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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512T11DHB020

Name: S29GL512T11DHB020
Brand: Infineon Technologies
SKU: S29GL512T11DHB020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512T11DHB020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512T11DHB020.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

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Product details

Overview

S29GL512T11DHB020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal hardware ECC for single-bit error correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.

For engineers reviewing the S29GL512T11DHB020 datasheet, S29GL512T11DHB020 pinout, S29GL512T11DHB020 application, or S29GL512T11DHB020 equivalent, key selection criteria include verified 100,000 program/erase cycles, 20-year data retention, OTP array with four lockable SSR regions, CFI compliance, and support for suspend/resume during embedded operations.

Technical Context

This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages all program and erase operations autonomously, including automatic ECC generation and verification during write cycles.

The architecture includes dedicated address space overlays (ASOs) for Device ID/CFI, Status Register, Data Polling, SSR (OTP), and ECC status - enabling standardized software drivers and robust firmware update workflows across embedded platforms.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	512 Mb (64 MB) - sufficient for full boot image + firmware partition in resource-constrained industrial microcontrollers.
Supply Voltage	2.7 V to 3.6 V - single VCC operation simplifies power design and eliminates need for separate I/O voltage rails.
Random Access Time	100 ns at –40°C to +85°C - enables direct XIP execution without performance penalty in real-time control loops.
Page Access Time	15 ns - accelerates sequential instruction fetch during boot or firmware load sequences.
Write Buffer Size	512 bytes - reduces effective programming time by up to 4× vs. single-word writes in firmware update routines.
ECC Support	Internal hardware single-bit error correction - ensures data integrity without CPU overhead or external logic.
Endurance	100,000 program/erase cycles - validated for frequent field firmware updates over product lifetime.
Data Retention	20 years - meets long-term reliability requirements for infrastructure and automotive ECUs.

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AB footprint. Compatible with automated PCB assembly and legacy socket-based programming fixtures.

Pin/Terminal	Circuit Role	Design Meaning
A0–A21	Address Inputs	22-bit address bus supporting full 512 Mb linear addressing (byte/word mode selectable via BYTE#).
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; operates as 8-bit in byte mode when BYTE# = LOW.
CE#	Chip Enable	Active-low chip select; controls device power state and enables read/write access only when asserted.
OE#	Output Enable	Active-low control for data bus output drivers; allows shared bus arbitration without contention.
WE#	Write Enable	Active-low signal initiating internal program/erase algorithms upon command sequence recognition.
RY/BY#	Ready/Busy Output	Open-drain status indicator - LOW during embedded operations, HIGH when ready for next command.
RESET#	Hardware Reset	Active-low input forcing device into reset state; clears internal state machines and aborts ongoing operations.
VCC	Core Supply	Primary 2.7–3.6 V supply powering logic, memory array, and ECC engine - no auxiliary voltage required.
VIO	I/O Supply	Separate 1.65–VCC I/O rail enabling mixed-voltage system interfacing (e.g., 1.8 V MCU with 3.3 V flash).
BYTE#	Bus Width Select	Configures DQ0–DQ15 as 16-bit word or DQ0–DQ7 as 8-bit byte interface - critical for legacy 8-bit controller compatibility.

Key Features

Feature	Design Value
Versatile I/O (VIO)	Independent 1.65 V to VCC I/O supply allows seamless integration with 1.8 V, 2.5 V, or 3.3 V host processors without level shifters.
512-byte Programming Buffer	Enables burst programming of up to 512 bytes per command, reducing firmware update time by >75% compared to single-word writes.
Hardware ECC Engine	On-the-fly single-bit error correction with no software intervention - maintains data integrity under radiation or aging effects.
Advanced Sector Protection (ASP)	Volatile and non-volatile locking per 128-KB sector prevents accidental overwrite of bootloader or calibration data in field-deployed units.
OTP Array with SSR Locking	2048-byte one-time-programmable region with four password-protected lockable sectors (SSR0–SSR3), where SSR0 is factory-locked for secure key storage.

Applications

Industrial PLC Boot Memory

Automotive ECU Firmware Storage

Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers deployed in factory automation systems.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency to meet deterministic scan cycle timing.

Use Value: Eliminates external SRAM copy step during boot, reducing BOM count and startup time while ensuring 20-year firmware persistence.

Use Scenario: Holding calibrated sensor parameters and safety-critical firmware in AEC-Q100 Grade 2 engine control units operating at 105°C ambient.

IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash delivering guaranteed 100,000-cycle endurance and ECC-protected reads under thermal stress.

Use Value: Enables in-field reprogramming of emission control algorithms without compromising ASIL-B functional safety compliance.

Medical Imaging System BIOS

Telecom Base Station Configuration

Use Scenario: Hosting diagnostic self-test routines and FPGA configuration bitstreams in portable ultrasound devices requiring high reliability.

IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware store with OTP-locked calibration constants and sector-protected boot code.

Use Value: Prevents unauthorized modification of FDA-regulated imaging parameters through hardware-enforced SSR3 password protection.

Use Scenario: Storing FPGA configuration images and protocol stack binaries in outdoor 5G base station remote radio units exposed to wide temperature swings.

IC Role / Device Role / Timing Role: High-density, extended-temperature (–40°C to +125°C) flash supporting hot-swap firmware updates via JTAG or PCIe interface.

Use Value: Maintains 120 ns access time and 245 KBps sector erase rate across full industrial temperature range for zero-downtime upgrades.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S11TFI020	Same density and core voltage, but uses 64-ball LAE BGA (9 mm × 9 mm); lacks VIO flexibility (VIO = VCC only).	Preferred for space-constrained designs where board area is prioritized over mixed-voltage interfacing.	Select when footprint reduction outweighs need for independent I/O rail control.
MX29GL512FHI-11G	Macronix part with identical 512 Mb density, 100 ns tACC, and CFI compliance; no OTP array or SSR locking capability.	Suitable for cost-sensitive consumer applications where secure key storage is not required.	Choose when hardware-based security features (SSR, ECC) are unnecessary and total BOM cost is primary driver.

Compared with S29GL512S11TFI020 and MX29GL512FHI-11G, the S29GL512T11DHB020 uniquely combines VIO flexibility, factory-locked OTP, and hardware ECC - making it the only option qualified for safety-critical firmware storage with mixed-voltage host interfaces.

Availability

S29GL512T11DHB020 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ECUs, medical imaging systems, and telecom base stations requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL512T11DHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D centers and ISO/TS 16949-certified manufacturing.

The GL-T family targets high-reliability embedded systems needing fast XIP execution and robust firmware storage - designed specifically for industrial automation, automotive, and medical applications demanding AEC-Q100 qualification and 20-year data retention.

FAQ

Is S29GL512T11DHB020 compatible with legacy 8-bit microcontrollers?

Yes. The BYTE# pin configures the device for 8-bit (DQ0–DQ7 only) or 16-bit operation. When BYTE# is held LOW, it presents an 8-bit data bus aligned to standard 8-bit address/data multiplexing schemes used in older MCUs like Intel 8051 derivatives and ARM7-based controllers.

Does this device support hardware reset recovery after power loss during programming?

Yes. The RESET# pin forces immediate termination of any active program or erase operation and returns the device to a known idle state. Internal state machines are cleared, and the RY/BY# pin transitions HIGH within 100 μs, enabling safe resumption of operations after brown-out recovery.

What is the purpose of the SSR0–SSR3 regions in the OTP array?

SSR0–SSR3 are four independently lockable 512-byte subregions within the 2048-byte OTP array. SSR0 is factory-locked and reserved for immutable keys; SSR3 supports password-based read protection. These enable hierarchical security for bootloader signing keys, calibration coefficients, and device-specific identifiers.

Can S29GL512T11DHB020 be used in systems requiring AEC-Q100 Grade 2 qualification?

No. This specific variant (S29GL512T11DHB020) is rated for Industrial grade (–40°C to +85°C). For AEC-Q100 Grade 2 (–40°C to +105°C), the correct orderable part is S29GL512T11DHB022, which shares identical functionality but undergoes additional automotive qualification testing and traceability controls.

S29GL512T11DHB020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-T

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 64M x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL512T11DHB020 FAQ

1.How can I place an order for S29GL512T11DHB020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512T11DHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512T11DHB020 reliable?

The price and inventory of S29GL512T11DHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11DHB020 is usually 5 days.

3.What payment methods are accepted for S29GL512T11DHB020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11DHB020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512T11DHB020?

S29GL512T11DHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512T11DHB020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512T11DHB020?

For technical support, including S29GL512T11DHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11DHB020 requirements.

6.How does Aetrix verify that S29GL512T11DHB020 is sourced from the original manufacturer or authorized distributors?

All S29GL512T11DHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11DHB020 meets industry standards.

7.What is the process for return or replacement of S29GL512T11DHB020?

All S29GL512T11DHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11DHB020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512T11DHB020 part is unused and in its original packaging.

Return procedure for S29GL512T11DHB020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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