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Infineon Technologies S29GL512T10TFI023
- Part No.:
- S29GL512T10TFI023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512T10TFI023.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,661
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Product details
Overview
S29GL512T10TFI023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating at 2.7–3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL512T10TFI023 datasheet, S29GL512T10TFI023 pinout, S29GL512T10TFI023 application, or S29GL512T10TFI023 equivalent, key selection criteria include verified 100,000 program/erase cycles, 20-year data retention, OTP array with four lockable SSR regions, CFI-compliant interface, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 configurable data bus and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages autonomous program and erase operations, including automatic ECC generation and verification per 512-byte sector.
The architecture includes dedicated address space overlays (ASOs) for Status Register, Data Polling, SSR (OTP), and ECC status, enabling real-time monitoring without host CPU intervention. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods, with factory-locked SSR0 and password-protected SSR3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images and configuration tables in resource-constrained embedded systems |
| Supply Voltage | 2.7 V to 3.6 V - single VCC operation simplifies power design vs. dual-rail flash |
| Random Access Time | 100 ns (–40°C to +85°C) - enables direct XIP execution without external cache penalty |
| Page Access Time | 15 ns - accelerates sequential instruction fetch within cached pages |
| Write Buffer Size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC Support | Internal hardware single-bit error correction - eliminates need for external ECC logic or software overhead |
| Data Retention | 20 years - ensures long-term reliability in unattended industrial deployments |
| Endurance | 100,000 program/erase cycles - supports field-upgradable firmware with robust wear leveling |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), standard JEDEC MO-141AC footprint, 18.4 mm × 10.16 mm × 1.2 mm height.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 512-Mb linear addressing (byte/word mode) |
| DQ0–DQ15 | Data I/O | Configurable ×8 (DQ0–DQ7) or ×16 (DQ0–DQ15) bidirectional data bus |
| CE# | Chip Enable | Active-low chip select; controls device power state and command latching |
| OE# | Output Enable | Active-low read strobe; gates output drivers without affecting internal state |
| WE# | Write Enable | Active-low control for write/program/erase command initiation |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: low = operation in progress, high = ready |
| VCC | Core Supply | 2.7–3.6 V main supply for all read/program/erase functions |
| VIO | I/O Supply | 1.65–VCC versatile I/O voltage - allows interfacing with 1.8 V or 3.3 V controllers |
| RESET# | Hardware Reset | Active-low asynchronous reset that halts ongoing operations and clears status registers |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Independent 1.65–VCC I/O supply enables mixed-voltage system integration without level shifters |
| 512-byte Programming Buffer | Reduces average programming time by >60% vs. single-word writes in firmware update scenarios |
| Hardware ECC | Single-bit correction implemented in silicon - no firmware overhead or latency penalty during reads |
| OTP Array with SSR Locking | 2048-byte one-time-programmable region with four independently lockable sectors for secure key storage |
| Suspend/Resume Capability | Allows interrupting erase or program operations to service higher-priority reads - critical for real-time response |
Applications
| Industrial PLC Boot Memory | Automotive ADAS Firmware Storage |
|---|---|
Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with deterministic 100 ns access latency. Use Value: Eliminates external SRAM caching requirement while ensuring 20-year firmware integrity under thermal cycling. | Use Scenario: Holding calibrated sensor fusion algorithms and safety-critical firmware in automotive camera ECU modules. IC Role / Device Role / Timing Role: AEC-Q100 grade 3 certified flash storing immutable firmware with hardware ECC and sector-level protection. Use Value: Meets ISO 26262 ASIL-B requirements via built-in error detection, OTP-secured calibration data, and 100K-cycle endurance. |
| Medical Imaging System Configuration | Telecom Base Station BIOS |
Use Scenario: Storing device-specific calibration profiles and regulatory compliance parameters in portable ultrasound units. IC Role / Device Role / Timing Role: Secure parameter storage using SSR3 password-protected OTP region for HIPAA-compliant data isolation. Use Value: Prevents unauthorized modification of FDA-cleared imaging parameters while enabling field updates to non-secure sectors. | Use Scenario: Hosting BIOS and FPGA configuration bitstreams in 5G radio unit baseband processors. IC Role / Device Role / Timing Role: High-reliability parallel flash interfaced to ARM Cortex-A series host via 16-bit bus for fast boot initialization. Use Value: Achieves <200 ms cold-boot time due to 15 ns page access and suspend/resume capability during diagnostics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI020 | Same density and package, but uses older 65-nm process; 110 ns tACC vs. 100 ns | Lacks hardware ECC and OTP SSR locking; no password-protected region | Select only if cost sensitivity outweighs ECC requirement and long-term data integrity needs |
| MX29GL512FHI-10G | Micron part with identical 512 Mb density, 100 ns tACC, and CFI compliance; no SSR OTP array | Supports only volatile sector protection; no factory-locked or password-protected OTP regions | Choose when CFI compatibility and timing match are primary, and secure key storage is handled externally |
Compared with S29GL512S10TFI020 and MX29GL512FHI-10G, the S29GL512T10TFI023 uniquely integrates hardware ECC, four-region OTP with password protection, and suspend/resume-enabling safer, longer-life firmware storage in safety-critical systems without external error-handling logic.
Availability
S29GL512T10TFI023 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging devices, and telecom base stations requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T10TFI023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing fast XIP execution and robust non-volatile storage - designed specifically for industrial control, automotive, and medical applications demanding long-term data integrity and security.
FAQ
What is the maximum operating temperature range for S29GL512T10TFI023?
The S29GL512T10TFI023 is rated for industrial temperature range: –40°C to +85°C. This is confirmed in the datasheet's "Temperature range / grade" section and applies to all electrical and timing specifications unless otherwise noted for extended grades. The part number suffix "I" explicitly denotes Industrial grade.
Does this device support both ×8 and ×16 data bus configurations?
Yes, S29GL512T10TFI023 supports configurable ×8 (DQ0–DQ7) or ×16 (DQ0–DQ15) operation. Bus width is determined by hardware configuration: WP#/ACC pin state at power-up selects word vs. byte mode, and address/data mapping follows JEDEC-standard parallel NOR conventions.
How does the hardware ECC function during read operations?
Hardware ECC operates transparently on every read: the device automatically calculates and checks Hamming-code parity across each 512-byte sector. If a single-bit error is detected, it is corrected in real time before data is driven onto DQ lines, and the ECC status register (bit 3) is set - no host intervention or additional timing overhead is required.
Can the OTP array be reprogrammed after initial programming?
No. The 2048-byte OTP array is physically one-time programmable. Once a bit is set to '0', it cannot be changed back to '1'. SSR0 is factory-locked and permanently read-only; SSR3 supports password-based read protection but remains write-once. Programming is performed via standard CFI commands with specific unlock sequences.
S29GL512T10TFI023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512T10TFI023 FAQ
1.How can I place an order for S29GL512T10TFI023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10TFI023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10TFI023 reliable?
The price and inventory of S29GL512T10TFI023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10TFI023 is usually 5 days.
3.What payment methods are accepted for S29GL512T10TFI023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10TFI023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10TFI023?
S29GL512T10TFI023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10TFI023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10TFI023?
For technical support, including S29GL512T10TFI023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10TFI023 requirements.
6.How does Aetrix verify that S29GL512T10TFI023 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10TFI023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10TFI023 meets industry standards.
7.What is the process for return or replacement of S29GL512T10TFI023?
All S29GL512T10TFI023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10TFI023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10TFI023 part is unused and in its original packaging.
Return procedure for S29GL512T10TFI023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T10TFI023 Tags
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