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Infineon Technologies S29GL512T11FHB023
- Part No.:
- S29GL512T11FHB023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T11FHB023.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,325
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Product details
Overview
S29GL512T11FHB023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It integrates hardware ECC for single-bit error correction, supports 128-KB uniform sector erase, and features a 512-byte programming buffer - enabling high-speed embedded code storage in automotive instrument clusters, industrial HMIs, and network boot loaders.
For engineers reviewing the S29GL512T11FHB023 datasheet, S29GL512T11FHB023 pinout, S29GL512T11FHB023 application, or S29GL512T11FHB023 equivalent, key selection criteria include verified 128-KB sector architecture, industrial-plus temperature grade (–40°C to +105°C), TSOP-56 package compatibility, and CFI-compliant software interface for legacy BIOS and firmware update systems.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus support and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC operations without host CPU intervention.
The versatile I/O feature enables independent VIO supply (1.65 V to VCC), allowing direct interfacing with 1.8 V or 3.3 V logic while maintaining full 2.7–3.6 V core operation. Sector protection includes volatile/non-volatile ASP and four lockable 2048-byte OTP regions (SSR0–SSR3), with SSR0 factory-locked and SSR3 password-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - sufficient for full firmware images in automotive ECUs and industrial controllers |
| Access Time (tACC) | 100 ns at –40°C to +85°C - meets real-time boot latency requirements for XIP execution |
| Page Access (tPACC) | 15 ns - enables fast sequential instruction fetch during burst reads |
| Programming Buffer | 512 bytes - reduces effective programming time by up to 4× vs. single-word writes |
| ECC Support | Internal hardware single-bit correction - eliminates need for external ECC logic in safety-critical systems |
| Endurance | 100,000 program/erase cycles - validated for field-updatable firmware over 10+ year product lifecycles |
| Data Retention | 20 years at +85°C - ensures long-term reliability in sealed industrial enclosures |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I), 14 mm × 20 mm, standard JEDEC MO-141AC footprint with 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 512 Mb linear addressing (byte/word mode) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 or ×16 mode per configuration |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE = 100 ns max for timing-critical systems |
| OE# | Output Enable | Active-low control for data output gating; tOE = 25 ns max ensures clean read strobing |
| WE# | Write Enable | Active-low signal initiating internal program/erase algorithms via command sequences |
| RY/BY# | Ready/Busy Output | Open-drain status indicator - low during embedded operations, critical for interrupt-driven firmware flow |
| VCC | Core Supply | 2.7–3.6 V single supply powering logic and memory array; no separate VPP required |
| VIO | I/O Supply | 1.65–VCC independent voltage rail - enables mixed-voltage system integration without level shifters |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC Engine | On-die single-bit error correction with automatic detection - removes ECC overhead from host processor and guarantees data integrity during power-loss events |
| 512-Byte Programming Buffer | Enables full-page programming in one command cycle - cuts typical firmware update time by >70% compared to legacy single-word write methods |
| Uniform 128-KB Sectors | 128 identically sized, independently erasable sectors - simplifies partitioning for dual-bank OTA updates and secure boot image management |
| Versatile I/O Voltage | VIO range 1.65 V to VCC - allows direct connection to 1.8 V FPGA I/O banks or 3.3 V microcontroller buses without external translation |
| CFI Compliance | Standard Common Flash Interface parameter table - enables auto-detection and driver compatibility across U-Boot, BIOS, and RTOS environments |
Applications
| Automotive Instrument Cluster | Industrial HMI Controller |
|---|---|
Use Scenario: Storing calibrated gauge graphics, firmware, and calibration tables in digital dashboards requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Non-volatile code and data storage with XIP capability for real-time display rendering and CAN message handling. Use Value: 100 ns random access enables sub-10 ms boot-to-display; 128-KB sectors allow atomic firmware patching without disrupting active UI processes. | Use Scenario: Firmware and configuration storage in panel-mounted HMIs deployed in factory automation cabinets with ambient temperatures up to +105°C. IC Role / Device Role / Timing Role: Primary boot memory and runtime parameter store interfaced to ARM Cortex-A series processors via parallel bus. Use Value: Industrial-plus temperature rating (–40°C to +105°C) ensures reliable operation in uncooled enclosures; hardware ECC prevents silent corruption in long-duration deployments. |
| Network Equipment Boot Loader | Medical Diagnostic Imaging System |
Use Scenario: Storing bootloader, FPGA bitstreams, and network stack binaries in enterprise switches and routers where field upgrades must be fail-safe. IC Role / Device Role / Timing Role: Secure, high-reliability boot memory supporting dual-image redundancy and CRC-verified load sequences. Use Value: 100,000 erase cycles and 20-year retention guarantee multi-generational platform reuse; OTP SSR regions protect cryptographic keys and MAC addresses. | Use Scenario: Storing FDA-cleared diagnostic firmware and calibration profiles in portable ultrasound and MRI control units requiring traceable data integrity. IC Role / Device Role / Timing Role: Certified non-volatile memory for Class II medical device firmware with audit-ready ECC logging and sector-lock protection. Use Value: Factory-locked SSR0 and password-protected SSR3 enforce secure boot chain; automatic ECC reporting satisfies IEC 62304 SW safety requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFB020 | Same density and architecture but uses 64-ball LAE BGA (9 mm × 9 mm); lacks OTP array and SSR protection | Targeted at space-constrained consumer electronics; not qualified for automotive or medical use | Select only when board layout requires BGA and security features are unnecessary |
| MX29GL512FPTI-90G | Micron equivalent with identical 512 Mb density, 100 ns access, and CFI compliance; no hardware ECC or OTP array | Used in cost-sensitive industrial gateways; requires external ECC implementation for safety-critical use | Choose when lower unit cost outweighs built-in ECC and secure OTP needs |
Compared with S29GL512S11TFB020 and MX29GL512FPTI-90G, the S29GL512T11FHB023 uniquely delivers integrated ECC, four-region OTP security, and AEC-Q100 Grade 2 qualification - making it the only option suitable for functional-safety firmware storage without external error-handling logic.
Availability
S29GL512T11FHB023 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, and network equipment boot loaders requiring stable component supply, long-term lifecycle support, and AEC-Q100 compliance.
Supply support for S29GL512T11FHB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, automotive MCUs, and trusted security solutions, with global manufacturing and R&D infrastructure.
The GL-T family targets high-reliability embedded systems requiring XIP-capable flash with industrial and automotive temperature grades, robust data integrity, and legacy parallel bus compatibility.
FAQ
Does S29GL512T11FHB023 support both ×8 and ×16 data bus modes?
Yes. The device automatically detects bus width via the BYTE# pin state at power-on reset: BYTE# high selects ×16 mode (DQ0–DQ15 active), BYTE# low selects ×8 mode (DQ0–DQ7 active). This dual-mode flexibility allows reuse across 8-bit and 16-bit microcontroller platforms without hardware redesign.
What is the function of the SSR0–SSR3 OTP regions?
SSR0–SSR3 are four 2048-byte one-time-programmable arrays. SSR0 is factory-locked and stores device-specific identifiers; SSR1–SSR2 are user-lockable for calibration data or serial numbers; SSR3 is password-protected for cryptographic keys. Once locked, OTP regions cannot be erased or rewritten.
How does hardware ECC operate during read cycles?
Hardware ECC runs transparently on every read access: the device checks each 512-byte sector for single-bit errors and corrects them in real time before data reaches the bus. Corrected reads return status via the Status Register (bit 6), and uncorrectable multi-bit errors trigger RY/BY# assertion and status flag setting.
Is the TSOP-56 package RoHS and REACH compliant?
Yes. S29GL512T11FHB023 in TSOP-56 packaging meets RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006, with lead-free terminations and halogen-free molding compound. Full compliance documentation is available under Infineon's material declaration ID 002-00247 Rev. *M.
S29GL512T11FHB023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL512T11FHB023 FAQ
1.How can I place an order for S29GL512T11FHB023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11FHB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11FHB023 reliable?
The price and inventory of S29GL512T11FHB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11FHB023 is usually 5 days.
3.What payment methods are accepted for S29GL512T11FHB023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11FHB023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11FHB023?
S29GL512T11FHB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11FHB023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11FHB023?
For technical support, including S29GL512T11FHB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11FHB023 requirements.
6.How does Aetrix verify that S29GL512T11FHB023 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11FHB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11FHB023 meets industry standards.
7.What is the process for return or replacement of S29GL512T11FHB023?
All S29GL512T11FHB023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11FHB023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11FHB023 part is unused and in its original packaging.
Return procedure for S29GL512T11FHB023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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