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Infineon Technologies S29GL512T11FHIV13
- Part No.:
- S29GL512T11FHIV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T11FHIV13.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,364
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Product details
Overview
S29GL512T11FHIV13 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C) in 56-pin TSOP package. It serves as non-volatile program storage in boot code execution and firmware update subsystems of industrial controllers.
For engineers reviewing the S29GL512T11FHIV13 datasheet, S29GL512T11FHIV13 pinout, S29GL512T11FHIV13 application, or S29GL512T11FHIV13 equivalent, key selection criteria include verified 100,000 program/erase cycles, 20-year data retention, CFI-compliant interface, OTP array with four lockable SSR regions, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages all program and erase operations-including buffer programming up to 512 bytes-and integrates automatic status monitoring via Status Register, Data Polling, and RY/BY# pin.
The architecture includes dedicated address space overlays for Device ID/CFI, Status Register, SSR (OTP), ECC status, and sector protection control. Versatile I/O allows VIO from 1.65 V to VCC, enabling interoperability with mixed-voltage host systems while maintaining full functionality across industrial temperature grades.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - fixed capacity for boot image and firmware storage in resource-constrained embedded hosts |
| Random access time | 100 ns at –40°C to +85°C - enables direct XIP execution without external cache penalty |
| Page access time | 15 ns - accelerates sequential instruction fetch during burst read sequences |
| Write buffer size | 512 bytes - reduces effective programming time by batching writes into single embedded operations |
| ECC capability | Internal hardware single-bit error correction - maintains data integrity without software overhead |
| Endurance | 100,000 program/erase cycles - supports field-updatable firmware with long service life |
| Data retention | 20 years - ensures reliable operation over full product lifecycle without refresh |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), standard JEDEC MO-141AC footprint, 20.0 mm × 10.16 mm × 1.2 mm height, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address inputs | 21-bit address bus supporting full 512-Mb linear addressing with byte/word boundary alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 or ×16 mode per configuration register setting |
| CE# | Chip enable | Active-low chip select; controls device power state and enables internal logic only when asserted |
| OE# | Output enable | Active-low read strobe; gates output drivers without affecting internal state or timing |
| WE# | Write enable | Active-low write strobe; initiates command latching or data loading during program/erase cycles |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation; used for hardware flow control |
| VCC | Core supply | 2.7 V to 3.6 V single supply powering core logic, memory array, and EAC |
| VIO | I/O supply | 1.65 V to VCC versatile I/O voltage - decouples interface voltage from core supply |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | On-die single-bit error correction with no CPU intervention - preserves deterministic timing in safety-critical boot paths |
| 512-byte write buffer | Enables full-page programming in one command sequence - cuts average programming latency by >60% vs. byte-by-byte writes |
| Uniform 128-KB sectors | 64 identical erase blocks simplifying partitioning for bootloader, kernel, and application firmware images |
| Four-lockable OTP regions (SSR0–SSR3) | SSR0 factory-locked for secure boot keys; SSR3 password-protected for customer-specific calibration data |
| Suspend/Resume for program & erase | Allows high-priority read access during long-duration erase - critical for real-time interrupt response |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing boot loader and runtime firmware in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 100 ns read access for hard real-time task initialization. Use Value: Eliminates need for external SRAM caching; supports field updates via sector-erase without disrupting operational continuity. | Use Scenario: Holding calibrated display graphics and safety-critical startup routines in automotive digital instrument clusters meeting AEC-Q100 Grade 3. IC Role / Device Role / Timing Role: Primary boot memory with hardware ECC ensuring integrity of safety-related code before MCU handoff. Use Value: Meets ASIL-B functional safety requirements through on-die error correction and 20-year retention under thermal cycling. |
| Medical Imaging System Configuration | Telecom Base Station FPGA Bitstream Storage |
Use Scenario: Retaining calibration tables and device-specific configuration parameters in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Secure, long-life parameter storage using OTP SSR regions for tamper-resistant calibration data. Use Value: Prevents unauthorized modification of medical device settings via hardware-enforced SSR3 password protection. | Use Scenario: Storing reconfigurable FPGA bitstreams in 5G baseband units requiring fast parallel load and field upgrade capability. IC Role / Device Role / Timing Role: High-speed parallel configuration memory with 15 ns page access enabling sub-millisecond FPGA startup. Use Value: Reduces system boot time by >40% compared to serial SPI flash alternatives while supporting hot-swap firmware updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11FHIV10 | Same density and package but uses older 65-nm process; 110 ns random access; no hardware ECC | Lacks on-die ECC and has lower endurance (10,000 cycles); unsuitable for safety-critical boot paths | Select only for cost-sensitive legacy designs where ECC and extended endurance are not required |
| MX29GL512FHT2I-11G | 512 Mb parallel NOR flash; 110 ns access; 64-ball FBGA; supports CFI but no OTP array or suspend/resume | No SSR regions or hardware suspend capability; limited to basic firmware storage without secure calibration support | Choose when board layout requires BGA footprint and advanced security features are unnecessary |
Compared with S29GL512S11FHIV10 and MX29GL512FHT2I-11G, the S29GL512T11FHIV13 delivers superior reliability via hardware ECC and higher endurance, plus secure OTP storage-making it uniquely suited for safety-aware and field-upgradable embedded systems.
Availability
S29GL512T11FHIV13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical imaging system configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T11FHIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and automotive markets.
The GL-T family targets high-reliability embedded systems needing fast XIP-capable flash with integrated data integrity and secure configuration storage - optimized for boot code, firmware, and calibration data retention.
FAQ
What is the maximum operating temperature range supported by S29GL512T11FHIV13?
The S29GL512T11FHIV13 is rated for the industrial temperature range of –40°C to +85°C. This rating is confirmed in the datasheet's "Temperature range / grade" section and applies to all electrical and timing specifications including 100 ns random access time and 100,000 program/erase cycles.
Does S29GL512T11FHIV13 support both ×8 and ×16 data bus configurations?
Yes, the device supports configurable ×8 (byte) or ×16 (word) operation via internal configuration registers. The data bus width is determined during initialization and affects address mapping - DQ0–DQ7 are used in ×8 mode, while DQ0–DQ15 operate in ×16 mode, as defined in Section 1 of the datasheet.
How does the hardware ECC function during normal read operations?
Hardware ECC operates transparently during every read access: single-bit errors in retrieved data are automatically corrected in real time, and the corrected data is delivered to the host. No software polling or command issuance is required - correction occurs within the device's internal path before data reaches the DQ pins.
Can the OTP array (SSR) be reprogrammed after initial programming?
No - the 2048-byte OTP array consists of four lockable regions (SSR0–SSR3), each permanently programmable once. SSR0 is factory-locked and cannot be modified; SSR3 supports password-based read protection but remains write-once. Reprogramming any SSR region is physically impossible after programming, as confirmed in Section 3.3 of the datasheet.
S29GL512T11FHIV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL512T11FHIV13 FAQ
1.How can I place an order for S29GL512T11FHIV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11FHIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11FHIV13 reliable?
The price and inventory of S29GL512T11FHIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11FHIV13 is usually 5 days.
3.What payment methods are accepted for S29GL512T11FHIV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11FHIV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11FHIV13?
S29GL512T11FHIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11FHIV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11FHIV13?
For technical support, including S29GL512T11FHIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11FHIV13 requirements.
6.How does Aetrix verify that S29GL512T11FHIV13 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11FHIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11FHIV13 meets industry standards.
7.What is the process for return or replacement of S29GL512T11FHIV13?
All S29GL512T11FHIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11FHIV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11FHIV13 part is unused and in its original packaging.
Return procedure for S29GL512T11FHIV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T11FHIV13 Tags
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M24C02-WMN6TP
STMicroelectronics
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Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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STMicroelectronics
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Microchip Technology
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Microchip Technology
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