10TFI013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10TFI013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10TFI013?
S29GL512T10TFI013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10TFI013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10TFI013?
For technical support, including S29GL512T10TFI013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10TFI013 requirements.
6.How does Aetrix verify that S29GL512T10TFI013 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10TFI013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10TFI013 meets industry standards.
7.What is the process for return or replacement of S29GL512T10TFI013?
All S29GL512T10TFI013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10TFI013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10TFI013 part is unused and in its original packaging.
Return procedure for S29GL512T10TFI013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T10TFI013 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
