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Infineon Technologies S29GL512T11DHIV23
- Part No.:
- S29GL512T11DHIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T11DHIV23.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,652
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Product details
Overview
S29GL512T11DHIV23 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal single-bit ECC, uniform 128-KB sectors, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL512T11DHIV23 datasheet, S29GL512T11DHIV23 pinout, S29GL512T11DHIV23 application, or S29GL512T11DHIV23 equivalent, key selection factors include verified 100,000 program/erase cycles, 20-year data retention, sector-level erase control, OTP array with four lockable SSR regions, and support for both ×8 and ×16 data bus configurations.
Technical Context
This device implements an asynchronous parallel interface with CE#, OE#, and WE# control signals and supports byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC correction without host intervention.
The flash array is organized into uniform 128-KB sectors, each independently erasable, and includes a dedicated 2048-byte one-time programmable (OTP) array with four lockable sectors (SSR0–SSR3), where SSR0 is factory-locked and SSR3 supports password-based read protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full firmware images and configuration tables in industrial HMI and gateway applications |
| Random access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution of real-time control code without external cache |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot or firmware update |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per operation |
| ECC capability | Internal hardware single-bit error correction - maintains data integrity without host software overhead |
| Endurance & retention | 100,000 program/erase cycles / 20-year data retention - meets long-lifecycle requirements for deployed industrial equipment |
| Operating voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - supports mixed-voltage system interfacing with 1.8 V or 3.3 V logic |
| Temperature grade | Industrial (–40°C to +85°C) - qualified for use in uncontrolled ambient environments such as factory-floor PLCs |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb address space; A0 selects byte/word mode when configured for ×8/×16 operation |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 mode (DQ0–DQ7 only) or ×16 mode (full DQ0–DQ15) depending on BYTE# state |
| CE# | Chip enable | Active-low chip select; controls device power state and enables read/write operations when asserted |
| OE# | Output enable | Active-low signal enabling output drivers during read; decouples read timing from CE# deassertion |
| WE# | Write enable | Active-low control for write/program/erase command latching; must be synchronized with address/data setup/hold |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation (low) or completion/readiness (high) |
| RESET# | Hardware reset | Active-low input forcing device into reset state; clears status register and aborts ongoing operations |
| BYTE# | Bus width select | Configures data bus width: high = ×16 mode, low = ×8 mode; determines DQ0–DQ7 vs. DQ0–DQ15 usage |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - eliminates level-shifting components when interfacing with 1.8 V microcontrollers |
| Asynchronous 32-byte page read | Enables burst-like sequential reads without address incrementing - improves throughput for firmware image streaming |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per 128-KB sector - prevents accidental overwrite of bootloader or calibration data |
| Common Flash Interface (CFI) | Standardized parameter table accessible via read commands - enables OS/driver auto-detection and portable flash management |
| Suspend/Resume for program/erase | Allows host to pause long-duration operations (e.g., sector erase) to service higher-priority interrupts - critical for real-time systems |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot code and runtime firmware for programmable logic controllers deployed in factory automation systems. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency to meet deterministic scan-cycle timing. Use Value: Eliminates need for external SRAM caching; 20-year data retention ensures firmware persistence over equipment lifetime without maintenance. | Use Scenario: Holding safety-critical boot firmware for radar processing units in automotive ADAS ECUs. IC Role / Device Role / Timing Role: AEC-Q100 grade 3-compliant parallel flash serving as primary boot source with ECC-protected instruction fetch path. Use Value: Internal single-bit ECC corrects bit flips induced by radiation or aging, maintaining functional safety integrity without host intervention. |
| Medical Imaging System Configuration | Telecom Base Station Upgrade Storage |
Use Scenario: Storing calibrated sensor profiles and user interface assets in portable ultrasound devices. IC Role / Device Role / Timing Role: High-reliability configuration store with OTP-protected calibration data in SSR0–SSR3 regions. Use Value: Factory-locked SSR0 preserves factory calibration; password-protected SSR3 allows secure field updates without exposing sensitive parameters. | Use Scenario: Hosting field-upgradable firmware images for 4G/5G baseband processors in remote telecom cabinets. IC Role / Device Role / Timing Role: High-endurance flash supporting frequent over-the-air (OTA) updates with 100,000 erase cycles. Use Value: Sector erase granularity enables partial reprogramming; 512-byte write buffer cuts OTA update time by >40% versus byte-wise programming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11DHIV10 | Same density and package but uses older 65-nm process; 110 ns tACC, no OTP array | Lacks SSR-based security features and has lower endurance (10,000 cycles) | Use only if cost sensitivity outweighs security and longevity requirements |
| MX29GL512FHI-11G | Micron equivalent; same 512 Mb, 100 ns tACC, but no internal ECC or OTP array | Requires external ECC handling and lacks hardware-based sector locking | Select when leveraging existing Micron qualification or supply chain alignment |
Compared with S29GL512S11DHIV10 and MX29GL512FHI-11G, the S29GL512T11DHIV23 delivers superior reliability through integrated ECC, longer endurance, and hardware-enforced OTP security-critical for safety- or mission-critical firmware storage where data integrity cannot be compromised.
Availability
S29GL512T11DHIV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T11DHIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems requiring fast XIP execution, robust data retention, and hardware-assisted security-designed specifically for industrial control, automotive, and medical applications demanding AEC-Q100 or extended temperature compliance.
FAQ
What is the function of the BYTE# pin on S29GL512T11DHIV23?
The BYTE# pin configures the device's data bus width: when pulled high, it enables ×16 operation using DQ0–DQ15; when pulled low, it enables ×8 operation using DQ0–DQ7 only. This pin must be held static during operation and determines how the host processor maps addresses and transfers data-no dynamic switching is supported during active read/write cycles.
Does S29GL512T11DHIV23 support simultaneous read and program operations?
No, S29GL512T11DHIV23 does not support true concurrent read and program. However, it supports suspend/resume functionality: an ongoing program or erase operation can be paused via the Suspend command, allowing a short read sequence (e.g., status polling or interrupt servicing), then resumed with no data loss or timing penalty.
How is the OTP array structured and protected in S29GL512T11DHIV23?
The OTP array is 2048 bytes, divided into four 512-byte lockable sectors (SSR0–SSR3). SSR0 is permanently locked at factory; SSR1 and SSR2 support volatile/non-volatile locking; SSR3 adds password-based read protection. Locking is performed via specific CFI command sequences and persists across power cycles unless explicitly unlocked using the correct password for SSR3.
Can S29GL512T11DHIV23 operate with VIO = 1.8 V while VCC = 3.3 V?
Yes, S29GL512T11DHIV23 supports versatile I/O: VIO may be set independently from VCC within 1.65 V to VCC. With VCC = 3.3 V, VIO = 1.8 V is valid and enables direct interfacing with 1.8 V logic families without level shifters-provided all timing specifications (e.g., tVX, tRH) are met per the datasheet's Versatile I/O AC characteristics table.
S29GL512T11DHIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512T11DHIV23 FAQ
1.How can I place an order for S29GL512T11DHIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11DHIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11DHIV23 reliable?
The price and inventory of S29GL512T11DHIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11DHIV23 is usually 5 days.
3.What payment methods are accepted for S29GL512T11DHIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11DHIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11DHIV23?
S29GL512T11DHIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11DHIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11DHIV23?
For technical support, including S29GL512T11DHIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11DHIV23 requirements.
6.How does Aetrix verify that S29GL512T11DHIV23 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11DHIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11DHIV23 meets industry standards.
7.What is the process for return or replacement of S29GL512T11DHIV23?
All S29GL512T11DHIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11DHIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11DHIV23 part is unused and in its original packaging.
Return procedure for S29GL512T11DHIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T11DHIV23 Tags
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STMicroelectronics
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