My Inquiry
My Account
Infineon Technologies S29GL512T10TFI043
- Part No.:
- S29GL512T10TFI043
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512T10TFI043.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,541
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL512T10TFI043 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile firmware retention.
For engineers reviewing the S29GL512T10TFI043 datasheet, S29GL512T10TFI043 pinout, S29GL512T10TFI043 application, or S29GL512T10TFI043 equivalent, key selection criteria include verified 100,000 program/erase cycles, 20-year data retention, TSOP-56 or FBGA packaging options, and support for asynchronous read, suspend/resume, and advanced sector protection (ASP) with OTP lockable regions.
Technical Context
This device implements an embedded algorithm controller (EAC) that executes internal program/erase operations without host CPU intervention, reducing software overhead. Its versatile I/O supports VIO from 1.65 V to VCC, enabling interoperability with mixed-voltage system buses while maintaining full 8-/16-bit data width operation.
The flash array is organized into uniform 128-KB sectors with independent locking capability via ASP, and includes a dedicated 2048-byte one-time programmable (OTP) array partitioned into four lockable SSR regions - SSR0 factory-locked, SSR3 password-protected - for secure boot configuration and device identity storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full firmware images and parameter tables in industrial HMI and gateway applications |
| Random access time | 100 ns at –40°C to +85°C - enables direct XIP execution of real-time control code without external cache |
| Page access time | 15 ns - accelerates sequential instruction fetch during boot or diagnostic routines |
| Write buffer size | 512 bytes - reduces effective programming time by up to 4× vs. single-word writes in firmware update scenarios |
| ECC capability | Internal hardware single-bit error correction - maintains data integrity without host-side ECC processing overhead |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years in deployed equipment |
| Data retention | 20 years at +85°C - ensures long-term reliability in unattended infrastructure systems |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint, lead-free and RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb addressing (byte/word boundary aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 or ×16 mode per configuration |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low control for data output driver; enables read data gating |
| WE# | Write enable | Active-low control for write/program command initiation and data capture |
| RY/BY# | Ready/Busy indicator | Open-drain status signal indicating ongoing embedded operations (program/erase) |
| VCC | Core supply | 2.7 V to 3.6 V single supply for all operations - eliminates need for separate I/O rail |
| VIO | I/O supply | 1.65 V to VCC - allows interface with 1.8 V, 2.5 V, or 3.3 V logic without level shifters |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO = 1.65 V to VCC enables seamless integration with mixed-voltage SoCs and FPGAs without external level translation |
| 512-byte programming buffer | Reduces firmware update time by buffering up to 512 bytes before internal write execution - critical for OTA reliability |
| Hardware ECC | Single-bit error correction performed autonomously in hardware - preserves system-level data integrity without CPU load |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per 128-KB sector - prevents accidental overwrite of bootloader or calibration data |
| OTP array with SSR locking | 2048-byte factory-programmable space with four independently lockable regions (SSR0–SSR3), including password-protected SSR3 for secure keys |
Applications
| Industrial PLC Firmware Storage | Automotive ECU Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and safety-critical control algorithms in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency to meet deterministic scan cycle timing. Use Value: 20-year data retention and 100,000-cycle endurance ensure firmware integrity across extended maintenance intervals without recalibration or replacement. | Use Scenario: Holding certified boot code and ASW configuration data in automotive engine control units compliant with AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Secure boot memory with OTP-based SSR3 password protection and hardware ECC to satisfy ISO 26262 ASIL-B functional safety requirements. Use Value: Sector-level ASP and factory-locked SSR0 prevent unauthorized modification of bootloader, supporting secure boot chain validation. |
| Medical Imaging System Parameter Storage | Telecom Base Station Configuration Memory |
Use Scenario: Retaining calibrated imaging parameters, user profiles, and regulatory compliance settings in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: High-reliability non-volatile storage with 128-KB uniform sectors enabling atomic parameter bank updates without data corruption risk. Use Value: Suspend/resume capability allows safe interruption of sector erase during power-loss events - preserving clinical configuration integrity. | Use Scenario: Storing FPGA bitstreams, radio calibration tables, and protocol stack configurations in 5G remote radio units operating in outdoor enclosures. IC Role / Device Role / Timing Role: Parallel NOR flash interfaced directly to FPGA fabric for low-latency configuration loading and runtime parameter access. Use Value: 15 ns page access time accelerates FPGA reconfiguration sequences, reducing service downtime during field upgrades. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S10TFI020 | Same density and architecture but uses older 65-nm process; 110 ns random access; no OTP SSR3 password protection | Lacks secure boot features required for ISO 26262 or IEC 62304 certification | Select only for cost-sensitive legacy designs where security and max speed are not critical |
| MX29GL512FHT2I-10G | Micron part with identical 512 Mb density, 100 ns tACC, but no hardware ECC and only 10,000 erase cycles | Not suitable for applications requiring >10,000 field firmware updates or long-term data integrity assurance | Consider only for short-lifecycle consumer devices with infrequent updates |
Compared with S29GL512S10TFI020 and MX29GL512FHT2I-10G, the S29GL512T10TFI043 delivers superior reliability via 45-nm process, hardware ECC, 10× higher endurance, and secure OTP locking - making it the only choice for safety-critical or long-life industrial deployments.
Availability
S29GL512T10TFI043 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot memory, and medical imaging parameter retention requiring stable component supply across multi-year production programs.
Supply support for S29GL512T10TFI043 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and high-reliability memory solutions for industrial and automotive markets.
The GL-T family was designed specifically for embedded systems requiring fast XIP execution, robust firmware storage, and long-term data integrity - bridging performance gaps between traditional NOR and NAND flash in mission-critical applications.
FAQ
Does S29GL512T10TFI043 support both ×8 and ×16 data bus modes?
Yes. The device automatically detects bus width via the BYTE# pin: when pulled high, it operates in ×16 mode (DQ0–DQ15 active); when pulled low, it operates in ×8 mode (DQ0–DQ7 active). This dual-mode flexibility simplifies migration between microcontroller platforms with differing bus widths without PCB redesign.
What is the function of the RY/BY# pin, and how is it used in system design?
RY/BY# is an open-drain ready/busy status indicator. It goes low during embedded program or erase operations and returns high when complete. System firmware must monitor this pin (or use status register polling) to avoid issuing new commands prematurely - essential for preventing command conflicts and ensuring data integrity during firmware updates.
Can the OTP array be reprogrammed after initial programming?
No. The 2048-byte OTP array is permanently programmable once written. Each of the four SSR regions (SSR0–SSR3) can be individually locked: SSR0 is factory-locked and irreversible; SSR3 supports password-based read protection, which, once enabled, prevents further reads without the correct password - enforcing secure key storage and immutable boot configuration.
Is the S29GL512T10TFI043 compatible with legacy S29GL512P devices?
No. While pin-compatible in TSOP-56 package, the S29GL512T introduces architectural enhancements including hardware ECC, enhanced ASP, and OTP SSR locking not present in the P-series. Command set extensions and status register bits differ - firmware must be updated to leverage new features or maintain compatibility with existing drivers.
S29GL512T10TFI043 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 100 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512T10TFI043 FAQ
1.How can I place an order for S29GL512T10TFI043 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T10TFI043 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T10TFI043 reliable?
The price and inventory of S29GL512T10TFI043 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T10TFI043 is usually 5 days.
3.What payment methods are accepted for S29GL512T10TFI043?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T10TFI043 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T10TFI043?
S29GL512T10TFI043 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T10TFI043 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T10TFI043?
For technical support, including S29GL512T10TFI043 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T10TFI043 requirements.
6.How does Aetrix verify that S29GL512T10TFI043 is sourced from the original manufacturer or authorized distributors?
All S29GL512T10TFI043 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T10TFI043 meets industry standards.
7.What is the process for return or replacement of S29GL512T10TFI043?
All S29GL512T10TFI043 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T10TFI043, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T10TFI043 part is unused and in its original packaging.
Return procedure for S29GL512T10TFI043:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T10TFI043 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
