Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512T11DHV010

Name: S29GL512T11DHV010
Brand: Infineon Technologies
SKU: S29GL512T11DHV010
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29GL512T11DHV010

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 64-LBGA

Datasheet:: S29GL512T11DHV010.pdf

Description:: IC FLASH 512MBIT PARALLEL 64FBGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:4,644

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29GL512T11DHV010 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It integrates hardware ECC for single-bit error correction, supports 128-KB uniform sector erase, and includes a 512-byte programming buffer for accelerated write throughput. It is deployed in industrial embedded systems requiring reliable code storage and XIP execution.

For engineers reviewing the S29GL512T11DHV010 datasheet, S29GL512T11DHV010 pinout, S29GL512T11DHV010 application, or S29GL512T11DHV010 equivalent, key selection criteria include its 128-KB sector architecture, Versatile I/O (1.65 V–V_CC), OTP array with four lockable SSR regions, and AEC-Q100 Grade 2 qualification for automotive control modules.

Technical Context

This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC operations without host intervention.

The flash array is organized into uniform 128-KB sectors, each independently erasable, and features status monitoring via Status Register, Data Polling, and RY/BY# pin. The 2048-byte OTP array includes factory-locked SSR0 and password-protected SSR3 for secure boot code storage.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	512 Mb (64 MB) - sufficient for full firmware images and parameter tables in industrial controllers
Random Access Time	100 ns at –40°C to +85°C - enables real-time XIP execution in microcontroller-based systems
Page Access Time	15 ns - accelerates sequential instruction fetch during burst reads
Programming Buffer	512 bytes - reduces effective programming time by batching up to 256 words per operation
ECC Support	Internal hardware single-bit error correction - ensures data integrity without software overhead
Endurance & Retention	100,000 program/erase cycles / 20-year data retention - meets long-life requirements in unattended equipment
Operating Voltage	V_CC: 2.7 V–3.6 V; V_IO: 1.65 V–V_CC - supports mixed-voltage system interfacing with 1.8 V or 3.3 V logic
Temperature Grade	AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood automotive ECUs and industrial motor drives

Pinout & Package

Package: 56-ball VBU fortified BGA (9 mm × 7 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.

Pin/Terminal	Circuit Role	Design Meaning
A0–A21	Address Inputs	22-bit address bus supporting full 512 Mb addressing space with byte/word alignment
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; configurable as ×8 or ×16 mode via BYTE# pin
CE#	Chip Enable	Active-low enable controlling device selection; t_CE ≤ 100 ns defines maximum chip select delay
OE#	Output Enable	Active-low control for read data output; t_OE ≤ 25 ns ensures fast data valid window
WE#	Write Enable	Active-low signal initiating internal program/erase algorithms when combined with command sequences
RY/BY#	Ready/Busy Output	Open-drain status indicator - low during embedded operations, high when ready for next command
RESET#	Hardware Reset	Asynchronous active-low input forcing device into reset state; required for power-on initialization
BYTE#	Bus Width Select	Configures data bus as ×8 (BYTE# = low) or ×16 (BYTE# = high); determines DQ0–DQ7 vs. DQ0–DQ15 usage

Key Features

Feature	Design Value
Versatile I/O Interface	V_IO range 1.65 V–V_CC allows direct connection to 1.8 V FPGA I/O banks or 3.3 V MCU buses without level shifters
512-byte Programming Buffer	Enables 1.14 MBps effective write speed - cuts firmware update time by >70% vs. single-word programming
Hardware ECC Engine	Single-bit correction implemented in silicon - eliminates need for external error-handling firmware or redundant storage
OTP Array with SSR Locking	2048-byte one-time-programmable region with four independently lockable sectors (SSR0–SSR3), including factory-locked SSR0 for immutable boot code
Advanced Sector Protection	Volatile and non-volatile locking per 128-KB sector - prevents accidental overwrite during field firmware updates or debug sessions

Applications

Automotive Powertrain Control

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated engine maps and diagnostic routines in ECU modules operating under hood temperature extremes.

IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability and AEC-Q100 Grade 2 qualification.

Use Value: 100,000-cycle endurance and 20-year retention ensure firmware integrity over vehicle lifetime without refresh.

Use Scenario: Holding ladder logic programs and I/O configuration data in programmable logic controllers deployed in factory automation lines.

IC Role / Device Role / Timing Role: Parallel NOR flash providing deterministic read latency for real-time scan cycle execution.

Use Value: 100 ns random access and 15 ns page access support sub-millisecond response in safety-critical motion control loops.

Medical Imaging System Boot ROM

Avionics Display Unit Code Storage

Use Scenario: Hosting boot firmware and calibration constants for MRI and CT scanner subsystems requiring traceable data integrity.

IC Role / Device Role / Timing Role: Secure, ECC-protected code storage with OTP-locked bootloader section (SSR0).

Use Value: Hardware ECC and factory-locked SSR0 prevent unauthorized modification and silent data corruption in regulated environments.

Use Scenario: Storing display driver firmware and font assets in DO-178C-certifiable cockpit display units.

IC Role / Device Role / Timing Role: High-reliability parallel flash with extended temperature support (–40°C to +105°C) and sector-level protection.

Use Value: Uniform 128-KB sector erase enables atomic firmware updates without disrupting active display rendering.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S11DHV010	Same density and package, but uses older 65-nm process; 110 ns random access (vs. 100 ns); no Versatile I/O (V_IO fixed at V_CC)	Lacks mixed-voltage interface support; unsuitable for 1.8 V host interfaces	Select only if cost sensitivity outweighs performance and voltage flexibility requirements
MX29GL512FHI-11G	512 Mb parallel NOR, 110 ns access, 3.0 V core, but no integrated ECC or OTP array; requires external error handling	No hardware ECC or secure boot region - increases firmware validation burden in safety-critical designs	Prefer only for legacy systems where ECC is managed in software and security is not mandated

Compared with S29GL512S11DHV010 and MX29GL512FHI-11G, the S29GL512T11DHV010 delivers superior reliability through on-die ECC, broader voltage interoperability via Versatile I/O, and secure boot capability via factory-locked OTP - making it optimal for new automotive and industrial designs demanding functional safety compliance.

Availability

S29GL512T11DHV010 is available at Aetrix Electronics and suitable for automotive powertrain control, industrial PLC firmware storage, and medical imaging system boot ROM requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for S29GL512T11DHV010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100 standards.

The GL-T family targets high-reliability embedded applications needing fast XIP execution, robust data retention, and automotive-grade qualification - specifically designed for ECUs, industrial controllers, and medical devices where firmware integrity is mission-critical.

FAQ

Does S29GL512T11DHV010 support both ×8 and ×16 data bus configurations?

Yes. The BYTE# pin selects bus width: asserted low configures ×8 mode (DQ0–DQ7 active), high enables ×16 mode (DQ0–DQ15 active). Addressing remains byte-aligned in both modes, and all commands function identically regardless of width setting.

What is the purpose of the SSR0–SSR3 regions in the OTP array?

SSR0–SSR3 are four 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is factory-locked and immutable; SSR3 supports password-based read protection. SSR1 and SSR2 are user-lockable for storing cryptographic keys or calibration data that must survive field reprogramming.

How does the hardware ECC operate during read operations?

ECC runs transparently on every read: the device checks each 512-byte page, corrects single-bit errors in real time, and reports multi-bit errors via the Status Register's ECCERR bit. No host software intervention is required, and corrected data appears on DQ pins without delay.

Can S29GL512T11DHV010 be used in systems with 1.8 V I/O voltage?

Yes. Its Versatile I/O feature supports V_IO from 1.65 V to V_CC, enabling direct interface with 1.8 V FPGAs or ASICs while maintaining V_CC at 3.3 V for core operation - eliminating external level shifters and reducing board complexity.

S29GL512T11DHV010 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-T

Package/Case:: 64-LBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 64M x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-FBGA (9x9)

S29GL512T11DHV010 FAQ

1.How can I place an order for S29GL512T11DHV010 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512T11DHV010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512T11DHV010 reliable?

The price and inventory of S29GL512T11DHV010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11DHV010 is usually 5 days.

3.What payment methods are accepted for S29GL512T11DHV010?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11DHV010 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512T11DHV010?

S29GL512T11DHV010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512T11DHV010 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512T11DHV010?

For technical support, including S29GL512T11DHV010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11DHV010 requirements.

6.How does Aetrix verify that S29GL512T11DHV010 is sourced from the original manufacturer or authorized distributors?

All S29GL512T11DHV010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11DHV010 meets industry standards.

7.What is the process for return or replacement of S29GL512T11DHV010?

All S29GL512T11DHV010 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11DHV010, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512T11DHV010 part is unused and in its original packaging.

Return procedure for S29GL512T11DHV010:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

2026-06-27 Machine Vision System: Components, Inspection Applications and Integration Guide

Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

2026-06-23 Electronic Devices and Circuits: Fundamentals, Components and Applications

Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…