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Infineon Technologies S29GL512T11DHV023

Part No.:
S29GL512T11DHV023
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixS29GL512T11DHV023.pdf
Description:
IC FLASH 512MBIT PARALLEL 64FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,671

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Product details

Overview

S29GL512T11DHV023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal single-bit ECC, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.

For engineers reviewing the S29GL512T11DHV023 datasheet, S29GL512T11DHV023 pinout, S29GL512T11DHV023 application, or S29GL512T11DHV023 equivalent, key selection considerations include parallel ×16 bus interface timing compliance, OTP array configuration for secure firmware storage, sector protection granularity, and thermal grade validation for embedded control environments.

Technical Context

This device implements asynchronous parallel NOR architecture with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages program/erase operations autonomously, including suspend/resume capability and status monitoring via Status Register, Data Polling, or RY/BY# pin.

The versatile I/O feature enables independent VIO supply (1.65 V to VCC), allowing interfacing with mixed-voltage logic systems. Internal hardware ECC provides single-bit error correction without software overhead, and the 2048-byte OTP array includes four lockable sectors-SSR0 factory-locked, SSR3 password-protected-for secure boot code or calibration data storage.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density512 Mb (64 MB) - sufficient for full boot image + firmware partition in industrial microcontroller systems
Random access time100 ns at –40°C to +85°C - enables direct XIP execution without external cache penalty
Page access time15 ns - accelerates sequential instruction fetch during boot initialization
Write buffer size512 bytes - reduces effective programming time by batching up to 256 words per operation
ECC capabilitySingle-bit correction - ensures data integrity over 20-year retention without host-level error handling
Sector size128 KB uniform sectors - simplifies firmware update partitioning and wear leveling in field-upgradeable devices
Operating voltageVCC = 2.7–3.6 V, VIO = 1.65–VCC - supports interoperability with 1.8 V/2.5 V/3.3 V logic families
Endurance100,000 program/erase cycles - meets long-life requirements for industrial HMI and PLC firmware storage

Pinout & Package

Package: 56-pin TSOP (Type I, standard thickness), JEDEC MO-142AC compliant, lead-free and RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
A0–A21Address inputs22-bit address bus supporting full 512 Mb decoding (byte/word aligned)
DQ0–DQ15Data I/O16-bit bidirectional data bus; operates in ×8 or ×16 mode per configuration
CE#Chip enableActive-low chip select; controls device power state and command latching
OE#Output enableActive-low read strobe; gates output drivers during read cycles
WE#Write enableActive-low write strobe; initiates program/erase command sequences
RY/BY#Ready/Busy indicatorOpen-drain output signaling active embedded operation (low = busy)
RESET#Hardware resetActive-low asynchronous reset; forces device into known initial state
VCCCore supply2.7–3.6 V main power for core logic and memory array
VIOI/O supply1.65–VCC independent supply for interface voltage level translation
VSSGroundCommon reference for VCC and VIO domains

Key Features

FeatureDesign Value
45-nm MIRRORBIT™ processEnables higher density and lower leakage vs. older NOR nodes, critical for compact industrial modules
Asynchronous 32-byte page readOptimizes burst instruction fetch in XIP applications without clock synchronization overhead
Separate 2048-byte OTP arrayProvides immutable storage for bootloader keys or calibration constants with hardware-enforced lock granularity
Advanced sector protection (ASP)Supports volatile/non-volatile locking per 128-KB sector, enabling secure firmware update zones
CFI parameter tableAllows runtime detection of geometry, timing, and command set - essential for generic flash drivers
Suspend/resume for program/erasePermits interrupt-driven background updates without corrupting ongoing operations

Applications

Industrial PLC Firmware StorageAutomotive Instrument Cluster Boot Memory

Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers deployed in factory automation.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with deterministic 100 ns latency.

Use Value: Eliminates need for external SRAM caching; 128-KB uniform sectors simplify firmware version management and field updates.

Use Scenario: Holding certified boot code and GUI assets in automotive digital instrument clusters meeting AEC-Q100 Grade 2 (–40°C to +105°C).

IC Role / Device Role / Timing Role: Certified flash memory with OTP-secured bootloader and ECC-protected runtime code storage.

Use Value: Meets automotive functional safety requirements via hardware ECC and sector-level write protection.

Medical Imaging System ConfigurationTelecom Base Station Control Firmware

Use Scenario: Retaining calibration tables, device profiles, and regulatory-compliant configuration data in portable ultrasound and MRI subsystems.

IC Role / Device Role / Timing Role: Secure, long-retention non-volatile storage with password-protected SSR3 OTP region for calibration constants.

Use Value: Ensures traceable, tamper-resistant configuration persistence across 20-year product lifecycle.

Use Scenario: Hosting FPGA configuration bitstreams and control firmware in carrier-grade 5G base station remote radio units (RRUs).

IC Role / Device Role / Timing Role: High-reliability parallel flash supporting rapid reconfiguration and hot-swap firmware updates.

Use Value: 512-byte write buffer enables sub-500 μs firmware patching; suspend/resume avoids service interruption during updates.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL512S11DHV020Same density and package, but uses older 65-nm process; 110 ns random access; no OTP arrayLacks SSR-based security features and has lower endurance (10K cycles)Select only if cost sensitivity outweighs security and longevity requirements
MX29GL512FHI-90G512 Mb parallel NOR, 90 ns access, 48-pin TSOP; no built-in ECC or OTP; supports only VCC = 2.7–3.6 V (no VIO flexibility)No hardware ECC or sector protection; requires external error handling and software-based protectionChoose when legacy board compatibility with 48-pin footprint is mandatory and ECC is implemented in host MCU

Compared with S29GL512S11DHV020 and MX29GL512FHI-90G, the S29GL512T11DHV023 delivers superior reliability through on-die ECC, secure firmware storage via OTP, and tighter timing-making it optimal for new designs where safety, longevity, and XIP performance are prioritized.

Availability

S29GL512T11DHV023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical imaging system configuration requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S29GL512T11DHV023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and high-reliability memory solutions, with global manufacturing and quality certifications including IATF 16949 and ISO 9001.

The GL-T family targets embedded systems requiring robust, high-density parallel NOR flash with XIP capability, hardware ECC, and secure OTP storage-designed specifically for industrial control, automotive, and medical applications demanding long-term data integrity.

FAQ

Is S29GL512T11DHV023 compatible with legacy S29GL512P designs?

No. The S29GL512T11DHV023 uses a different command set, timing parameters, and OTP architecture than the P-series. Pinout is identical in TSOP packages, but firmware must be updated to use CFI queries and new status register bits. Electrical interface remains backward-compatible, but embedded algorithms require validation.

What is the function of the SSR0–SSR3 regions in the OTP array?

SSR0–SSR3 are four 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is permanently locked at factory and stores device ID and CFI data. SSR1–SSR2 are user-lockable for calibration or serial numbers. SSR3 supports password-based read protection for sensitive keys, enforced by hardware-no software bypass is possible.

Does this device support synchronous read modes?

No. The S29GL512T11DHV023 is strictly asynchronous-timing relies on CE#, OE#, and WE# control signals without clock input. It does not support QSPI, DDR, or any clocked interface. Page read is asynchronous with 32-byte burst capability, but no clock signal is required or accepted.

How is ECC implemented and verified during operation?

ECC is fully hardware-managed: single-bit errors are corrected automatically on every read, and the Status Register reports correction events via the ECCERR bit. No host intervention is needed. Correction occurs transparently in the data path; uncorrectable multi-bit errors trigger BUSY timeout and require host-initiated recovery. ECC logic is always enabled and cannot be disabled.

S29GL512T11DHV023 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-T
Package/Case:
64-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
110 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-FBGA (9x9)

S29GL512T11DHV023 FAQ

1.How can I place an order for S29GL512T11DHV023 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512T11DHV023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512T11DHV023 reliable?

The price and inventory of S29GL512T11DHV023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11DHV023 is usually 5 days.

3.What payment methods are accepted for S29GL512T11DHV023?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11DHV023 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512T11DHV023?

S29GL512T11DHV023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512T11DHV023 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512T11DHV023?

For technical support, including S29GL512T11DHV023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11DHV023 requirements.

6.How does Aetrix verify that S29GL512T11DHV023 is sourced from the original manufacturer or authorized distributors?

All S29GL512T11DHV023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11DHV023 meets industry standards.

7.What is the process for return or replacement of S29GL512T11DHV023?

All S29GL512T11DHV023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11DHV023, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512T11DHV023 part is unused and in its original packaging.

Return procedure for S29GL512T11DHV023:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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