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Infineon Technologies S29GL512T11FHIV23
- Part No.:
- S29GL512T11FHIV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T11FHIV23.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,170
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Product details
Overview
S29GL512T11FHIV23 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring deterministic XIP execution.
For engineers reviewing the S29GL512T11FHIV23 datasheet, S29GL512T11FHIV23 pinout, S29GL512T11FHIV23 application, or S29GL512T11FHIV23 equivalent, key selection criteria include parallel ×16 bus interface, 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI compliance, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages all program and erase operations-including buffer programming up to 512 bytes-and integrates automatic status monitoring via Status Register, Data Polling, and RY/BY# pin.
The architecture includes dedicated address space overlays (ASOs) for Device ID/CFI, Status Register, ECC status, and Sector Protection Control (SSR), enabling robust firmware update and secure boot partitioning. Hardware ECC operates transparently during read cycles without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full boot image + firmware + configuration tables in resource-constrained controllers |
| Interface type | Parallel ×16 (also supports ×8) - enables direct connection to legacy microcontroller address/data buses without glue logic |
| Random access time | 100 ns at –40°C to +85°C - meets real-time boot latency requirements for industrial PLCs and HMI systems |
| Write buffer size | 512 bytes - reduces effective programming time by batching writes, critical for field firmware updates |
| ECC capability | Internal hardware single-bit error correction - ensures data integrity over 20-year retention without software overhead |
| Endurance | 100,000 program/erase cycles - supports frequent OTA updates in edge gateway applications |
| Operating temp | –40°C to +85°C (Industrial grade) - qualified for deployment in uncontrolled ambient environments |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb addressing with byte/word boundary alignment |
| DQ0–DQ15 | Data I/O (×16 mode) | Bidirectional 16-bit data path; configurable for ×8 mode using DQ0–DQ7 only |
| CE# | Chip enable | Active-low chip select; tCE = 100 ns max - defines minimum chip activation delay in multi-device systems |
| OE# | Output enable | Active-low read strobe; tOE = 25 ns max - controls data valid window timing relative to address setup |
| WE# | Write enable | Active-low write strobe; initiates command latching and embedded program/erase sequences |
| RY/BY# | Ready/Busy output | Open-drain status indicator; low during active program/erase - enables hardware polling without CPU intervention |
| VCC | Core supply | 2.7 V to 3.6 V single supply - eliminates need for separate I/O voltage rail in 3.3 V systems |
| VIO | I/O supply | 1.65 V to VCC - supports mixed-voltage interfacing with 1.8 V or 3.3 V controllers |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - enables interoperability with both 1.8 V and 3.3 V host processors without level shifters |
| 512-byte programming buffer | Reduces average programming time per byte by >3× vs. single-word writes - accelerates firmware field updates |
| Hardware ECC engine | Single-bit correction applied automatically on every read - eliminates need for external error-handling firmware |
| Four-lockable OTP sectors (SSR0–SSR3) | SSR0 factory-locked, SSR3 password-protected - allows secure storage of keys, calibration data, and boot loader signatures |
| CFI-compliant parameter table | Enables OS-agnostic auto-detection and driver initialization - simplifies integration into Linux/U-Boot and RTOS environments |
Applications
| Industrial PLC Boot Memory | Medical Imaging Controller Firmware Storage |
|---|---|
Use Scenario: Stores boot loader, real-time OS kernel, and motion control firmware in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Parallel NOR flash providing XIP-capable boot memory with deterministic 100 ns read latency and sector-level erase granularity. Use Value: Enables cold-start execution within <500 ms while supporting secure firmware updates via protected OTP regions and ECC-verified reads. | Use Scenario: Holds FPGA configuration bitstreams and diagnostic application binaries in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Non-volatile storage with 20-year data retention and AEC-Q100-grade reliability - used for mission-critical configuration persistence. Use Value: Guarantees bitstream integrity across thermal cycling and power loss events via hardware ECC and 100K-cycle endurance. |
| Automotive ADAS Camera Module | Energy Meter Firmware Vault |
Use Scenario: Stores camera ISP firmware and calibration parameters in rear-view and surround-view modules operating at –40°C to +105°C. IC Role / Device Role / Timing Role: Automotive-grade (AEC-Q100 Grade 2) parallel flash with suspend/resume during program/erase - maintains system responsiveness during over-the-air updates. Use Value: Allows safe firmware patching without interrupting video stream processing, leveraging RY/BY# pin for hardware synchronization. | Use Scenario: Secures metrology firmware, tariff tables, and cryptographic keys in ANSI C12.22-compliant smart electricity meters. IC Role / Device Role / Timing Role: OTP-protected flash with four lockable SSR regions - used for tamper-resistant storage of security credentials and billing logic. Use Value: Prevents unauthorized modification of billing algorithms through hardware-enforced write protection and password-locked SSR3. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11FHIV20 | Same density and package, but uses older 65-nm process; 110 ns random access; no Versatile I/O (VIO fixed to VCC) | Lacks VIO flexibility and has slower access; suitable only where 1.8 V host interfacing is not required | Select when cost sensitivity outweighs performance and voltage flexibility needs |
| MX29GL512FHI-11G | Macronix equivalent; same 512 Mb, 100 ns, ×16 interface; supports CFI but lacks integrated OTP lock regions and hardware ECC | Requires external ECC handling and software-based sector locking - increases firmware complexity | Choose only if Infineon-specific features (OTP, ECC, ASP) are not required in the design |
Compared with S29GL512S11FHIV20 and MX29GL512FHI-11G, the S29GL512T11FHIV23 delivers superior voltage flexibility, built-in ECC, and hardware-enforced OTP security-making it optimal for safety-critical and long-lifecycle embedded systems where firmware integrity and update resilience are mandatory.
Availability
S29GL512T11FHIV23 is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging controllers, automotive ADAS camera modules, and smart energy meters requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T11FHIV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The GL-T family was designed specifically for high-reliability embedded systems needing fast XIP execution, secure firmware storage, and long-term data retention - targeting boot memory and firmware vault use cases in harsh environments.
FAQ
Is S29GL512T11FHIV23 pin-compatible with earlier S29GL512P or S29GL512N variants?
No. The S29GL512T uses a revised pinout optimized for Versatile I/O and enhanced ECC routing. Key differences include relocated VIO and RY/BY# pins, and removal of the BYTE# pin. Migration requires PCB layout revision and updated timing constraints in the host controller's memory interface.
Does this device support Quad SPI or other serial interfaces?
No. S29GL512T11FHIV23 is strictly a parallel-interface NOR flash with ×8/×16 bus support. It does not implement SPI, QSPI, or any serial protocol. For serial NOR alternatives, consider Infineon's Semper™ family (e.g., S26KL512SDPBH200), which offers different architecture and feature sets.
How is the 2048-byte OTP array organized and accessed?
The OTP array consists of four 512-byte sectors (SSR0–SSR3), each independently lockable via command sequence. SSR0 is permanently locked at factory; SSR3 supports password-based read protection. Access occurs through dedicated CFI ASO addresses (0x0000–0x07FF), and writes require specific unlock sequences followed by sector-specific program commands.
What is the impact of enabling hardware ECC on read performance?
Hardware ECC adds no measurable latency to read operations. Error detection and correction occur transparently in parallel with data output; the 100 ns tACC specification includes full ECC processing. No additional wait states or software overhead are introduced, preserving deterministic XIP execution timing.
S29GL512T11FHIV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL512T11FHIV23 FAQ
1.How can I place an order for S29GL512T11FHIV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11FHIV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11FHIV23 reliable?
The price and inventory of S29GL512T11FHIV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11FHIV23 is usually 5 days.
3.What payment methods are accepted for S29GL512T11FHIV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11FHIV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11FHIV23?
S29GL512T11FHIV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11FHIV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11FHIV23?
For technical support, including S29GL512T11FHIV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11FHIV23 requirements.
6.How does Aetrix verify that S29GL512T11FHIV23 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11FHIV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11FHIV23 meets industry standards.
7.What is the process for return or replacement of S29GL512T11FHIV23?
All S29GL512T11FHIV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11FHIV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11FHIV23 part is unused and in its original packaging.
Return procedure for S29GL512T11FHIV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T11FHIV23 Tags
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