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Infineon Technologies S29GL512T11DHB023
- Part No.:
- S29GL512T11DHB023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T11DHB023.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,379
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Product details
Overview
S29GL512T11DHB023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal single-bit ECC, uniform 128-KB sectors, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile firmware retention.
For engineers reviewing the S29GL512T11DHB023 datasheet, S29GL512T11DHB023 pinout, S29GL512T11DHB023 application, or S29GL512T11DHB023 equivalent, key selection factors include its 56-pin TSOP package, Versatile I/O (1.65 V to VCC), sector erase granularity, OTP array with four lockable regions, and AEC-Q100 grade 3 compliance option.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both ×8 and ×16 data bus configurations. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC correction without host intervention.
The memory array is organized into uniform 128-KB sectors, each independently erasable, and includes a dedicated 2048-byte one-time programmable (OTP) array segmented into four lockable SSR regions - SSR0 factory-locked, SSR3 password-protected - enabling secure boot and configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - sufficient for full firmware images and parameter tables in industrial HMI and gateway applications |
| Supply Voltage | 2.7 V to 3.6 V - single VCC rail simplifies power design versus dual-supply NOR devices |
| Random Access Time | 100 ns at –40°C to +85°C - enables direct XIP execution of real-time control code without external cache |
| Page Access Time | 15 ns - accelerates sequential instruction fetch during boot or diagnostic routines |
| Write Buffer Size | 512 bytes - reduces effective programming time by up to 10× vs. single-word writes |
| ECC Support | Internal hardware single-bit error correction - eliminates need for software ECC overhead in safety-critical firmware |
| Data Retention | 20 years - ensures long-term reliability in unattended infrastructure equipment |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over product lifetime |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 20.0 mm × 10.16 mm, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 512 Mb decode; A0 selects byte/word mode when ×16 configured |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 or ×16 mode per configuration pins |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE = 100 ns max defines minimum chip select assertion window |
| OE# | Output Enable | Active-low control for data output gating; tOE = 25 ns max sets read timing margin |
| WE# | Write Enable | Active-low signal initiating write/program operations; synchronized with address and data setup |
| RY/BY# | Ready/Busy Output | Open-drain status indicator - low during embedded operations, high when ready for next command |
| VIO | I/O Supply | Separate 1.65 V to VCC input enabling interface voltage translation with mixed-voltage SoCs |
| RESET# | Hardware Reset | Active-low asynchronous reset clearing internal state and aborting ongoing operations |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Independent 1.65 V to VCC I/O supply allows seamless interfacing with 1.8 V, 2.5 V, or 3.3 V host processors |
| 512-byte Programming Buffer | Enables burst programming of up to 512 bytes per command, achieving 1.14 MBps effective write rate |
| Hardware ECC | On-the-fly single-bit error correction reduces firmware validation burden and improves field reliability |
| Four-lock OTP Array | 2048-byte one-time programmable region with SSR0–SSR3 lock control supports secure boot keys and calibration data |
| ASP Sector Protection | Volatile and non-volatile protection modes per sector prevent accidental erase/write during power transitions or debug sessions |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency to meet deterministic scan cycle timing. Use Value: Uniform 128-KB sector erase enables modular firmware updates without full reflash; 20-year retention ensures operation across 15+ year plant lifecycles. | Use Scenario: Holding certified boot code and sensor calibration data in automotive surround-view camera ECUs. IC Role / Device Role / Timing Role: AEC-Q100 grade 3 compliant NOR flash serving as primary boot source with hardware ECC for ASIL-B functional safety compliance. Use Value: SSR3 password-protected OTP region stores cryptographic keys; ASP prevents runtime corruption during ECU reset sequences. |
| Medical Imaging System BIOS | Energy Meter Secure Configuration |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound systems requiring rapid cold-start capability. IC Role / Device Role / Timing Role: High-speed parallel interface delivers 15 ns page access for immediate instruction fetch post-power-on, reducing boot time by >30% vs. serial NOR. Use Value: 56-pin TSOP package enables compact PCB layout; 100,000-cycle endurance supports field-upgradable diagnostic firmware. | Use Scenario: Storing tariff tables, metering algorithms, and tamper logs in smart electricity meters deployed in harsh outdoor substations. IC Role / Device Role / Timing Role: Industrial-grade (–40°C to +85°C) flash with standby current <100 μA minimizing battery drain during grid outage monitoring. Use Value: Separate OTP array secures regulatory certification parameters; CFI table enables auto-detection by metering MCU bootloader. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFI020 | Same density and architecture but uses 64-ball LAE BGA (9 mm × 9 mm); no TSOP option | Targeted at space-constrained automotive modules where board area is prioritized over serviceability | Select when BGA mounting and thermal performance outweigh manual rework requirements |
| MX29GL512FHI-11G | Micron part with identical 512 Mb density, 100 ns tACC, but lacks hardware ECC and OTP array | Suitable for cost-sensitive consumer gateways where firmware integrity is managed in software | Choose only if external ECC implementation and absence of secure OTP are acceptable |
Compared with S29GL512S11TFI020, this TSOP variant offers easier prototyping and field replacement; versus MX29GL512FHI-11G, it adds hardware ECC and OTP security essential for industrial and automotive firmware integrity.
Availability
S29GL512T11DHB023 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging BIOS, and smart energy metering systems requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T11DHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing fast XIP-capable flash with integrated data integrity and security features - designed specifically for industrial control, automotive, and medical applications demanding long-term supply stability.
FAQ
What is the maximum operating temperature range supported by S29GL512T11DHB023?
This part is rated for industrial temperature range: –40°C to +85°C. It is not the extended (–40°C to +125°C) or automotive grade 2 (–40°C to +105°C) variant - those use different suffixes (e.g., 'H' or 'I') in the ordering code. The 'DHB' suffix confirms industrial grade with TSOP packaging.
Does S29GL512T11DHB023 support both ×8 and ×16 data bus widths?
Yes, it supports configurable ×8 or ×16 operation via A0 pin state at power-up: A0 low enables ×16 mode (DQ0–DQ15 active), A0 high enables ×8 mode (DQ0–DQ7 active). This flexibility allows compatibility with legacy 8-bit microcontrollers and modern 16-bit bus interfaces without redesign.
How does the Versatile I/O (VIO) feature function in practice?
VIO allows independent 1.65 V to VCC supply on the I/O pins, decoupled from core VCC. When interfacing with a 1.8 V SoC, VIO is set to 1.8 V while VCC remains at 3.3 V - enabling level-shift-free communication and eliminating external translators in mixed-voltage designs.
Can the OTP array be reprogrammed after initial programming?
No - the 2048-byte OTP array is physically one-time programmable. Once a bit is programmed (set to '0'), it cannot be reset to '1'. SSR0 is factory-locked and permanently protected; SSR3 supports password-based read protection but no write re-enabling. Lock bits are irreversible.
S29GL512T11DHB023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512T11DHB023 FAQ
1.How can I place an order for S29GL512T11DHB023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11DHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11DHB023 reliable?
The price and inventory of S29GL512T11DHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11DHB023 is usually 5 days.
3.What payment methods are accepted for S29GL512T11DHB023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11DHB023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11DHB023?
S29GL512T11DHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11DHB023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11DHB023?
For technical support, including S29GL512T11DHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11DHB023 requirements.
6.How does Aetrix verify that S29GL512T11DHB023 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11DHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11DHB023 meets industry standards.
7.What is the process for return or replacement of S29GL512T11DHB023?
All S29GL512T11DHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11DHB023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11DHB023 part is unused and in its original packaging.
Return procedure for S29GL512T11DHB023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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