Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512T11TFB020

Name: S29GL512T11TFB020
Brand: Infineon Technologies
SKU: S29GL512T11TFB020
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29GL512T11TFB020

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL512T11TFB020.pdf

Description:: IC FLASH 512MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:1,994

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29GL512T11TFB020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring deterministic XIP execution.

For engineers reviewing the S29GL512T11TFB020 datasheet, S29GL512T11TFB020 pinout, S29GL512T11TFB020 application, or S29GL512T11TFB020 equivalent, key selection criteria include asynchronous parallel interface timing, OTP array configuration, sector protection granularity, and automotive-grade thermal qualification.

Technical Context

This device implements an asynchronous parallel interface with ×8/×16 data bus support and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations without external microcode.

The internal hardware ECC engine corrects single-bit errors on-the-fly during read cycles, and the Common Flash Interface (CFI) table enables host software to auto-detect device geometry and command set. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods per 128-KB sector.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory density	512 Mb (64 MB), enabling full firmware image storage for mid-tier microcontrollers
Random access time	100 ns at –40°C to +85°C, supporting real-time XIP execution in industrial PLCs
Page access time	15 ns, accelerating sequential instruction fetch in boot ROM applications
Write buffer size	512 bytes, reducing effective programming time by up to 4× vs. single-word writes
ECC capability	Single-bit error correction per 512-byte sector, ensuring data integrity without host intervention
Operating voltage	VCC = 2.7 V to 3.6 V, compatible with 3.3 V logic rails and brown-out tolerant systems
Temperature grade	Industrial (–40°C to +85°C), qualified for factory automation and motor drive control units
Endurance & retention	100,000 program/erase cycles and 20-year data retention, meeting long-lifecycle embedded requirements

Pinout & Package

Package: 64-ball LAE fortified BGA (9 mm × 9 mm), RoHS-compliant, lead-free, with 0.8 mm ball pitch.

Pin/Terminal	Circuit Role	Design Meaning
A0–A21	Address inputs	22-bit address bus supporting full 512 Mb linear addressing (byte/word mode)
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; operates as 8-bit in byte mode via BYTE# control
CE#	Chip enable	Active-low chip select; device enters standby when high, enabling multi-chip memory expansion
OE#	Output enable	Controls output drivers during read; allows shared data bus with other peripherals
WE#	Write enable	Initiates write/program/erase commands; latches address and data on rising edge
RY/BY#	Ready/Busy indicator	Open-drain status signal; low during embedded operations, enabling polling-free interrupt-driven flow
RESET#	Hardware reset	Asynchronous active-low reset that aborts ongoing operations and returns device to read mode
VIO	I/O supply	Independent 1.65 V to VCC I/O voltage rail, enabling interfacing with mixed-voltage SoCs

Key Features

Feature	Design Value
Versatile I/O (VIO)	Separate 1.65 V–VCC I/O supply allows direct connection to 1.8 V, 2.5 V, or 3.3 V host interfaces without level shifters
512-byte write buffer	Enables burst programming of up to 512 bytes per command, cutting typical firmware update time by >70% vs. legacy flash
Hardware ECC	On-die single-bit error correction eliminates need for host-side ECC logic and reduces firmware overhead
OTP array (2048 B)	Four lockable SSR regions (SSR0–SSR3) provide secure storage for keys, calibration data, and boot configuration
Advanced sector protection	Volatile and non-volatile locking per 128-KB sector prevents accidental erase/write during field firmware updates

Applications

Industrial PLC Boot Memory

Motor Drive Firmware Storage

Use Scenario: Stores boot loader and real-time control firmware in programmable logic controllers deployed in factory environments.

IC Role / Device Role / Timing Role: Non-volatile boot ROM providing deterministic XIP execution with ≤100 ns latency for safety-critical motion control loops.

Use Value: Hardware ECC ensures firmware integrity over 20 years of operation without periodic verification, reducing maintenance downtime.

Use Scenario: Holds motor control algorithms and parameter tables in servo drives operating at ambient temperatures up to +85°C.

IC Role / Device Role / Timing Role: Parallel flash memory mapped into CPU address space for zero-wait-state instruction fetch during torque loop execution.

Use Value: 15 ns page access time accelerates initialization of PID coefficients and lookup tables at power-on.

Medical Imaging System BIOS

Energy Meter Secure Configuration

Use Scenario: Stores diagnostic BIOS and calibration firmware in portable ultrasound devices requiring AEC-Q100–compliant components.

IC Role / Device Role / Timing Role: Industrial Plus grade (–40°C to +105°C) flash used for cold-start firmware load before FPGA configuration.

Use Value: OTP array (SSR3 password-protected) secures device-specific calibration constants against tampering or cloning.

Use Scenario: Retains tariff schedules, metering keys, and regulatory compliance flags in smart electricity meters certified to IEC 62056.

IC Role / Device Role / Timing Role: Sector-protected flash storing critical configuration data with non-volatile lock bits preventing overwrite during firmware upgrades.

Use Value: 100,000 erase cycles support 10+ years of scheduled firmware updates without wear-out risk.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S11TFB020	Same density and package, but uses older 65-nm process; 110 ns random access, no VIO support	Lacks versatile I/O and hardware ECC; requires external level shifting for 1.8 V hosts	Select only if cost sensitivity outweighs reliability and interface flexibility needs
MX29GL512FHT2I-90G	512 Mb, 90 ns access, 3.3 V only, no OTP array or hardware ECC	No built-in security features; limited to basic firmware storage without integrity assurance	Choose for legacy designs where CFI compatibility is sufficient and ECC is handled externally

Compared with S29GL512S11TFB020 and MX29GL512FHT2I-90G, the S29GL512T11TFB020 delivers superior system-level reliability through integrated ECC, wider voltage interoperability via VIO, and secure configuration storage via OTP-reducing BOM count and firmware validation effort.

Availability

S29GL512T11TFB020 is available at Aetrix Electronics and suitable for industrial PLC boot memory, motor drive firmware storage, and medical imaging system BIOS requiring stable component supply across extended product lifecycles.

Supply support for S29GL512T11TFB020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.

The GL-T family targets high-reliability embedded systems needing fast, secure, and long-life parallel NOR flash for boot code and firmware storage in harsh thermal environments.

FAQ

Is S29GL512T11TFB020 pin-compatible with earlier S29GL512P or S29GL512S variants?

No. S29GL512T11TFB020 uses a 64-ball LAE BGA (9 mm × 9 mm), while S29GL512P uses 56-pin TSOP and S29GL512S uses 64-ball LAA BGA (13 mm × 11 mm). Ball pitch, footprint, and signal mapping differ; PCB redesign is required for migration.

Does the hardware ECC correct errors during program or erase operations?

No. The internal ECC engine operates only during read cycles to detect and correct single-bit errors in stored data. It does not validate or repair data during programming or erasing; those operations rely on verify algorithms and status register reporting.

Can the OTP array be reprogrammed after initial programming?

Only SSR0 is factory-locked and permanently read-only. SSR1–SSR3 can be programmed once per region and then locked via non-volatile bits. Once locked, they cannot be unlocked or rewritten-ensuring permanent storage of keys or calibration data.

What is the minimum VIO voltage supported for reliable operation?

The device guarantees full functionality down to VIO = 1.65 V across the industrial temperature range. Below this, timing margins degrade and data integrity is not assured; operation at 1.6 V or lower is outside specification and unsupported.

S29GL512T11TFB020 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-T

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 64M x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 105°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL512T11TFB020 FAQ

1.How can I place an order for S29GL512T11TFB020 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512T11TFB020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512T11TFB020 reliable?

The price and inventory of S29GL512T11TFB020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11TFB020 is usually 5 days.

3.What payment methods are accepted for S29GL512T11TFB020?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11TFB020 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512T11TFB020?

S29GL512T11TFB020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512T11TFB020 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512T11TFB020?

For technical support, including S29GL512T11TFB020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11TFB020 requirements.

6.How does Aetrix verify that S29GL512T11TFB020 is sourced from the original manufacturer or authorized distributors?

All S29GL512T11TFB020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11TFB020 meets industry standards.

7.What is the process for return or replacement of S29GL512T11TFB020?

All S29GL512T11TFB020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11TFB020, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512T11TFB020 part is unused and in its original packaging.

Return procedure for S29GL512T11TFB020:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

2026-07-06 Voltage Regulator: Types, Circuits, Testing and Selection Guide

Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

2026-06-30 Amplifiers Explained: Types, Circuits, Gain, Classes and Applications

Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

2026-06-27 Machine Vision System: Components, Inspection Applications and Integration Guide

Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…

2026-06-23 Electronic Devices and Circuits: Fundamentals, Components and Applications

Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…