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Infineon Technologies S29GL512T11FAIV20
- Part No.:
- S29GL512T11FAIV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T11FAIV20.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,550
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Product details
Overview
S29GL512T11FAIV20 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL512T11FAIV20 datasheet, S29GL512T11FAIV20 pinout, S29GL512T11FAIV20 application, or S29GL512T11FAIV20 equivalent, key selection factors include its 56-pin TSOP package, Versatile I/O support (1.65 V to VCC), CFI-compliant interface, OTP array with four lockable SSR regions, and AEC-Q100 grade 3 qualification for automotive control modules.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and status reporting via Status Register, Data Polling, or RY/BY# pin.
The internal hardware ECC operates transparently during read operations, correcting single-bit errors without software intervention. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods, while the 2048-byte OTP array includes factory-locked SSR0 and password-protected SSR3 for secure firmware storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - sufficient for full boot image + firmware partition in industrial HMI systems |
| Supply Voltage | 2.7 V to 3.6 V - enables direct connection to 3.3 V logic rails without level shifters |
| Random Access Time | 100 ns at –40°C to +85°C - meets real-time boot latency requirements for PLCs |
| Page Access Time | 15 ns - accelerates sequential instruction fetch in XIP mode |
| Write Buffer Size | 512 bytes - reduces effective programming time by up to 10× vs. single-word writes |
| ECC Support | Internal single-bit error correction - eliminates need for external ECC logic in safety-critical designs |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years of operation |
| Data Retention | 20 years - ensures long-term reliability in unpowered storage applications |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, standard JEDEC MO-141AC footprint, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 512 Mb addressing space with byte/word alignment |
| DQ0–DQ15 | Data I/O | Configurable ×8 or ×16 bus; bidirectional with tristate control for shared memory buses |
| CE# | Chip Enable | Active-low enable controlling device selection in multi-chip memory systems |
| OE# | Output Enable | Active-low control for data output gating; used with CE# for read timing compliance |
| WE# | Write Enable | Active-low signal initiating internal program/erase algorithms when combined with command sequences |
| RY/BY# | Ready/Busy Output | Open-drain status indicator showing active programming/erasing (low) or ready (high) |
| VCC | Core Supply | 3.0 V nominal supply powering core logic and memory array; tolerant of 2.7–3.6 V range |
| VIO | I/O Supply | Independent 1.65–VCC I/O voltage rail enabling mixed-voltage system interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Supports 1.65 V to VCC I/O voltage - eliminates level shifters when interfacing with 1.8 V or 2.5 V microcontrollers |
| Hardware ECC | On-the-fly single-bit error correction - removes software overhead and improves system MTBF in harsh EMI environments |
| OTP Array with SSR Locking | 2048-byte one-time programmable region with four independently lockable sectors - enables secure bootloader storage and calibration data binding |
| Suspend/Resume | Interruptible program/erase operations - allows high-priority read access during background flash operations |
| CFI Compliance | Standard Common Flash Interface parameter table - enables automatic driver detection and configuration in Linux/U-Boot environments |
Applications
| Industrial PLC Boot Memory | Automotive ADAS Control Module |
|---|---|
Use Scenario: Stores boot firmware and real-time control code for programmable logic controllers operating in factory automation environments. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency. Use Value: Enables deterministic boot within 500 ms and supports field firmware updates via 128-KB uniform sector erase. | Use Scenario: Holds calibrated sensor fusion parameters and safety-critical startup routines in lane-departure warning ECUs. IC Role / Device Role / Timing Role: AEC-Q100 grade 3 qualified flash storing immutable boot code and runtime configuration data. Use Value: Guarantees 20-year data retention at +85°C ambient and withstands 100,000 reprogramming cycles during vehicle lifetime. |
| Medical Imaging System Storage | Telecom Base Station Firmware |
Use Scenario: Stores FPGA configuration bitstreams and diagnostic firmware in portable ultrasound devices requiring radiation-tolerant storage. IC Role / Device Role / Timing Role: High-reliability parallel flash with hardware ECC ensuring integrity of critical imaging algorithms. Use Value: Single-bit error correction prevents silent data corruption in stored DICOM processing kernels. | Use Scenario: Hosts baseband processor firmware and protocol stack images in 4G/5G remote radio units deployed in outdoor cabinets. IC Role / Device Role / Timing Role: Industrial-grade flash supporting extended temperature operation (–40°C to +85°C) and robust power-loss recovery. Use Value: Versatile I/O allows direct interface with 1.8 V FPGAs while maintaining 512-byte buffered programming efficiency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11FAIV20 | Same density and package, but uses older 65-nm process; 110 ns random access (vs. 100 ns); no Versatile I/O (fixed VIO = VCC) | Lacks independent I/O rail - requires matching host VCC for interface; lower endurance (50k cycles) | Select only if cost sensitivity outweighs performance and flexibility needs in legacy designs. |
| MX29GL512FHI-11G | Micron equivalent; identical 56-pin TSOP, 512 Mb, 100 ns access; supports CFI but lacks OTP array and SSR locking | No hardware-based secure storage - requires external encryption or software-managed keys for bootloader protection | Choose when secure OTP functionality is not required and Micron supply chain preference applies. |
Compared with S29GL512S11FAIV20 and MX29GL512FHI-11G, the S29GL512T11FAIV20 delivers superior interface flexibility (Versatile I/O), higher endurance, integrated security (SSR-lockable OTP), and tighter timing-making it optimal for new industrial and automotive designs demanding long-term reliability and firmware integrity.
Availability
S29GL512T11FAIV20 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, medical imaging systems, and telecom base station firmware requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T11FAIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and memory solutions, with global R&D and manufacturing infrastructure.
The GL-T family was designed specifically for high-reliability embedded systems needing fast XIP execution, robust data retention, and secure firmware storage - targeting industrial automation, automotive control, and medical equipment markets.
FAQ
What is the maximum operating temperature range for S29GL512T11FAIV20?
The S29GL512T11FAIV20 is rated for industrial temperature range: –40°C to +85°C. This rating is confirmed in the datasheet's "Temperature range / grade" section and applies to all electrical and timing specifications unless otherwise noted. It is not qualified for the +105°C or +125°C extended grades in this specific part number variant.
Does S29GL512T11FAIV20 support both ×8 and ×16 data bus configurations?
Yes - the device supports configurable ×8 (byte) or ×16 (word) operation via hardware pin strapping (BYTE# input) and internal register settings. The datasheet confirms that all read and write accesses align to byte or word boundaries, and the CFI query returns correct bus width identification for driver auto-configuration.
How does the hardware ECC function during normal read operations?
The internal ECC logic automatically checks each 512-byte flash page during read access and corrects single-bit errors transparently. No software intervention or additional timing overhead is required - corrected data appears on DQ pins within standard tACC timing, and uncorrectable multi-bit errors trigger status flag assertion per the Status Register definition.
Is the OTP array fully programmable and lockable per sector?
Yes - the 2048-byte OTP array is divided into four 512-byte lockable regions (SSR0–SSR3). SSR0 is factory-locked and permanently read-only; SSR1 and SSR2 are user-lockable via command sequence; SSR3 supports password-based read protection. All locking is non-volatile and irreversible once committed.
S29GL512T11FAIV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL512T11FAIV20 FAQ
1.How can I place an order for S29GL512T11FAIV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11FAIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11FAIV20 reliable?
The price and inventory of S29GL512T11FAIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11FAIV20 is usually 5 days.
3.What payment methods are accepted for S29GL512T11FAIV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11FAIV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11FAIV20?
S29GL512T11FAIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11FAIV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11FAIV20?
For technical support, including S29GL512T11FAIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11FAIV20 requirements.
6.How does Aetrix verify that S29GL512T11FAIV20 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11FAIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11FAIV20 meets industry standards.
7.What is the process for return or replacement of S29GL512T11FAIV20?
All S29GL512T11FAIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11FAIV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11FAIV20 part is unused and in its original packaging.
Return procedure for S29GL512T11FAIV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T11FAIV20 Tags
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M24C02-WMN6TP
STMicroelectronics
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