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Infineon Technologies S29GL512T11TFB023
- Part No.:
- S29GL512T11TFB023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512T11TFB023.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,025
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Product details
Overview
S29GL512T11TFB023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, internal single-bit ECC, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers requiring fast XIP execution and reliable firmware retention.
For engineers reviewing the S29GL512T11TFB023 datasheet, S29GL512T11TFB023 pinout, S29GL512T11TFB023 application, or S29GL512T11TFB023 equivalent, this device delivers deterministic read latency, hardware-assisted error correction, sector-level protection, and versatile I/O voltage support (1.65 V to VCC) critical for legacy parallel bus embedded systems.
Technical Context
The S29GL512T11TFB023 implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations without external timing control.
It integrates hardware ECC for single-bit error correction and uses Common Flash Interface (CFI) parameter tables for host software identification. Sector protection includes volatile and non-volatile methods per 128-KB sector, plus a 2048-byte OTP array with four lockable regions (SSR0–SSR3), where SSR0 is factory-locked and SSR3 supports password-based read protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full boot image + firmware + configuration in industrial controllers |
| Random access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution without cache penalty |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot initialization |
| Write buffer size | 512 bytes - reduces average programming time by batching up to 256 words per command |
| ECC capability | Internal hardware single-bit correction - eliminates need for external ECC logic in safety-critical systems |
| Endurance & retention | 100,000 program/erase cycles / 20-year data retention - meets long-life requirements for telecom infrastructure |
| Operating voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - interoperable with mixed-voltage 3.3 V/1.8 V system buses |
Pinout & Package
This device is packaged in a 64-ball LAE fortified BGA (9 mm × 9 mm), RoHS-compliant, with 0.8 mm ball pitch and standard JEDEC MO-270AB footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb linear addressing (byte/word aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; configurable as ×8 or ×16 via BYTE# signal |
| CE#, OE#, WE# | Chip Enable, Output Enable, Write Enable | Standard asynchronous control signals enabling glueless interface to legacy microcontrollers |
| RY/BY# | Ready/Busy output | Open-drain status indicator for polling during program/erase operations |
| VCC, VIO, GND | Power supplies | Separate core (VCC) and I/O (VIO) rails allow independent voltage scaling for noise isolation |
| RESET# | Hardware reset input | Asynchronous active-low reset that forces device into reading state and clears internal state |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - simplifies integration with 1.8 V or 3.3 V host processors without level shifters |
| Uniform 128-KB sector architecture | 512 sectors total - enables fine-grained firmware updates and secure partitioning of boot vs. application code |
| Suspend/Resume for program & erase | Allows interrupting long erase cycles to service high-priority reads - essential for real-time response in industrial HMIs |
| Advanced sector protection (ASP) | Volatile/non-volatile locking per sector - prevents accidental overwrite during field firmware upgrades |
| CFI-compliant interface | Enables automatic detection and configuration by BIOS/bootloader without hard-coded timing parameters |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers with extended temperature operation. IC Role / Device Role / Timing Role: Non-volatile boot memory providing deterministic 100 ns read access for XIP execution during cold start. Use Value: Eliminates external SRAM copy step; 20-year data retention ensures firmware integrity over equipment lifetime. | Use Scenario: Holding certified boot code and sensor calibration data in automotive camera modules compliant with AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Safety-critical boot memory with hardware ECC and sector lock to prevent unauthorized modification. Use Value: Meets ISO 26262 ASIL-B requirements through built-in error correction and write-protection granularity. |
| Telecom Base Station Control Plane | Medical Imaging System Configuration |
Use Scenario: Hosting FPGA configuration bitstreams and management firmware in LTE/5G remote radio units. IC Role / Device Role / Timing Role: High-reliability parallel flash with 100,000 erase cycles supporting frequent field upgrades. Use Value: Reduces downtime via suspend/resume during partial reconfiguration without halting baseband processing. | Use Scenario: Storing DICOM protocol stacks and regulatory-certified calibration profiles in portable ultrasound devices. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with OTP region (SSR3 password-protected) for audit logs. Use Value: Supports FDA 21 CFR Part 11 compliance via hardware-enforced write protection of critical configuration data. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFB023 | Same density and package, but uses older 65-nm process; 110 ns tACC vs. 100 ns | Lacks hardware ECC and has no OTP array; lower endurance (50K cycles) | Select only if cost sensitivity outweighs ECC requirement and lifecycle needs |
| MX29GL512FHI-11G | Macronix part; same 512 Mb, 100 ns tACC, but no built-in ECC and different CFI layout | Requires external error handling; lacks SSR OTP protection and ASP flexibility | Choose when migrating legacy designs with identical timing but no ECC dependency |
Compared with S29GL512S11TFB023 and MX29GL512FHI-11G, the S29GL512T11TFB023 provides superior reliability via integrated ECC and secure firmware update capability through its OTP and ASP features-critical for new designs targeting long-term maintenance and functional safety.
Availability
S29GL512T11TFB023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and telecom base station control plane applications requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T11TFB023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing deterministic parallel flash performance, combining XIP speed with data storage density and robust data integrity features for mission-critical firmware.
FAQ
Does S29GL512T11TFB023 support both ×8 and ×16 data bus modes?
Yes, it supports configurable ×8 or ×16 operation via the BYTE# pin. When BYTE# is low, the device operates in ×16 mode using DQ0–DQ15; when high, it operates in ×8 mode using DQ0–DQ7 only. This allows flexible integration with 8-bit or 16-bit microcontrollers without redesigning the PCB layout.
What is the function of the SSR OTP array and how is it secured?
The 2048-byte SSR OTP array contains four lockable regions (SSR0–SSR3). SSR0 is factory-locked and immutable; SSR3 supports password-based read protection. Once locked, SSR regions cannot be reprogrammed, ensuring permanent storage of security keys or calibration data resistant to field tampering.
How does the Ready/Busy# (RY/BY#) pin behave during embedded operations?
RY/BY# is an open-drain output that goes low during program or erase operations and returns high upon completion. It can be polled directly by the host processor or used with interrupts. Unlike status register polling, RY/BY# provides hardware-level timing certainty without requiring command overhead or bus arbitration delays.
Can S29GL512T11TFB023 operate across the full industrial temperature range without derating?
Yes, it is fully specified for –40°C to +85°C with no performance derating. All key parameters-including 100 ns tACC, 15 ns tPACC, and 100,000-cycle endurance-are guaranteed across this range. The datasheet also defines extended grades up to +125°C, but the TFB023 suffix denotes the industrial-grade variant with validated operation at full speed throughout the range.
S29GL512T11TFB023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512T11TFB023 FAQ
1.How can I place an order for S29GL512T11TFB023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11TFB023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11TFB023 reliable?
The price and inventory of S29GL512T11TFB023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11TFB023 is usually 5 days.
3.What payment methods are accepted for S29GL512T11TFB023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11TFB023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11TFB023?
S29GL512T11TFB023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11TFB023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11TFB023?
For technical support, including S29GL512T11TFB023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11TFB023 requirements.
6.How does Aetrix verify that S29GL512T11TFB023 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11TFB023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11TFB023 meets industry standards.
7.What is the process for return or replacement of S29GL512T11TFB023?
All S29GL512T11TFB023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11TFB023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11TFB023 part is unused and in its original packaging.
Return procedure for S29GL512T11TFB023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T11TFB023 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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AT24C08C-STUM-T
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