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Infineon Technologies S29GL512T11FHIV33
- Part No.:
- S29GL512T11FHIV33
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T11FHIV33.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,658
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Product details
Overview
S29GL512T11FHIV33 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sectors, and supports industrial temperature range (–40°C to +85°C). Used in boot code storage for industrial controllers requiring deterministic XIP execution.
For engineers reviewing the S29GL512T11FHIV33 datasheet, S29GL512T11FHIV33 pinout, S29GL512T11FHIV33 application, or S29GL512T11FHIV33 equivalent, key selection criteria include parallel ×16 bus interface, Versatile I/O (1.65 V to VCC), sector erase reliability, OTP array security, and AEC-Q100 grade 3 qualification status.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing, supporting both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations without external microcontroller intervention.
The internal hardware ECC engine performs real-time single-bit error correction during read cycles, while the Common Flash Interface (CFI) table enables host software to auto-detect device geometry and command set. Sector protection uses volatile and non-volatile lock bits per 128-KB block, plus four 2048-byte OTP regions with factory-locked SSR0 and password-protected SSR3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full firmware images and parameter tables in industrial HMI and PLCs |
| Interface type | Asynchronous parallel ×16 - enables direct CPU bus connection without translation logic |
| Random access time | 100 ns at –40°C to +85°C - meets real-time boot latency requirements for ARM Cortex-M7-based systems |
| Write buffer size | 512 bytes - reduces effective programming time by up to 4× vs. single-word writes |
| ECC capability | Single-bit correction per 512-byte sector - ensures data integrity over 20-year retention without SW overhead |
| Endurance | 100,000 program/erase cycles - supports field firmware updates in telecom baseband modules |
| Operating voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - allows interfacing with 1.8 V/3.3 V SoCs without level shifters |
| Temperature grade | Industrial (–40°C to +85°C) - qualified for deployment in uncooled control cabinets and outdoor gateways |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AC footprint with 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb decoding; A0 selects byte/word mode when configured for ×8 operation |
| DQ0–DQ15 | Data I/O bus | 16-bit bidirectional data path; operates in either ×8 (DQ0–DQ7) or ×16 mode per configuration register setting |
| CE# | Chip enable | Active-low chip select; must be stable ≥100 ns before address setup for valid read access |
| OE# | Output enable | Controls output drivers during read; tOE = 25 ns max defines minimum data hold window |
| WE# | Write enable | Initiates write/program cycles; latches command sequences on rising edge when CE# and OE# are high |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operations; used for polling instead of status register reads |
| RESET# | Hardware reset | Asynchronous reset input that forces device into standby mode and clears internal state machines |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage | VIO range 1.65 V to VCC enables direct interfacing with mixed-voltage SoCs (e.g., 1.8 V core / 3.3 V I/O) |
| 512-byte write buffer | Reduces average programming time to ≤450 μs per 512-byte block, improving firmware update throughput |
| Hardware ECC engine | Corrects single-bit errors on-the-fly during read; eliminates need for software-based BCH or Hamming routines |
| OTP array with SSR locking | 2048-byte one-time-programmable space partitioned into four lockable regions, enabling secure key storage and calibration data |
| Suspend/resume capability | Allows interrupting erase or program operations to service higher-priority reads, critical for real-time OS environments |
| CFI compliance | Standardized parameter table allows automatic detection and configuration by bootloader or flash utility tools |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader, RTOS kernel, and safety-critical application code in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency. Use Value: Ensures deterministic startup within 500 ms after power-on, supported by 100,000-cycle endurance for field firmware patches. |
Use Scenario: Holding boot firmware and sensor calibration data for radar ECU modules operating in automotive grade 3 environment (–40°C to +85°C). IC Role / Device Role / Timing Role: AEC-Q100 qualified parallel NOR flash serving as primary boot source for TI Jacinto 7 SoC. Use Value: Hardware ECC and OTP SSR3 password protection meet ISO 26262 ASIL-B data integrity requirements. |
| Telecom Base Station Configuration | Medical Imaging System Parameter Storage |
Use Scenario: Retaining FPGA configuration bitstreams and radio parameter sets in 5G small cell base stations requiring hot-swap firmware updates. IC Role / Device Role / Timing Role: High-reliability configuration store supporting suspend/resume during live traffic periods. Use Value: 512-byte buffer enables sub-millisecond reprogramming of radio profiles without service interruption. |
Use Scenario: Storing DICOM metadata templates, calibration coefficients, and regulatory audit logs in FDA-cleared MRI console systems. IC Role / Device Role / Timing Role: Secure, long-retention (20 years) non-volatile memory with locked OTP region for immutable calibration records. Use Value: SSR0 factory lock prevents accidental overwrite of factory calibration data during field servicing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFIV33 | Same density and package but uses older 65-nm process; 110 ns random access, no Versatile I/O (VIO fixed at VCC) | Lacks 1.65 V I/O compatibility; unsuitable for mixed-voltage SoC designs | Select only if legacy board reuse requires identical timing margins and no low-VIO support needed |
| MX29GL512FHI-11G | Micron equivalent with same 512 Mb density, 100 ns access, but no integrated ECC or OTP array | Requires external ECC implementation and lacks secure key storage capability | Choose when cost sensitivity outweighs built-in data integrity and security features |
Compared with S29GL512S11TFIV33 and MX29GL512FHI-11G, the S29GL512T11FHIV33 uniquely combines Versatile I/O, on-die ECC, and OTP-based security in a single industrial-grade package-enabling simplified BOMs and reduced firmware validation effort.
Availability
S29GL512T11FHIV33 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and telecom base station configuration requiring stable component supply across extended lifecycle programs.
Supply support for S29GL512T11FHIV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and non-volatile memory solutions, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing fast XIP execution and robust data storage, combining NOR flash speed with NAND-like density and advanced data protection features.
FAQ
Is S29GL512T11FHIV33 pin-compatible with earlier S29GL512P variants?
No. The S29GL512T11FHIV33 uses a 56-pin TSOP package with updated signal assignments including dedicated RY/BY# and RESET# pins not present in the legacy S29GL512P series. Board-level redesign is required due to differing pinout, voltage tolerance, and command set extensions like suspend/resume.
Does this device support synchronous burst read mode?
No. The S29GL512T11FHIV33 is strictly asynchronous and does not implement clocked interfaces or burst addressing. All read operations use CE#, OE#, and address setup/hold timing defined in the AC characteristics table; page read is asynchronous with 15 ns tPACC.
Can the OTP array be reprogrammed after initial write?
No. The 2048-byte OTP array is physically one-time programmable. Once any bit is programmed from '1' to '0', it cannot be reversed. SSR0 is factory-locked and permanently read-only; SSR3 supports password-controlled read access but no rewrites.
What is the maximum sustained write bandwidth using the 512-byte buffer?
At –40°C to +85°C, the device achieves 1.14 MBps sustained programming rate for 512-byte buffer writes, translating to ~447 μs per buffer fill. This assumes optimal command sequencing and no suspend interruptions; actual system-level throughput depends on host bus arbitration and address setup overhead.
S29GL512T11FHIV33 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (13x11)
S29GL512T11FHIV33 FAQ
1.How can I place an order for S29GL512T11FHIV33 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11FHIV33 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11FHIV33 reliable?
The price and inventory of S29GL512T11FHIV33 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11FHIV33 is usually 5 days.
3.What payment methods are accepted for S29GL512T11FHIV33?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11FHIV33 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11FHIV33?
S29GL512T11FHIV33 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11FHIV33 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11FHIV33?
For technical support, including S29GL512T11FHIV33 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11FHIV33 requirements.
6.How does Aetrix verify that S29GL512T11FHIV33 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11FHIV33 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11FHIV33 meets industry standards.
7.What is the process for return or replacement of S29GL512T11FHIV33?
All S29GL512T11FHIV33 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11FHIV33, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11FHIV33 part is unused and in its original packaging.
Return procedure for S29GL512T11FHIV33:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T11FHIV33 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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