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Infineon Technologies S29GL512T10TFI033
- Part No.:
- S29GL512T10TFI033
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512T10TFI033.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:900
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Product details
Overview
S29GL512T10TFI033 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL512T10TFI033 datasheet, S29GL512T10TFI033 pinout, S29GL512T10TFI033 application, or S29GL512T10TFI033 equivalent, key selection criteria include asynchronous parallel interface timing, OTP array configuration, sector protection granularity, and industrial-grade thermal performance across voltage variation.
Technical Context
This device implements an embedded algorithm controller (EAC) that executes program/erase operations autonomously without host CPU intervention. Its CFI-compliant interface enables plug-and-play compatibility with standard flash memory controllers, while the versatile I/O feature allows independent VIO supply (1.65 V to VCC) decoupled from core VCC.
The internal hardware ECC operates transparently during read cycles, correcting single-bit errors on-the-fly and reporting uncorrectable multi-bit errors via status register flags. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods, with four 2048-byte OTP regions-SSR0 factory-locked and SSR3 password-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB), organized as 4,194,304 × 16-bit or 8,388,608 × 8-bit |
| Read Access Time | 100 ns max at –40°C to +85°C, enabling real-time boot code fetch in microcontroller systems |
| Page Access Time | 15 ns max, supporting high-throughput sequential instruction reads |
| Write Buffer Size | 512 bytes, allowing burst programming of up to 256 words per command |
| ECC Capability | Single-bit error correction with automatic detection, reducing system-level error handling overhead |
| Endurance & Retention | 100,000 program/erase cycles and 20-year data retention at 85°C |
| Operating Voltage | VCC = 2.7 V to 3.6 V; VIO = 1.65 V to VCC, enabling mixed-voltage board integration |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, JEDEC MO-141AC compliant, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 512 Mb addressing (byte/word boundary aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; configurable as 8-bit via BYTE# control |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE ≤ 100 ns defines minimum chip select assertion window |
| OE# | Output Enable | Active-low control for data output gating; tOE ≤ 25 ns ensures fast read turnaround |
| WE# | Write Enable | Active-low signal initiating write/program commands; synchronized with address/data setup/hold timing |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: low = operation in progress, high = ready/completed |
| RESET# | Hardware Reset | Active-low asynchronous reset clearing internal state and aborting ongoing operations |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous Page Read | 32-byte burst capability with 15 ns page access enables efficient instruction prefetch in XIP applications |
| Uniform Sector Architecture | 512 × 128-KB sectors simplify firmware partitioning and field update management |
| OTP Array with SSR Locking | 2048-byte one-time-programmable space with four lockable regions supports secure boot key storage |
| Suspend/Resume Commands | Allows interrupting erase or program operations to service higher-priority reads, critical for real-time systems |
| Common Flash Interface (CFI) | Standardized parameter table enables automatic driver initialization without hard-coded timing constants |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers with frequent field updates. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with <100 ns latency. Use Value: Uniform 128-KB sectors allow atomic firmware image replacement without partial corruption risk. | Use Scenario: Holding safety-critical boot code and calibration data in automotive camera ECU modules certified to AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Industrial Plus grade (–40°C to +105°C) parallel flash ensuring deterministic startup under engine bay thermal stress. Use Value: Hardware ECC guarantees integrity of boot instructions even after 10+ years of vehicle service life. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Storing diagnostic firmware and regulatory-compliant configuration parameters in FDA-cleared imaging equipment. IC Role / Device Role / Timing Role: Secure non-volatile memory with OTP-locked SSR0 region for immutable regulatory signature storage. Use Value: Factory-locked SSR0 prevents tampering with FDA-required boot authentication keys. | Use Scenario: Hosting FPGA configuration bitstreams and runtime parameter tables in 5G baseband units requiring hot-swap resilience. IC Role / Device Role / Timing Role: High-reliability parallel flash supporting suspend/resume during live traffic handover events. Use Value: Ability to pause 128-KB sector erase mid-operation avoids service interruption during maintenance windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI020 | Same density and package but older 65-nm process; 110 ns random access; no OTP array | Lacks SSR-based security features and has lower endurance (10K cycles) | Select only if legacy design reuse requires identical footprint without security requirements |
| MX29GL512FPTI-90G | Micron 45-nm part; same 100 ns access, but CFI implementation differs; no hardware ECC | Requires external error handling; OTP not supported; different command set timing margins | Choose when cost sensitivity outweighs ECC and OTP needs, and driver software can accommodate timing variances |
Compared with S29GL512S10TFI020 and MX29GL512FPTI-90G, the S29GL512T10TFI033 uniquely combines hardware ECC, factory-locked OTP, and suspend/resume - making it the only option for safety-critical boot memory where data integrity and secure key storage are mandatory.
Availability
S29GL512T10TFI033 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system BIOS requiring stable component supply across extended lifecycle programs.
Supply support for S29GL512T10TFI033 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The GL-T family targets high-reliability embedded systems needing XIP-capable parallel NOR flash with integrated ECC and secure OTP - specifically designed for boot code integrity in mission-critical environments.
FAQ
What is the function of the RY/BY# pin on S29GL512T10TFI033?
The RY/BY# pin is an open-drain ready/busy status output. It asserts low during internal program, erase, or suspend operations and returns high when the device completes the operation or enters standby. This signal eliminates polling overhead and enables precise timing coordination with host processors in real-time systems.
Does S29GL512T10TFI033 support byte-wide data access?
Yes, it supports both ×8 and ×16 data bus configurations. When BYTE# is driven high, DQ0–DQ7 operate as an 8-bit data bus with A0 ignored; when BYTE# is low, the full 16-bit bus (DQ0–DQ15) is active. This flexibility allows seamless integration with 8-bit microcontrollers or 16-bit DSPs without external data-width translation logic.
How does the OTP array work in S29GL512T10TFI033?
The 2048-byte OTP array is divided into four 512-byte sectors (SSR0–SSR3). SSR0 is permanently locked at factory; SSR1 and SSR2 are user-lockable via command sequence; SSR3 supports password-based read protection. Once locked, sectors cannot be reprogrammed, making them suitable for storing cryptographic keys or calibration constants that must remain immutable.
Can S29GL512T10TFI033 operate with VIO = 1.8 V while VCC = 3.3 V?
Yes, the versatile I/O feature explicitly supports VIO from 1.65 V to VCC. With VCC = 3.3 V, VIO may be set to 1.8 V to interface directly with low-voltage FPGAs or ASICs, while maintaining full 3.3 V core functionality. All input thresholds and output drive strengths are guaranteed across this VIO range per datasheet Section 10.4.
S29GL512T10TFI033 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512T10TFI033 FAQ
1.How can I place an order for S29GL512T10TFI033 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10TFI033 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10TFI033 reliable?
The price and inventory of S29GL512T10TFI033 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10TFI033 is usually 5 days.
3.What payment methods are accepted for S29GL512T10TFI033?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10TFI033 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10TFI033?
S29GL512T10TFI033 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10TFI033 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10TFI033?
For technical support, including S29GL512T10TFI033 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10TFI033 requirements.
6.How does Aetrix verify that S29GL512T10TFI033 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10TFI033 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10TFI033 meets industry standards.
7.What is the process for return or replacement of S29GL512T10TFI033?
All S29GL512T10TFI033 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10TFI033, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10TFI033 part is unused and in its original packaging.
Return procedure for S29GL512T10TFI033:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T10TFI033 Tags
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