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Infineon Technologies S29GL512T11DHV013
- Part No.:
- S29GL512T11DHV013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T11DHV013.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,171
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Product details
Overview
S29GL512T11DHV013 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL512T11DHV013 datasheet, S29GL512T11DHV013 pinout, S29GL512T11DHV013 application, or S29GL512T11DHV013 equivalent, key selection criteria include parallel ×16 bus interface timing, OTP array configuration (SSR0–SSR3), sector protection volatility, CFI compliance, and thermal grade validation for embedded control systems.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages program/erase operations with suspend/resume capability and status reporting via Status Register, Data Polling, and RY/BY# pin.
The internal hardware ECC operates transparently during read cycles, correcting single-bit errors without software intervention. Sector protection uses advanced methods including volatile (lock bits) and non-volatile (OTP-based) mechanisms, with four lockable 2048-byte SSR regions-SSR0 factory-locked and SSR3 password-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full firmware images and parameter tables in industrial HMI and PLC boot memory |
| Interface type | Asynchronous parallel ×16 - enables direct CPU address/data bus connection without translation logic |
| Access time (tACC) | 100 ns at –40°C to +85°C - meets real-time boot latency requirements for ARM Cortex-M7/M4 microcontrollers |
| Write buffer size | 512 bytes - reduces effective programming time by up to 4× vs. single-word writes in firmware update routines |
| ECC support | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot paths |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years in deployed equipment |
| Data retention | 20 years at +85°C - ensures long-term reliability in unattended industrial gateways and edge nodes |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint with 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb decoding (byte/word aligned); A0 selects LSB/MSB in ×16 mode |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in multiplexed read/write with CE#, OE#, WE# control |
| CE# | Chip enable | Active-low enable controlling device selection; tCE = 100 ns max defines minimum chip select assertion window |
| OE# | Output enable | Active-low control for data output gating; tOE = 25 ns max ensures clean read strobe timing |
| WE# | Write enable | Active-low signal initiating write/program cycles; synchronizes command latching with address/data setup |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling internal operation progress; low = busy, high = ready for next command |
| VCC | Core supply | 2.7 V–3.6 V single supply powering logic and memory array; decoupling required per datasheet layout guidelines |
| VIO | I/O supply | 1.65 V–VCC versatile I/O voltage - allows interfacing with 1.8 V, 2.5 V, or 3.3 V host buses without level shifters |
Key Features
| Feature | Design Value |
|---|---|
| 512-byte programming buffer | Enables burst programming of up to 512 bytes per command, cutting firmware update time by >75% vs. legacy single-word writes |
| Hardware ECC engine | Corrects single-bit errors on-the-fly during read cycles, eliminating software overhead and ensuring boot integrity without external logic |
| Uniform 128-KB sectors | Allows precise partitioning of boot loader, application, and configuration sectors with independent erase control |
| Four OTP SSR regions | Provides secure storage for calibration data, MAC addresses, and security keys-SSR0 factory-locked, SSR3 password-protected |
| CFI-compliant interface | Enables automatic detection and configuration by standard flash drivers (e.g., U-Boot, Linux MTD), reducing BSP integration effort |
Applications
| Industrial PLC Boot Memory | Automotive ECU Firmware Storage |
|---|---|
Use Scenario: Stores boot loader and real-time control firmware in programmable logic controllers with watchdog supervision and hot-swap capability. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency to ARM Cortex-R5F cores. Use Value: Uniform 128-KB sectors allow isolated firmware rollback; hardware ECC prevents silent corruption in mission-critical motion control loops. | Use Scenario: Holds calibrated sensor fusion algorithms and CAN FD stack binaries in automotive body control modules (BCM) certified to AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Flash memory storing signed firmware images verified at power-on; operates across –40°C to +105°C ambient range. Use Value: OTP SSR regions store vehicle-specific VIN and calibration constants; sector protection prevents accidental overwrite during OTA updates. |
| Medical Imaging System Configuration | Energy Meter Firmware Archive |
Use Scenario: Retains DICOM protocol stacks, image processing LUTs, and regulatory compliance certificates in portable ultrasound devices. IC Role / Device Role / Timing Role: Non-volatile archive memory with 20-year data retention guarantee at +85°C, supporting Class II medical device lifecycle requirements. Use Value: Versatile I/O (1.65 V–3.6 V) interfaces directly with 1.8 V FPGA configuration bus; CFI enables automated driver generation. | Use Scenario: Stores firmware revisions, tariff tables, and metrology calibration parameters in ANSI C12.22-compliant smart electricity meters deployed in tropical climates. IC Role / Device Role / Timing Role: Long-life flash memory operating continuously at +85°C ambient with <100 μA standby current to extend battery backup life. Use Value: 100,000-cycle endurance supports 50+ field firmware upgrades over 15-year meter lifetime; SSR3 password protection secures utility billing keys. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11DHV010 | Same density and package but rated for –40°C to +105°C (Industrial Plus); no OTP SSR3 password protection | Targeted at extended-temperature industrial gateways where firmware update frequency exceeds 100k cycles | Select when operating above +85°C ambient or when OTP password enforcement is not required |
| MX29GL512FHI-11G | Macronix part with identical 512 Mb ×16 interface, 100 ns tACC, but lacks hardware ECC and OTP SSR regions | Suitable for cost-sensitive consumer electronics where ECC is handled in software and security is not mandated | Choose only if external ECC implementation is acceptable and security certification is not required |
Compared with S29GL512S11DHV010 and MX29GL512FHI-11G, the S29GL512T11DHV013 uniquely combines industrial-grade temperature support, on-die ECC, and password-protected OTP-making it the only option qualified for safety-critical boot memory in certified industrial and automotive systems.
Availability
S29GL512T11DHV013 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ECUs, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant sourcing.
Supply support for S29GL512T11DHV013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.
The GL-T family was designed specifically for embedded systems requiring XIP-capable, high-endurance parallel NOR flash with integrated data integrity and security features-targeting boot memory in safety-certified controllers and gateways.
FAQ
Is S29GL512T11DHV013 compatible with legacy S29GL512P designs?
No. The S29GL512T replaces the P-series with enhanced 45-nm MIRRORBIT™ process, faster 15 ns page access, hardware ECC, and updated OTP architecture. Pinout is identical in TSOP-56, but command set differs-especially for SSR lock/unlock and ECC status polling. Migration requires firmware revision and validation per Infineon AN229242.
Does this device support 1.8 V I/O operation?
Yes. The versatile I/O feature supports VIO from 1.65 V to VCC. With VCC = 3.0 V, VIO can be independently set to 1.8 V, enabling direct interface to 1.8 V FPGAs or ASICs without level shifters-confirmed in Section 8.4 and Table 10.4 of the datasheet.
How is the 2048-byte OTP array organized and accessed?
The OTP array consists of four 512-byte sectors (SSR0–SSR3), each individually lockable via dedicated commands. SSR0 is factory-permanently locked; SSR3 supports password-based read protection. Access requires CFI query followed by SSR-specific unlock sequences-detailed in Sections 2.5 and 3.3 of the datasheet.
What thermal grade does S29GL512T11DHV013 carry?
This part is specified for the Industrial temperature grade: –40°C to +85°C. It is not rated for Automotive (AEC-Q100) or Extended (–40°C to +125°C) operation. The "H" in the part number denotes Industrial grade; automotive variants use suffixes like "A" or "B" per Infineon ordering guide section 14.2.
S29GL512T11DHV013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512T11DHV013 FAQ
1.How can I place an order for S29GL512T11DHV013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11DHV013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11DHV013 reliable?
The price and inventory of S29GL512T11DHV013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11DHV013 is usually 5 days.
3.What payment methods are accepted for S29GL512T11DHV013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11DHV013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11DHV013?
S29GL512T11DHV013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11DHV013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11DHV013?
For technical support, including S29GL512T11DHV013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11DHV013 requirements.
6.How does Aetrix verify that S29GL512T11DHV013 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11DHV013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11DHV013 meets industry standards.
7.What is the process for return or replacement of S29GL512T11DHV013?
All S29GL512T11DHV013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11DHV013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11DHV013 part is unused and in its original packaging.
Return procedure for S29GL512T11DHV013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T11DHV013 Tags
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M24C02-WMN6TP
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