My Inquiry
My Account
Infineon Technologies S29GL512T11FAIV23
- Part No.:
- S29GL512T11FAIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T11FAIV23.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,287
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL512T11FAIV23 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with MIRRORBIT™ technology, designed for embedded code storage and XIP execution in industrial and automotive systems. It operates from 2.7 V to 3.6 V, delivers 100 ns random access time (–40°C to +85°C), features 512-byte write buffer programming, internal single-bit ECC, and uniform 128-KB sector erase.
For engineers reviewing the S29GL512T11FAIV23 datasheet, S29GL512T11FAIV23 pinout, S29GL512T11FAIV23 application, or S29GL512T11FAIV23 equivalent, key selection criteria include parallel ×16 bus interface, industrial temperature grade (–40°C to +85°C), TSOP-56 packaging, OTP array with four lockable SSR regions, and CFI-compliant software interface support.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC correction without host intervention.
The GL-T architecture integrates status register monitoring, data polling, and RY/BY# hardware signaling for real-time operation status feedback. Sector protection uses volatile and non-volatile methods per 128-KB sector, while the 2048-byte OTP array includes factory-locked SSR0 and password-protected SSR3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full firmware images and boot code in resource-constrained embedded controllers |
| Interface type | Asynchronous parallel ×16 - enables direct CPU bus connection without translation logic or serial-to-parallel conversion |
| Random access time | 100 ns at –40°C to +85°C - meets real-time code fetch latency requirements for industrial PLCs and motor drives |
| Write buffer size | 512 bytes - reduces effective programming time by up to 10× vs. single-word writes in firmware update routines |
| ECC capability | Internal single-bit error correction - maintains data integrity over 20-year retention without external ECC logic |
| Endurance | 100,000 program/erase cycles - supports field firmware updates across product lifetime in automotive ECUs |
| Operating voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - allows interoperability with 1.8 V, 2.5 V, and 3.3 V I/O domains |
| Temperature grade | Industrial (–40°C to +85°C) - qualified for use in factory automation, HMI, and industrial gateways without derating |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, standard JEDEC MO-141AC footprint with gull-wing leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address inputs | 21-bit address bus supporting full 512 Mb address space with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports 8-bit mode via BYTE# control |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low read strobe; gates output drivers during read operations |
| WE# | Write enable | Active-low write strobe; initiates program/erase command sequences |
| RY/BY# | Ready/Busy indicator | Open-drain status signal; low during embedded operations, high when ready |
| RESET# | Hardware reset | Active-low asynchronous reset; forces device into known state and aborts ongoing operations |
| BYTE# | Bus width select | Configures ×8 (high) or ×16 (low) data bus mode; determines DQ0–DQ7 or DQ0–DQ15 usage |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO = 1.65 V to VCC - eliminates level shifters when interfacing with mixed-voltage SoCs and microcontrollers |
| Uniform 128-KB sectors | 512 individually erasable sectors - enables fine-grained firmware partitioning and secure OTA update zones |
| OTP array with SSR locking | 2048-byte one-time-programmable region with four lockable sub-regions - supports secure key storage and calibration data binding |
| CFI parameter table | Standardized JEDEC JESD68 query structure - enables auto-detection and driver compatibility across OS and bootloader environments |
| Suspend/Resume capability | Interruptible program/erase - allows high-priority read access during background flash operations in real-time systems |
Applications
| Industrial PLC Firmware Storage | Automotive ECU Boot Memory |
|---|---|
Use Scenario: Storing ladder logic programs and configuration data in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability; provides deterministic <100 ns instruction fetch latency during motion control loops. Use Value: Eliminates external SRAM caching and reduces BOM count by enabling direct CPU execution from flash, lowering system cost and board area. | Use Scenario: Holding boot firmware and safety-critical startup routines in engine control units operating under AEC-Q100 Grade 3 conditions. IC Role / Device Role / Timing Role: Primary boot memory with 20-year data retention and 100,000-cycle endurance for reprogramming during vehicle service life. Use Value: Meets ISO 26262 ASIL-B functional safety requirements through built-in ECC and sector-level protection, reducing validation effort. |
| HMI Application Code Storage | Network Gateway Firmware Image |
Use Scenario: Hosting GUI application binaries and localized language assets in human-machine interface panels used in medical and building automation equipment. IC Role / Device Role / Timing Role: High-density parallel flash with OTP-secured calibration data storage; supports fast GUI load times via page-mode reads. Use Value: Enables multi-language UI deployment without requiring external memory expansion, simplifying certification for regional regulatory compliance. | Use Scenario: Storing dual firmware images (active + backup) and protocol stacks in industrial Ethernet gateways connecting legacy fieldbus networks to cloud platforms. IC Role / Device Role / Timing Role: Dual-image storage with sector protection; allows atomic firmware rollback on failed OTA updates. Use Value: Guarantees zero-downtime field upgrades and prevents bricking during network interruptions, improving remote maintenance SLA. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11FAIV23 | Same density and package, but uses older 65-nm process; 110 ns random access (vs. 100 ns); no OTP array | Lacks SSR-based security features; unsuitable for secure key storage or calibration binding | Select only if OTP and tighter timing are not required, and cost sensitivity outweighs longevity and security needs |
| MX29GL512FHI-11G | Micron equivalent; same 512 Mb, TSOP-56, 100 ns access; supports CFI but lacks hardware ECC and OTP | No integrated ECC requires external error handling; no dedicated secure storage region | Prefer when leveraging existing Micron qualification or where ECC is implemented in software/firmware layer |
Compared with S29GL512S11FAIV23 and MX29GL512FHI-11G, the S29GL512T11FAIV23 uniquely combines 45-nm efficiency, hardware ECC, and OTP-based security-making it optimal for safety- or security-critical industrial and automotive firmware storage where long-term reliability and tamper resistance are mandatory.
Availability
S29GL512T11FAIV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot memory, HMI application code storage, and network gateway firmware image hosting requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T11FAIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The GL-T family targets high-reliability embedded systems needing fast XIP-capable flash with robust data integrity and flexible I/O voltage support-designed specifically for code storage in safety-critical and long-lifecycle deployments.
FAQ
Is S29GL512T11FAIV23 compatible with legacy S29GL512P designs?
No. The S29GL512T uses a different command set and timing model than the P-series. While pin-compatible in TSOP-56, differences in CFI query responses, ECC behavior, and OTP access require firmware and driver updates. Migration requires validation of all read, program, and erase sequences per the Rev. *M datasheet.
Does this device support byte-write operations without sector erase?
Yes. The S29GL512T11FAIV23 supports single-word programming within an already-erased sector. However, each word must be programmed only once per erase cycle unless the entire sector is erased first. Repeated writes to the same location without erase will result in bit failures due to oxide stress.
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte sub-regions in the 2048-byte OTP array. SSR0 is factory-locked and permanently read-only. SSR1 and SSR2 are user-lockable via command sequence. SSR3 supports password-protected read access, enabling secure storage of cryptographic keys or calibration coefficients that must remain confidential.
Can RY/BY# be used as a general-purpose I/O pin?
No. RY/BY# is a dedicated open-drain status output with internal pull-up. It asserts low during program/erase operations and goes high only when the device is fully ready. Using it as a GPIO would violate timing specifications and risk incorrect status interpretation during critical operations.
S29GL512T11FAIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL512T11FAIV23 FAQ
1.How can I place an order for S29GL512T11FAIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11FAIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11FAIV23 reliable?
The price and inventory of S29GL512T11FAIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11FAIV23 is usually 5 days.
3.What payment methods are accepted for S29GL512T11FAIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11FAIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11FAIV23?
S29GL512T11FAIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11FAIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11FAIV23?
For technical support, including S29GL512T11FAIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11FAIV23 requirements.
6.How does Aetrix verify that S29GL512T11FAIV23 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11FAIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11FAIV23 meets industry standards.
7.What is the process for return or replacement of S29GL512T11FAIV23?
All S29GL512T11FAIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11FAIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11FAIV23 part is unused and in its original packaging.
Return procedure for S29GL512T11FAIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T11FAIV23 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
