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Infineon Technologies S29GL512T11DHB013

Name: S29GL512T11DHB013
Brand: Infineon Technologies
SKU: S29GL512T11DHB013
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512T11DHB013

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512T11DHB013.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL512T11DHB013 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It serves as non-volatile code storage in boot ROM applications for microcontroller-based embedded systems.

For engineers reviewing the S29GL512T11DHB013 datasheet, S29GL512T11DHB013 pinout, S29GL512T11DHB013 application, or S29GL512T11DHB013 equivalent, key selection criteria include parallel ×16 data bus support, 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI compliance, and Versatile I/O enabling 1.65 V to VCC interface voltage flexibility.

Technical Context

This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both XIP-capable fast random reads and high-throughput buffered programming. Its embedded algorithm controller (EAC) manages autonomous program/erase operations, suspend/resume capability, and status reporting via Status Register, Data Polling, or RY/BY# pin.

The architecture includes dedicated address space overlays for Device ID/CFI, Status Register, SSR (OTP), ECC status, and sector protection control. Hardware ECC operates transparently during read, correcting single-bit errors without software intervention, while the 2048-byte OTP array provides secure configuration storage with factory-locked SSR0 and password-protected SSR3.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	512 Mb (64 MB) - sufficient for full firmware images and bootloader storage in resource-constrained embedded controllers
Interface type	Parallel ×16 data bus - enables high-bandwidth code fetch without serial protocol overhead
Random access time	100 ns at –40°C to +85°C - meets real-time boot latency requirements for industrial MCU applications
Write buffer size	512 bytes - reduces effective programming time by batching up to 256 words per operation
ECC capability	Internal hardware single-bit error correction - ensures data integrity without CPU intervention or software overhead
Endurance	100,000 program/erase cycles - supports field firmware updates over extended product lifetime
Data retention	20 years - guarantees long-term reliability of stored code and calibration data in unpowered conditions

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), standard JEDEC MO-141AC footprint, suitable for surface-mount assembly in space-constrained industrial PCBs.

Pin/Terminal	Circuit Role	Design Meaning
A0–A21	Address inputs	22-bit address bus supporting full 512 Mb addressing with byte/word boundary alignment
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; supports ×16 mode with DQ15/A-1 used as LSB address bit in ×8 mode
CE#	Chip enable	Active-low chip select; controls device power state and enables access timing (tCE = 100 ns max)
OE#	Output enable	Active-low read strobe; gates output drivers (tOE = 25 ns max) and enables data sampling
WE#	Write enable	Active-low write strobe; initiates internal program/erase algorithms when combined with valid command sequences
RY/BY#	Ready/Busy indicator	Open-drain output signaling active embedded operations; allows host to poll status without register reads
VCC	Core supply	Single 2.7–3.6 V supply powering logic and memory array; eliminates need for separate I/O rail
VIO	I/O supply	Independent 1.65–VCC input enabling mixed-voltage system interfacing (e.g., 1.8 V host with 3.3 V flash)

Key Features

Feature	Design Value
Versatile I/O voltage range	VIO supports 1.65 V to VCC - enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without level shifters
Hardware ECC engine	On-die single-bit error correction - maintains firmware integrity across temperature and aging without software overhead
2048-byte OTP array	Four lockable SSR regions (SSR0–SSR3) with factory-locked SSR0 and password-protected SSR3 - secures boot configuration and device identity
CFI-compliant interface	Standardized Common Flash Interface parameter table - simplifies driver development and enables auto-detection in U-Boot/Linux MTD stacks
Suspend/resume capability	Interruptible program/erase operations - allows high-priority read access during background writes, critical for real-time systems

Applications

Industrial PLC Firmware Storage

Automotive Instrument Cluster Boot ROM

Use Scenario: Storing firmware and configuration data in programmable logic controllers deployed in factory automation environments with wide ambient temperature swings.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable code execution and field-upgradable firmware storage.

Use Value: 100,000 erase cycles and 20-year data retention ensure reliable operation over 15+ year equipment lifetimes without memory degradation.

Use Scenario: Hosting boot code and display assets in automotive digital instrument clusters requiring AEC-Q100 grade 3 qualification.

IC Role / Device Role / Timing Role: Primary boot ROM accessed directly by MCU on power-up; supports fast 100 ns random reads for deterministic startup timing.

Use Value: Industrial Plus temperature rating (–40°C to +105°C) and hardware ECC meet automotive functional safety requirements for code integrity.

Medical Diagnostic Equipment BIOS

Network Router Boot Image Storage

Use Scenario: Storing BIOS and calibration tables in portable ultrasound and imaging devices subject to strict regulatory validation and long service intervals.

IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware repository with OTP-locked security registers and sector-level write protection.

Use Value: Four-lockable SSR regions and ASP allow granular protection of calibration data and regulatory-critical firmware sections.

Use Scenario: Holding bootloaders and OS kernels in enterprise-grade routers where firmware update reliability and concurrent read/write are essential.

IC Role / Device Role / Timing Role: High-bandwidth parallel flash enabling rapid kernel load and background firmware patching via 512-byte write buffer.

Use Value: 1.14 MBps buffer programming rate and suspend/resume capability minimize network downtime during updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S11TFI010	Same density and core voltage, but uses 64-ball LAE BGA (9 mm × 9 mm); lacks Versatile I/O (fixed VIO = VCC)	Preferred for space-constrained, high-density PCB layouts where BGA assembly is available	Select when board area is limited and thermal profile permits BGA reflow; avoid if 1.65–2.5 V host interfacing is required
MX29GL512FHI-90G	Macronix part with identical 512 Mb density, 90 ns access time, and CFI compliance; no integrated hardware ECC	Used where external ECC handling is acceptable and cost sensitivity outweighs built-in reliability features	Choose for cost-optimized designs with software-managed error correction; not suitable for safety-critical or long-life deployments

Compared with S29GL512S11TFI010 and MX29GL512FHI-90G, the S29GL512T11DHB013 uniquely combines Versatile I/O, on-die ECC, and TSOP packaging-enabling robust, mixed-voltage, drop-in boot memory replacement without redesigning signal integrity or error-handling logic.

Availability

S29GL512T11DHB013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot ROM, and medical diagnostic equipment BIOS requiring stable component supply across extended product lifecycles.

Supply support for S29GL512T11DHB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global manufacturing and R&D infrastructure.

The GL-T family targets high-reliability embedded systems needing XIP-capable parallel flash with enhanced data integrity, offering optimized balance of speed, endurance, and security for boot-critical applications.

FAQ

Is S29GL512T11DHB013 compatible with legacy S29GL512P devices?

No. The S29GL512T11DHB013 belongs to the newer GL-T generation with 45-nm MIRRORBIT™ process, faster 15 ns page access, Versatile I/O, and integrated hardware ECC. Legacy GL-P parts use older 65-nm technology, lack VIO flexibility and on-die ECC, and have different command sets-requiring firmware and timing adjustments for migration.

What is the function of the SSR0–SSR3 regions in the OTP array?

SSR0–SSR3 are four independent 512-byte sectors within the 2048-byte one-time-programmable array. SSR0 is factory-locked and stores permanent device identifiers. SSR1–SSR2 are user-lockable for calibration or configuration data. SSR3 supports password-based read protection, enabling secure storage of cryptographic keys or licensing information.

Does this device support synchronous burst reads?

No. The S29GL512T11DHB013 implements only asynchronous parallel interface protocols: standard read, page read (32-byte burst), and buffered programming. It does not support clocked burst modes like G-series or HyperFlash devices-timing is controlled solely by CE#, OE#, and WE# signal edges per JEDEC standards.

How is hardware ECC triggered and verified during operation?

Hardware ECC activates automatically on every read access. Single-bit errors in retrieved data are corrected in real time by on-die logic before output to DQ pins. The ECC status register (bit 15) indicates correction events, and uncorrectable multi-bit errors trigger status flag 0x80. No host intervention or command sequence is required for ECC operation.

S29GL512T11DHB013 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-T

Package/Case:: 64-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 64M x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL512T11DHB013 FAQ

1.How can I place an order for S29GL512T11DHB013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512T11DHB013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512T11DHB013 reliable?

The price and inventory of S29GL512T11DHB013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11DHB013 is usually 5 days.

3.What payment methods are accepted for S29GL512T11DHB013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11DHB013 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512T11DHB013?

S29GL512T11DHB013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512T11DHB013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512T11DHB013?

For technical support, including S29GL512T11DHB013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11DHB013 requirements.

6.How does Aetrix verify that S29GL512T11DHB013 is sourced from the original manufacturer or authorized distributors?

All S29GL512T11DHB013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11DHB013 meets industry standards.

7.What is the process for return or replacement of S29GL512T11DHB013?

All S29GL512T11DHB013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11DHB013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512T11DHB013 part is unused and in its original packaging.

Return procedure for S29GL512T11DHB013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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