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Infineon Technologies S29GL512T11FHB020
- Part No.:
- S29GL512T11FHB020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T11FHB020.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,926
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Product details
Overview
S29GL512T11FHB020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It integrates hardware ECC for single-bit error correction, supports 128-KB uniform sector erase, and includes a 512-byte programming buffer - deployed in industrial-grade embedded systems requiring reliable code storage and XIP execution.
For engineers reviewing the S29GL512T11FHB020 datasheet, S29GL512T11FHB020 pinout, S29GL512T11FHB020 application, or S29GL512T11FHB020 equivalent, key selection criteria include its 100,000 program/erase cycles, –40°C to +85°C industrial temperature grade, 128-KB sector architecture, and support for both ×8 and ×16 data bus configurations in TSOP and BGA packages.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both standard and page-mode reads. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC correction without host intervention.
The versatile I/O feature enables independent VIO supply (1.65 V to VCC), allowing interoperability with mixed-voltage system buses. Sector protection includes volatile/non-volatile ASP and four lockable OTP regions (SSR0–SSR3), with SSR0 factory-locked and SSR3 password-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for boot code, firmware, and configuration storage in resource-constrained embedded controllers |
| Random access time (tACC) | 100 ns at –40°C to +85°C - enables deterministic real-time code fetch in XIP applications |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during burst reads |
| Programming buffer size | 512 bytes - reduces effective programming time by up to 10× vs. single-word writes |
| ECC capability | Single-bit error correction via on-die hardware - eliminates need for external ECC logic in safety-critical firmware storage |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention - meets long-lifecycle requirements for industrial control and automotive ECUs |
| Operating voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - supports integration into 3.3 V systems with 1.8 V or 3.3 V I/O domains |
Pinout & Package
Package: 56-pin TSOP (Type I, 14 mm × 20 mm, 0.55 mm pitch), compliant with JEDEC MO-142AB. Pinout validated per Infineon datasheet Rev. *M, Section 12.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb addressing (byte/word boundary aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 or ×16 mode depending on BYTE# state |
| CE# | Chip enable | Active-low chip select; controls device power state and read/write initiation |
| OE# | Output enable | Active-low control for data bus output drivers during read operations |
| WE# | Write enable | Active-low signal initiating write, program, or erase command latching |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation (low = busy) |
| BYTE# | Bus width select | High = ×8 mode (DQ0–DQ7 active); low = ×16 mode (DQ0–DQ15 active) |
| RESET# | Hardware reset | Active-low input forcing device into reset state, clearing status registers and aborting operations |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | On-die single-bit error correction with automatic detection and correction during read - ensures firmware integrity without CPU overhead |
| 512-byte write buffer | Enables programming of up to 512 bytes per command - cuts typical firmware update time by >70% vs. legacy flash |
| Uniform 128-KB sectors | 64 identical sectors simplify partitioning for bootloader, application, and parameter storage with deterministic erase timing |
| Versatile I/O (VIO) | Independent 1.65 V–VCC I/O supply - allows direct interfacing with 1.8 V FPGAs or 3.3 V microcontrollers without level shifters |
| OTP array with SSR locking | 2048-byte one-time-programmable area with four lockable regions - secures calibration data, keys, or device-specific identifiers |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and runtime logic in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability and deterministic 100 ns read latency for real-time task scheduling. Use Value: 20-year data retention and 100,000-cycle endurance ensure firmware integrity over 15+ years of unattended operation. | Use Scenario: Hosting boot code and display graphics assets in automotive digital instrument clusters meeting AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Primary boot memory with hardware ECC to prevent corruption-induced display faults during cold cranking or thermal cycling. Use Value: Built-in ECC and extended temperature rating eliminate need for external error-handling logic and qualify for under-hood deployment. |
| Medical Imaging System Configuration | Avionics Data Logger Storage |
Use Scenario: Retaining calibration tables, sensor profiles, and regulatory compliance settings in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage using locked SSR3 region with password protection for HIPAA-compliant configuration data. Use Value: Factory-locked SSR0 and password-protected SSR3 prevent unauthorized modification of FDA-cleared operational parameters. | Use Scenario: Logging flight-critical telemetry and fault records in certified avionics black box recorders requiring DO-160 environmental resilience. IC Role / Device Role / Timing Role: High-reliability non-volatile storage with 128-KB uniform sectors enabling atomic log segment updates and wear leveling across partitions. Use Value: 100,000 erase cycles and extended temperature range (–40°C to +125°C) meet RTCA DO-160 Section 22 Category D shock/vibration and thermal stress requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFB020 | Same density and core voltage, but uses 64-ball LAE BGA (9 mm × 9 mm) instead of 56-pin TSOP; lacks VIO versatility (fixed 3.3 V I/O) | Preferred for space-constrained PCBs where BGA routing and thermal performance outweigh TSOP ease-of-use | Select when board layout favors fine-pitch BGA and I/O voltage is fixed at 3.3 V |
| MX29GL512FHI-90G | Micron equivalent with identical 512 Mb density, 90 ns tACC, and 128-KB sectors; no integrated ECC or OTP array | Requires external ECC implementation and lacks secure OTP for calibration data storage | Choose only if cost sensitivity outweighs built-in reliability features and security requirements |
Compared with S29GL512S11TFB020 and MX29GL512FHI-90G, the S29GL512T11FHB020 uniquely combines TSOP package accessibility, versatile I/O, on-die ECC, and password-protected OTP - making it optimal for industrial and automotive designs demanding field-upgradable firmware with zero-error tolerance.
Availability
S29GL512T11FHB020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical imaging system configuration requiring stable component supply across multi-year production cycles.
Supply support for S29GL512T11FHB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and high-reliability memory solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q100.
The GL-T family targets embedded systems needing robust, high-density parallel NOR flash with XIP capability, ECC, and extended temperature operation - designed specifically for automotive, industrial, and medical applications where firmware integrity is non-negotiable.
FAQ
Is S29GL512T11FHB020 pin-compatible with earlier S29GL512P devices?
No. The S29GL512T11FHB020 uses a 56-pin TSOP package with updated pin assignments for RY/BY#, RESET#, and VIO support, differing from the 48-pin TSOP of the P-series. Signal mapping and timing parameters also differ - direct replacement requires PCB redesign and firmware validation.
Does this device support synchronous read mode?
No. The S29GL512T11FHB020 is strictly asynchronous - all read operations (standard and page mode) rely on CE#, OE#, and address setup/hold timing without clock input. It does not implement CFI mode 0x01 (synchronous burst) or any clocked interface.
Can the OTP array be reprogrammed after locking SSR3?
No. Once SSR3 is locked with a valid password, that 512-byte OTP region becomes permanently read-only. The password itself is stored in a separate register and cannot be recovered or overwritten - this is a hardware-enforced security feature per Infineon's GL-T specification.
What is the maximum sustained write throughput using the 512-byte buffer?
At –40°C to +85°C, the device achieves 1.14 MBps buffer programming rate - meaning a full 512-byte buffer writes in approximately 447 μs. This assumes optimal bus turnaround and no inter-buffer delays; actual throughput depends on host controller timing margins and CE#/WE# assertion stability.
S29GL512T11FHB020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL512T11FHB020 FAQ
1.How can I place an order for S29GL512T11FHB020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11FHB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11FHB020 reliable?
The price and inventory of S29GL512T11FHB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11FHB020 is usually 5 days.
3.What payment methods are accepted for S29GL512T11FHB020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11FHB020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11FHB020?
S29GL512T11FHB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11FHB020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11FHB020?
For technical support, including S29GL512T11FHB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11FHB020 requirements.
6.How does Aetrix verify that S29GL512T11FHB020 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11FHB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11FHB020 meets industry standards.
7.What is the process for return or replacement of S29GL512T11FHB020?
All S29GL512T11FHB020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11FHB020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11FHB020 part is unused and in its original packaging.
Return procedure for S29GL512T11FHB020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T11FHB020 Tags
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M24C02-WMN6TP
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AT21CS01-STUM10-T
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