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Infineon Technologies S29GL512T10TFI040
- Part No.:
- S29GL512T10TFI040
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512T10TFI040.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:268
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Product details
Overview
S29GL512T10TFI040 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It integrates hardware ECC for single-bit error correction, supports 128-KB uniform sector erase, and includes a 512-byte programming buffer for accelerated write throughput. It is qualified for industrial temperature range (–40°C to +85°C) and used in boot code storage for embedded controllers.
For engineers reviewing the S29GL512T10TFI040 datasheet, S29GL512T10TFI040 pinout, S29GL512T10TFI040 application, or S29GL512T10TFI040 equivalent, key selection criteria include its 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI-compliant interface, and support for suspend/resume during erase and program operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration, supporting byte- and word-aligned addressing. Its embedded algorithm controller (EAC) manages all program and erase operations autonomously, including automatic ECC generation and verification during writes and reads.
The flash uses a dual-bit-per-cell MIRRORBIT™ architecture enabling higher density without compromising reliability. Sector protection is implemented via both volatile (lock bits) and non-volatile (ASP) methods, and the 2048-byte OTP array includes factory-locked SSR0 and password-protected SSR3 for secure firmware storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - sufficient for full boot image + firmware partition in resource-constrained embedded systems |
| Supply Voltage | 2.7 V to 3.6 V - single VCC rail simplifies power design and enables compatibility with 3.3 V logic domains |
| Random Access Time | 100 ns at –40°C to +85°C - meets real-time boot latency requirements for industrial microcontrollers |
| Page Access Time | 15 ns - enables high-throughput sequential read during XIP execution or firmware loading |
| Programming Buffer | 512 bytes - reduces effective programming time by up to 10× vs. single-word writes in firmware update routines |
| ECC Support | Internal hardware single-bit correction - eliminates need for external ECC logic in safety-critical boot memory paths |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years of operation |
| Data Retention | 20 years - ensures long-term integrity of stored bootloader and calibration data without refresh |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 512 Mb linear addressing (byte mode); A0 selects LSB in ×16 mode |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 (DQ0–DQ7) or ×16 mode depending on BYTE# state |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE = 100 ns max defines minimum chip select assertion window |
| OE# | Output Enable | Active-low control for data output; tOE = 25 ns max governs read timing margin in high-speed interfaces |
| WE# | Write Enable | Active-low signal initiating internal program/erase commands; latches command sequences on rising edge |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations, enabling polling-based host synchronization |
| RESET# | Hardware Reset | Active-low asynchronous reset that halts ongoing operations and returns device to read mode within 100 μs |
| VCC | Core Supply | 2.7–3.6 V main supply powering core logic, memory array, and EAC; decoupling required per datasheet layout guidelines |
| VIO | I/O Supply | 1.65 V to VCC versatile I/O voltage - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V host buses without level shifters |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC Engine | On-die single-bit error correction with no CPU overhead - maintains data integrity during power loss or radiation events |
| 512-Byte Programming Buffer | Enables burst programming of up to 512 bytes per command - cuts firmware update time by >80% vs. legacy flash parts |
| Uniform 128-KB Sectors | 64 identical sectors simplify BOM management and enable deterministic erase scheduling in OTA update stacks |
| OTP Array with SSR Locking | 2048-byte one-time-programmable space with four independently lockable regions - secures cryptographic keys and device identity |
| Suspend/Resume Capability | Interrupts active program/erase to service high-priority reads - essential for real-time OS environments with mixed memory access |
| CFI Compliance | Standardized parameter table accessible via read commands - enables auto-detection and driver portability across flash vendors |
Applications
| Industrial PLC Boot Memory | Automotive Instrument Cluster Firmware |
|---|---|
Use Scenario: Stores boot loader and real-time OS kernel for programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency. Use Value: 20-year data retention and 100,000-cycle endurance ensure reliable operation over 15+ year product lifecycles without field replacement. |
Use Scenario: Holds calibrated display firmware and safety-critical UI assets in automotive digital instrument clusters. IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified parallel flash serving as primary firmware store with hardware ECC. Use Value: Internal ECC and SSR-locked OTP protect against corruption during vehicle battery transients and ESD events. |
| Medical Imaging System BIOS | Telecom Base Station Configuration |
Use Scenario: Hosts diagnostic BIOS and FPGA configuration bitstreams in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: High-reliability boot memory supporting fast cold-start and secure firmware validation. Use Value: Versatile I/O (1.65 V–3.6 V) enables direct connection to 1.8 V FPGA configuration buses without level translation. |
Use Scenario: Stores field-upgradable configuration tables and protocol stacks in 5G radio unit control modules. IC Role / Device Role / Timing Role: Parallel NOR flash with suspend/resume used for concurrent read/write during live network reconfiguration. Use Value: 512-byte buffer and sector erase allow atomic firmware patching without interrupting baseband processing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI020 | Same density and package but uses older 65-nm process; 110 ns random access; no OTP array | Lacks SSR locking and hardware ECC - unsuitable for security-sensitive or safety-certified designs | Select only when cost sensitivity outweighs ECC and OTP requirements |
| MX29GL512FHI-90G | Micron 512 Mb parallel NOR; 90 ns access; no built-in ECC; supports CFI but no suspend/resume | Requires external ECC logic and lacks firmware update flexibility due to missing suspend capability | Prefer where legacy toolchain compatibility is prioritized over modern reliability features |
Compared with S29GL512S10TFI020 and MX29GL512FHI-90G, the S29GL512T10TFI040 delivers superior reliability through integrated ECC and secure OTP, plus operational flexibility via suspend/resume-critical for real-time embedded systems requiring concurrent firmware updates and execution.
Availability
S29GL512T10TFI040 is available at Aetrix Electronics and suitable for industrial PLCs, automotive instrument clusters, medical imaging BIOS, and telecom base station configuration requiring stable component supply across extended lifecycle programs.
Supply support for S29GL512T10TFI040 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded applications demanding XIP performance, long-term data retention, and robust firmware protection-designed specifically for industrial automation, automotive, and medical electronics.
FAQ
Does S29GL512T10TFI040 support both ×8 and ×16 data bus modes?
Yes, it supports configurable ×8 or ×16 operation via the BYTE# pin. In ×16 mode, DQ0–DQ15 carry 16-bit data with A0 ignored; in ×8 mode, DQ0–DQ7 are active and A0 selects odd/even bytes. This dual-mode flexibility simplifies migration between 8-bit and 16-bit host processors without PCB redesign.
What is the function of the SSR (Secure Silicon Region) and how is it protected?
The 2048-byte OTP array contains four lockable SSR regions (SSR0–SSR3). SSR0 is factory-locked and immutable; SSR3 supports password-based read protection. Locking is permanent and irreversible, ensuring cryptographic keys or device identifiers remain tamper-proof after programming-critical for secure boot and anti-cloning.
Can S29GL512T10TFI040 be used in automotive applications?
Yes, the "I040" suffix denotes Industrial Plus grade (–40°C to +105°C), which satisfies AEC-Q100 Grade 2 requirements. It is widely deployed in instrument clusters and ADAS control units where extended temperature operation and hardware ECC are mandatory for functional safety compliance.
How does the 512-byte programming buffer improve firmware update efficiency?
The buffer allows up to 512 bytes to be loaded before initiating a single embedded program operation, reducing command overhead and bus arbitration delays. Measured performance shows 1.14 MBps effective write speed-over 8× faster than single-word programming-enabling sub-second firmware patches in field-deployed devices.
S29GL512T10TFI040 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512T10TFI040 FAQ
1.How can I place an order for S29GL512T10TFI040 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10TFI040 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10TFI040 reliable?
The price and inventory of S29GL512T10TFI040 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10TFI040 is usually 5 days.
3.What payment methods are accepted for S29GL512T10TFI040?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10TFI040 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10TFI040?
S29GL512T10TFI040 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10TFI040 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10TFI040?
For technical support, including S29GL512T10TFI040 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10TFI040 requirements.
6.How does Aetrix verify that S29GL512T10TFI040 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10TFI040 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10TFI040 meets industry standards.
7.What is the process for return or replacement of S29GL512T10TFI040?
All S29GL512T10TFI040 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10TFI040, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10TFI040 part is unused and in its original packaging.
Return procedure for S29GL512T10TFI040:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T10TFI040 Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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M24C02-FMC6TG
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