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Infineon Technologies S29GL512T11DHB010
- Part No.:
- S29GL512T11DHB010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T11DHB010.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,034
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Product details
Overview
S29GL512T11DHB010 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile firmware retention.
For engineers reviewing the S29GL512T11DHB010 datasheet, S29GL512T11DHB010 pinout, S29GL512T11DHB010 application, or S29GL512T11DHB010 equivalent, key selection criteria include verified 100,000 program/erase cycles, 20-year data retention, TSOP-56 and BGA package compatibility, Versatile I/O support (1.65 V to VCC), and CFI-compliant software interface for legacy embedded systems.
Technical Context
This device implements asynchronous parallel interface logic with dedicated CE#, OE#, and WE# control lines, supporting both byte (×8) and word (×16) data bus configurations. Its embedded algorithm controller (EAC) manages all program/erase operations autonomously, including suspend/resume capability and status reporting via Status Register, Data Polling, or RY/BY# pin.
The internal architecture includes a 128-KB uniform sector layout, a separate 2048-byte one-time-programmable (OTP) array with four lockable SSR regions, and hardware-based ECC that corrects single-bit errors on-the-fly during read operations without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - sufficient for full boot image + firmware + configuration storage in resource-constrained microcontrollers |
| Read Access Time | 100 ns (tACC) - enables direct XIP execution from flash without external cache in real-time industrial firmware |
| Page Access Time | 15 ns (tPACC) - accelerates sequential instruction fetch during burst reads in boot loader initialization |
| Write Buffer Size | 512 bytes - reduces effective programming time by up to 10× vs. single-word writes in firmware update routines |
| ECC Support | Hardware single-bit error correction - ensures data integrity over 20-year retention without host-side ECC overhead |
| Endurance | 100,000 program/erase cycles - validated for frequent field firmware updates in industrial gateways |
| Operating Temp | –40°C to +85°C (Industrial grade) - qualified for deployment in uncontrolled ambient environments like factory-floor PLCs |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm body, standard JEDEC MO-142AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 512 Mb addressing (byte/word boundary aligned) |
| DQ0–DQ15 | Data Input/Output | 16-bit bidirectional data bus; configurable as ×8 (DQ0–DQ7) or ×16 mode via BYTE# pin |
| CE# | Chip Enable | Active-low chip select; controls device power state and enables read/write access when asserted |
| OE# | Output Enable | Active-low control for data bus output drivers; used to gate read data onto shared system data bus |
| WE# | Write Enable | Active-low signal initiating write/program/erase commands; latches command sequences on rising edge |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: low = operation in progress, high = ready for next command |
| BYTE# | Bus Width Select | Low = ×16 mode (DQ0–DQ15 active), high = ×8 mode (DQ0–DQ7 only, DQ8–DQ15 high-Z) |
| VCC | Core Supply | 2.7 V to 3.6 V single supply powering core logic, memory array, and EAC - no auxiliary voltage required |
| VIO | I/O Supply | 1.65 V to VCC - decouples I/O voltage from core, enabling interoperability with 1.8 V/2.5 V/3.3 V host processors |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O Voltage Range | VIO supports 1.65 V to VCC - eliminates level-shifting components when interfacing with mixed-voltage SoCs |
| Hardware ECC Engine | On-die single-bit error correction - removes need for external ECC logic or software overhead in safety-critical boot paths |
| Program/Erase Suspend | Allows read access during background erase - enables real-time status monitoring without halting firmware updates |
| Advanced Sector Protection | Volatile/non-volatile locking per 128-KB sector - prevents accidental overwrite of bootloader or calibration data in field-deployed units |
| CFI-Compatible Interface | Standard Common Flash Interface parameter table - ensures drop-in compatibility with existing flash-aware BIOS/bootloader stacks |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing boot code and runtime firmware for programmable logic controllers deployed in factory automation systems. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic 100 ns latency. Use Value: Enables deterministic startup within 50 ms and supports field firmware updates via 512-byte buffered programming without system reset. | Use Scenario: Holding calibrated display graphics, gauge logic, and safety-critical boot images in automotive digital instrument clusters. IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified parallel NOR flash serving as primary boot source for MCU during cold start. Use Value: Guarantees 20-year data retention at 85°C ambient and withstands 100,000 reprogramming cycles across vehicle lifetime. |
| Medical Imaging Device Configuration | Telecom Base Station Control Firmware |
Use Scenario: Retaining calibration tables, user preferences, and regulatory compliance settings in portable ultrasound and MRI control units. IC Role / Device Role / Timing Role: Secure, OTP-backed configuration store with SSR0 factory-locked for immutable safety parameters. Use Value: Prevents unauthorized modification of FDA/IEC 62304-mandated calibration data while allowing field-updatable UI assets. | Use Scenario: Hosting FPGA configuration bitstreams and baseband processor boot images in 4G/5G remote radio units. IC Role / Device Role / Timing Role: High-reliability parallel flash interfaced directly to ARM Cortex-A series host processors via 16-bit bus. Use Value: Delivers 1.14 MBps buffered programming speed and 120 ns max access at +105°C for rapid field upgrades in outdoor enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFI010 | Same density and timing, but uses 64-ball LAE BGA (9 mm × 9 mm); lacks Versatile I/O (VIO fixed at VCC) | Preferred for space-constrained PCBs where BGA routing is acceptable and host I/O voltage matches VCC | Select when board area is critical and no mixed-voltage I/O is required |
| MX29GL512FHI-90G | Macronix part with identical 512 Mb density, 90 ns tACC, but no hardware ECC and only 10K endurance cycles | Suitable for cost-sensitive consumer applications where ECC and long-term reliability are secondary | Choose only if firmware update frequency is low and ECC is implemented in software |
Compared with S29GL512S11TFI010 and MX29GL512FHI-90G, the S29GL512T11DHB010 uniquely combines Versatile I/O, hardware ECC, and 100K-cycle endurance in a TSOP-56 package-making it optimal for industrial designs requiring field upgrade resilience and mixed-voltage compatibility without BGA assembly complexity.
Availability
S29GL512T11DHB010 is available at Aetrix Electronics and suitable for industrial PLCs, automotive instrument clusters, medical imaging devices, and telecom base station control systems requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T11DHB010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and R&D infrastructure.
The GL-T family was designed specifically for high-reliability embedded boot memory applications demanding XIP performance, long data retention, and robust program/erase endurance in harsh thermal environments.
FAQ
Is S29GL512T11DHB010 pin-compatible with earlier S29GL512P or S29GL512N variants?
No. S29GL512T11DHB010 uses the updated GL-T architecture with revised command set, enhanced ECC, and Versatile I/O support. Pinout is compatible with other GL-T series parts (e.g., S29GL512S), but not with legacy P/N variants due to differences in status reporting and protection register mapping.
Does this device support synchronous read or burst mode?
No. S29GL512T11DHB010 is an asynchronous parallel NOR flash. It supports only asynchronous read, page read (32-byte burst), and random access - no clock input or DDR interface. Burst capability is limited to internal 32-byte page reads, not external clock-synchronized transfers.
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is factory-locked and contains immutable device identity and security keys. SSR3 supports password-based read protection. SSR1 and SSR2 are user-lockable for storing calibration data or cryptographic keys with hardware-enforced write-once semantics.
Can the device operate reliably at 2.7 V across the full industrial temperature range?
Yes. The datasheet specifies full functionality-including 100 ns random access, 512-byte buffered programming, and ECC operation-at VCC = 2.7 V and temperatures from –40°C to +85°C. DC characteristics and timing margins are guaranteed across this range per Infineon's AC/DC test conditions in Rev. *M.
S29GL512T11DHB010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512T11DHB010 FAQ
1.How can I place an order for S29GL512T11DHB010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11DHB010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11DHB010 reliable?
The price and inventory of S29GL512T11DHB010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11DHB010 is usually 5 days.
3.What payment methods are accepted for S29GL512T11DHB010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11DHB010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11DHB010?
S29GL512T11DHB010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11DHB010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11DHB010?
For technical support, including S29GL512T11DHB010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11DHB010 requirements.
6.How does Aetrix verify that S29GL512T11DHB010 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11DHB010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11DHB010 meets industry standards.
7.What is the process for return or replacement of S29GL512T11DHB010?
All S29GL512T11DHB010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11DHB010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11DHB010 part is unused and in its original packaging.
Return procedure for S29GL512T11DHB010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T11DHB010 Tags
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