My Inquiry
My Account
Infineon Technologies S29GL512T11DHIV20
- Part No.:
- S29GL512T11DHIV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T11DHIV20.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,177
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL512T11DHIV20 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL512T11DHIV20 datasheet, S29GL512T11DHIV20 pinout, S29GL512T11DHIV20 application, or S29GL512T11DHIV20 equivalent, key selection factors include verified 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI-compliant interface, and support for suspend/resume during embedded operations - critical for deterministic firmware update and fail-safe boot systems.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages all program/erase operations, including automatic ECC generation and correction, status monitoring via Status Register or Data Polling, and RY/BY# signaling.
The architecture includes dedicated address space overlays (ASOs) for Device ID/CFI, Status Register, ECC status, and Sector Protection Registers (SSR0–SSR3), enabling secure, field-upgradable firmware storage with hardware-enforced protection granularity down to 2048-byte OTP sectors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full boot image + firmware + parameter storage in resource-constrained embedded hosts |
| Access Time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution without external cache penalty |
| Page Access (tPACC) | 15 ns - accelerates sequential instruction fetch during boot initialization |
| Write Buffer Size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC Support | Internal hardware single-bit error correction - eliminates need for software ECC layer in safety-critical applications |
| Endurance | 100,000 program/erase cycles - validated for frequent field firmware updates over product lifetime |
| Data Retention | 20 years at +85°C - ensures long-term reliability in unattended industrial deployments |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AC footprint, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 512 Mb linear addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; configurable as ×8 or ×16 mode via BYTE# signal |
| CE# | Chip Enable | Active-low chip select; controls device power state and enables read/write access timing |
| OE# | Output Enable | Active-low control for data bus output drivers; used during read operations only |
| WE# | Write Enable | Active-low control for write/program/erase command latching and data capture |
| RY/BY# | Ready/Busy Output | Open-drain status indicator - low during embedded operations, high when ready |
| VCC | Core Supply | 2.7 V to 3.6 V single supply for read, program, and erase - simplifies power design |
| VIO | I/O Supply | 1.65 V to VCC versatile I/O voltage - supports mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Independent 1.65 V to VCC I/O supply allows seamless integration with 1.8 V, 2.5 V, or 3.3 V host processors |
| Hardware ECC | On-die single-bit error correction eliminates software overhead and improves system-level functional safety compliance |
| OTP Array with SSR Locking | 2048-byte one-time-programmable region split into four lockable sectors (SSR0–SSR3), enabling secure key storage and firmware signature validation |
| Suspend/Resume | Interruptible program and erase operations allow real-time response to host priority events without data corruption |
| CFI Compliance | Standard Common Flash Interface parameter table enables automatic driver detection and configuration in bootloader environments |
Applications
| Industrial PLC Boot Memory | Automotive ADAS Firmware Storage |
|---|---|
Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic 100 ns access latency. Use Value: Enables cold-start execution within <500 ms while maintaining 20-year data retention under continuous 85°C ambient operation. | Use Scenario: Holding calibrated sensor fusion firmware and safety monitor code in automotive camera ECU modules certified to AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Secure, high-endurance firmware storage with hardware ECC and OTP-based cryptographic key isolation. Use Value: Meets ISO 26262 ASIL-B requirements through verified 100,000-cycle endurance and on-die error correction without software intervention. |
| Medical Imaging System Configuration | Energy Meter Firmware Vault |
Use Scenario: Retaining calibration tables, user preferences, and regulatory audit logs in portable ultrasound devices requiring long-term field reliability. IC Role / Device Role / Timing Role: Non-volatile parameter and configuration storage with sector-level protection against accidental overwrite. Use Value: Prevents unauthorized modification via ASP and SSR locking, ensuring FDA 21 CFR Part 11 compliance for electronic records. | Use Scenario: Hosting firmware and tariff tables in smart electricity meters deployed in utility substations with wide temperature swings (–40°C to +85°C). IC Role / Device Role / Timing Role: High-reliability code and data storage with extended temperature grade and 125°C option support. Use Value: Guarantees 20-year data integrity even after 10+ years of repeated firmware upgrades in harsh outdoor environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11DHIV10 | Same density and package, but uses older 65-nm process; slower tACC (110 ns) and no hardware ECC | Lacks on-die ECC and OTP locking - requires external error handling and software-based security | Select only if legacy compatibility or cost sensitivity outweighs ECC and security needs |
| MX29GL512FHI-11G | Micron equivalent with identical 512 Mb density, 100 ns tACC, and CFI support; no OTP array or SSR locking | Supports suspend/resume and sector protection but lacks factory-lockable OTP for keys or signatures | Preferred for cost-driven designs where cryptographic key isolation is handled externally |
Compared with S29GL512S11DHIV10 and MX29GL512FHI-11G, the S29GL512T11DHIV20 uniquely delivers integrated hardware ECC, four-region OTP locking with factory-secured SSR0, and 45-nm process efficiency - making it the only choice for safety-certified or security-hardened embedded boot applications.
Availability
S29GL512T11DHIV20 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging systems, and smart energy meters requiring stable component supply across extended lifecycles.
Supply support for S29GL512T11DHIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, connectivity, and security solutions for industrial, automotive, and IoT markets.
The GL-T family targets high-reliability embedded systems needing fast XIP execution, robust firmware storage, and hardware-enforced security - bridging performance and safety requirements in mission-critical applications.
FAQ
What temperature grades are supported by S29GL512T11DHIV20?
The S29GL512T11DHIV20 is specified for the Industrial grade (–40°C to +85°C), with optional Extended (–40°C to +125°C) and Automotive AEC-Q100 Grade 2 (–40°C to +105°C) variants. This specific part number corresponds to the Industrial grade, confirmed by the 'I' in the suffix and datasheet Section 1.1.
Does S29GL512T11DHIV20 support both ×8 and ×16 data bus modes?
Yes, it supports configurable ×8 or ×16 operation via the BYTE# pin. When BYTE# is low, the device operates in ×16 mode with DQ0–DQ15 active; when high, it operates in ×8 mode using DQ0–DQ7 only. This is defined in Section 8.3 of the datasheet and verified in the pin description table.
How is the 2048-byte OTP array protected and accessed?
The OTP array is divided into four 512-byte sectors (SSR0–SSR3), each independently lockable via dedicated commands. SSR0 is factory-locked and permanently read-only; SSR3 supports password-protected read access. Protection is enforced in hardware and persists across power cycles, as detailed in Sections 2.5 and 3.3 of the datasheet.
Can S29GL512T11DHIV20 be used in systems requiring ISO 26262 compliance?
Yes - its hardware ECC, 100,000-cycle endurance, 20-year data retention, and AEC-Q100 Grade 2 qualification (available in alternate variants) provide foundational elements for ASIL-B compliance. However, full certification requires system-level integration, fault injection testing, and safety analysis per ISO 26262 Part 5.
S29GL512T11DHIV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512T11DHIV20 FAQ
1.How can I place an order for S29GL512T11DHIV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11DHIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11DHIV20 reliable?
The price and inventory of S29GL512T11DHIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11DHIV20 is usually 5 days.
3.What payment methods are accepted for S29GL512T11DHIV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11DHIV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11DHIV20?
S29GL512T11DHIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11DHIV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11DHIV20?
For technical support, including S29GL512T11DHIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11DHIV20 requirements.
6.How does Aetrix verify that S29GL512T11DHIV20 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11DHIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11DHIV20 meets industry standards.
7.What is the process for return or replacement of S29GL512T11DHIV20?
All S29GL512T11DHIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11DHIV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11DHIV20 part is unused and in its original packaging.
Return procedure for S29GL512T11DHIV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T11DHIV20 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
