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Infineon Technologies S29GL512T11FAIV13
- Part No.:
- S29GL512T11FAIV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T11FAIV13.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,691
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Product details
Overview
S29GL512T11FAIV13 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It serves as non-volatile program storage in boot code execution and firmware update subsystems of industrial controllers.
For engineers reviewing the S29GL512T11FAIV13 datasheet, S29GL512T11FAIV13 pinout, S29GL512T11FAIV13 application, or S29GL512T11FAIV13 equivalent, key selection criteria include verified 100,000 program/erase cycles, 20-year data retention, OTP array with four lockable SSR regions, CFI compliance, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 configurable data bus and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages all program/erase operations, including automatic ECC generation and status reporting via Status Register, Data Polling, or RY/BY# pin.
The versatile I/O feature enables independent VIO supply (1.65 V to VCC), allowing interoperability with mixed-voltage host systems. Sector protection includes volatile/non-volatile ASP and factory-locked SSR0 plus password-protected SSR3 within the 2048-byte OTP array.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - fixed capacity for boot image and firmware storage in resource-constrained embedded hosts |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution without external cache in real-time control loops |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot initialization |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Internal hardware single-bit error correction - maintains data integrity without host CPU overhead |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over full product lifecycle |
| Data retention | 20 years - ensures long-term reliability in unpowered storage applications |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141BA footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512-Mb addressing space with byte/word boundary alignment |
| DQ0–DQ15 | Data I/O | Configurable ×8/×16 bidirectional data bus; DQ15 functions as BYTE# when operating in ×8 mode |
| CE# | Chip enable | Active-low chip select enabling device participation in parallel bus transactions |
| OE# | Output enable | Controls output drivers during read cycles; used with CE# and WE# for timing coordination |
| WE# | Write enable | Initiates write/program/erase commands when asserted with valid address and data |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation; high = ready, low = busy |
| VCC | Core supply | Single 2.7–3.6 V supply powering core logic, memory array, and EAC |
| VIO | I/O supply | Independent 1.65–VCC supply enabling voltage translation with lower-voltage processors |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - eliminates level shifters when interfacing with 1.8 V or 3.3 V SoCs |
| Hardware ECC engine | On-die single-bit error correction - preserves boot code integrity without software intervention |
| Program suspend/resume | Interrupts ongoing buffer programming to service higher-priority reads - essential for real-time interrupt latency control |
| OTP array with SSR locking | 2048-byte one-time programmable region partitioned into four lockable sectors (SSR0–SSR3) - secures bootloader keys and calibration data |
| CFI-compliant interface | Standardized parameter table accessible via read commands - enables generic flash driver reuse across platforms |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and configuration parameters in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 100 ns read access for deterministic startup timing. Use Value: Enables reliable cold-start within 500 ms while supporting field firmware updates via secure OTP-protected update vectors. | Use Scenario: Hosting boot code and safety-critical sensor calibration data in automotive camera modules compliant with AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: High-reliability boot memory with 20-year data retention and hardware ECC to meet ISO 26262 ASIL-B requirements. Use Value: Eliminates need for external error-checking logic and extends functional safety lifetime beyond 15 years of vehicle operation. |
| Medical Imaging System Configuration | Telecom Base Station Upgrade Storage |
Use Scenario: Retaining device-specific calibration tables and regulatory compliance settings in portable ultrasound equipment. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage using factory-locked SSR0 and password-protected SSR3 for HIPAA-compliant data governance. Use Value: Meets FDA 21 CFR Part 11 audit trail requirements through hardware-enforced write protection of critical configuration registers. | Use Scenario: Storing field-upgradable protocol stacks and RF calibration profiles in 5G small cell base stations operating in extended temperature ranges. IC Role / Device Role / Timing Role: High-endurance flash with 100,000 erase cycles supporting quarterly firmware revisions over 10+ year deployments. Use Value: Reduces maintenance downtime by enabling in-service updates without hardware replacement or service visits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11FAIV10 | Same density and package but rated for –40°C to +105°C; lacks OTP SSR3 password protection | Preferred for extended-temperature industrial gateways where OTP security is secondary to thermal margin | Select when operating ambient exceeds +85°C and SSR3-level security is not required |
| MX29GL512FHI-11G | Micron equivalent with identical 512 Mb density, 100 ns tACC, and CFI compliance; no hardware ECC engine | Requires host-side ECC implementation, increasing software complexity and CPU load | Choose only if legacy driver stack already supports Micron's command set and ECC is handled externally |
Compared with S29GL512S11FAIV10 and MX29GL512FHI-11G, the S29GL512T11FAIV13 uniquely combines industrial-grade temperature tolerance, on-die ECC, and four-region OTP security-making it optimal for safety-critical, long-lifecycle embedded systems requiring zero-host-error-correction overhead.
Availability
S29GL512T11FAIV13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across multi-year production programs.
Supply support for S29GL512T11FAIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and automotive markets.
The GL-T family targets high-reliability embedded applications requiring XIP-capable parallel NOR flash with enhanced endurance, ECC, and secure OTP storage - optimized for boot code, firmware, and calibration data retention.
FAQ
Does S29GL512T11FAIV13 support both ×8 and ×16 data bus configurations?
Yes, it supports configurable ×8/×16 operation via the BYTE# signal (DQ15). In ×8 mode, DQ0–DQ7 transfer data while DQ8–DQ15 are unused; in ×16 mode, all DQ lines operate concurrently. Addressing remains word-aligned in both modes, and the CFI query returns correct bus width identification.
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four independently lockable 512-byte sectors within the 2048-byte OTP array. SSR0 is factory-locked and immutable; SSR1 and SSR2 are user-lockable via command sequence; SSR3 supports password-based read protection. These regions store cryptographic keys, calibration constants, and device identity data with hardware-enforced write prevention.
Can the S29GL512T11FAIV13 be used in automotive applications requiring AEC-Q100 qualification?
No - this specific variant (S29GL512T11FAIV13) is rated for industrial temperature range (–40°C to +85°C) and is not AEC-Q100 qualified. Automotive-grade equivalents such as S29GL512T11FHIV13 (Grade 2, –40°C to +105°C) or S29GL512T11FHV13 (Grade 3) must be selected for automotive use cases.
How does the 512-byte write buffer improve effective programming speed?
The buffer allows up to 512 bytes (256 words) to be loaded before initiating a single embedded program operation, reducing command overhead and bus arbitration delays. Measured buffer programming rate is 1.14 MBps across all temperature grades, delivering up to 4× faster effective throughput versus single-word programming in firmware update scenarios.
S29GL512T11FAIV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL512T11FAIV13 FAQ
1.How can I place an order for S29GL512T11FAIV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11FAIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11FAIV13 reliable?
The price and inventory of S29GL512T11FAIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11FAIV13 is usually 5 days.
3.What payment methods are accepted for S29GL512T11FAIV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11FAIV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11FAIV13?
S29GL512T11FAIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11FAIV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11FAIV13?
For technical support, including S29GL512T11FAIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11FAIV13 requirements.
6.How does Aetrix verify that S29GL512T11FAIV13 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11FAIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11FAIV13 meets industry standards.
7.What is the process for return or replacement of S29GL512T11FAIV13?
All S29GL512T11FAIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11FAIV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11FAIV13 part is unused and in its original packaging.
Return procedure for S29GL512T11FAIV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T11FAIV13 Tags
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