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Infineon Technologies S29GL512T11TFIV10
- Part No.:
- S29GL512T11TFIV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512T11TFIV10.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:583
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Product details
Overview
S29GL512T11TFIV10 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It integrates hardware ECC for single-bit correction, 128-KB uniform sector erase, and a 512-byte programming buffer-enabling fast embedded code execution and firmware storage in industrial control and automotive infotainment systems.
For engineers reviewing the S29GL512T11TFIV10 datasheet, S29GL512T11TFIV10 pinout, S29GL512T11TFIV10 application, or S29GL512T11TFIV10 equivalent, key selection criteria include verified 128-KB sector architecture, industrial-grade temperature range (–40°C to +85°C), TSOP-56 package compatibility, and CFI-compliant software interface for legacy boot loader integration.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus support and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC operations without host CPU intervention.
The versatile I/O feature enables independent VIO supply (1.65 V to VCC), allowing direct interfacing with 1.8 V or 3.3 V logic while maintaining full VCC operation for core functions. Status monitoring uses Ready/Busy#, Data Polling, and Status Register reads-supporting robust real-time operation in deterministic embedded environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - supports full firmware images for mid-tier microcontrollers and boot code storage in resource-constrained systems |
| Access Time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution from flash without external cache in real-time control applications |
| Page Access Time (tPACC) | 15 ns - accelerates sequential instruction fetch during burst read operations |
| Programming Buffer | 512 bytes - reduces effective programming time by up to 10× vs. single-word writes, critical for field firmware updates |
| ECC Support | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot memory paths |
| Sector Size | Uniform 128 KB sectors - simplifies partitioning for secure OTA update zones and bootloader/OS/application separation |
| Data Retention | 20 years - ensures long-term reliability in unattended industrial equipment and automotive ECUs |
| Endurance | 100,000 program/erase cycles - supports frequent firmware revision in test and calibration systems |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I, Type I), 14 mm × 20 mm, 0.55 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 512 Mb linear addressing; A0 selects byte/word mode when configured for ×8/×16 operation |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates in ×8 mode (DQ0–DQ7 active) or ×16 mode (all 16 bits active) per configuration |
| CE# | Chip Enable | Active-low enable controlling device selection; tCE = 100 ns max - defines minimum chip select assertion window for timing-critical boot sequences |
| OE# | Output Enable | Active-low control for data bus output drivers; tOE = 25 ns max - ensures clean read data valid window relative to clockless address setup |
| WE# | Write Enable | Active-low signal initiating internal program/erase algorithms; latches command sequences on rising edge after valid address/data setup |
| RY/BY# | Ready/Busy Output | Open-drain status indicator; low during embedded operations - used for polling-free interrupt-driven firmware update state management |
| VCC | Core Supply | 2.7 V to 3.6 V single supply powering core logic, memory array, and EAC - eliminates need for separate I/O rail in cost-sensitive designs |
| VIO | I/O Supply | 1.65 V to VCC - enables interoperability with mixed-voltage SoCs without level shifters, reducing BOM count |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC Engine | On-die single-bit error correction with no latency penalty - maintains deterministic boot timing and eliminates external ECC ICs in ASIL-B designs |
| 512-Byte Programming Buffer | Enables full-page programming in one command cycle - cuts firmware update time by >85% compared to byte-wise writes in production line flashing |
| Uniform 128-KB Sectors | Eliminates complex sector mapping logic in bootloader - allows identical erase routines across all sectors for simplified field update firmware |
| CFI-Compatible Interface | Standardized parameter table accessible via read commands - enables vendor-agnostic flash abstraction layers in RTOS-based systems |
| OTP Array (2048 B) | Four lockable SSR regions including factory-locked SSR0 - supports secure key storage and immutable bootloader signature verification |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing firmware and configuration data in programmable logic controllers deployed in factory automation environments with ambient temperatures up to +85°C. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable code execution and field-upgradable application binaries. Use Value: 100 ns random access enables real-time task scheduling without RAM shadowing; 100,000-cycle endurance supports lifetime firmware revisions in maintenance cycles. | Use Scenario: Hosting boot code and gauge graphics assets in digital instrument clusters requiring AEC-Q100 compliance and operation from –40°C to +85°C. IC Role / Device Role / Timing Role: Secure, high-reliability boot memory with OTP-protected bootloader signature and hardware ECC for ASIL-B functional safety path. Use Value: Factory-locked SSR0 prevents unauthorized bootloader modification; 20-year data retention ensures integrity over vehicle lifetime without refresh. |
| Medical Diagnostic Equipment Configuration | Telecom Base Station Control Firmware |
Use Scenario: Storing calibration tables, device profiles, and regulatory-certified firmware in portable ultrasound and imaging systems requiring long-term data integrity. IC Role / Device Role / Timing Role: Non-volatile configuration store with ECC-protected read paths and sector-level write protection for audit-trail compliance. Use Value: Internal ECC eliminates soft-error-induced misconfiguration; uniform 128-KB sectors simplify FDA-required change-control partitioning. | Use Scenario: Holding FPGA configuration bitstreams and control plane firmware in outdoor telecom base stations exposed to extended temperature ranges. IC Role / Device Role / Timing Role: High-density parallel flash supporting rapid reconfiguration and hot-swap firmware updates via JTAG or PCIe-based management interfaces. Use Value: 512-byte buffer enables sub-second FPGA reload times; versatile I/O (1.65 V–3.6 V) interfaces directly with 1.8 V FPGA I/O banks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFIV10 | Same density and package but uses older 65-nm process; 110 ns tACC vs. 100 ns; no OTP array | Lacks SSR-based secure boot features; lower endurance (50K cycles) | Select only if cost sensitivity outweighs ECC, OTP, and 20-year retention requirements |
| MX29GL512FHT2I-90G | Macronix part with 90 ns tACC, 1.8 V/3.3 V dual I/O supply, no hardware ECC | Requires external ECC logic; different command set limits CFI compatibility | Consider only for designs already committed to Macronix ecosystem and tolerant of added BOM complexity |
Compared with S29GL512S11TFIV10 and MX29GL512FHT2I-90G, the S29GL512T11TFIV10 delivers superior reliability through integrated ECC and OTP security, tighter timing for deterministic boot, and guaranteed 20-year retention-making it optimal for safety- and longevity-critical deployments.
Availability
S29GL512T11TFIV10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical diagnostic equipment configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T11TFIV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.
The GL-T family targets embedded systems needing XIP-capable, high-endurance parallel NOR flash with integrated data integrity features-designed specifically for boot code, firmware, and configuration storage where deterministic timing and long-term reliability are mandatory.
FAQ
Is S29GL512T11TFIV10 compatible with legacy S29GLxxxS devices?
No. While pin-compatible with some S-series variants, the T-series introduces hardware ECC, OTP array, and updated command set extensions. Bootloader firmware must be updated to leverage ECC status registers and SSR lock commands-existing S-series code will not access OTP or detect corrected errors.
What voltage levels are supported on VIO and VCC simultaneously?
VIO may be independently set from 1.65 V to VCC, enabling mixed-voltage operation-for example, VCC = 3.3 V and VIO = 1.8 V. This allows direct connection to 1.8 V FPGA or ASIC I/O banks without level shifters, provided VIO remains within its specified range relative to VCC.
How is the 2048-byte OTP array organized and secured?
The OTP array contains four 512-byte SSR regions (SSR0–SSR3). SSR0 is factory-locked and read-only; SSR3 supports password-based read protection. Locking is permanent and irreversible via dedicated unlock/lock commands-no physical fuses are required, and protection persists across power cycles.
Does this device support synchronous read modes or DDR interface?
No. S29GL512T11TFIV10 is strictly asynchronous with no clock input. It supports only standard parallel NOR timing modes: asynchronous read, page read, and buffered program. Synchronous or DDR variants are not offered in the GL-T family-designs requiring clocked interfaces must select Infineon's HyperFlash or Octal Flash families instead.
S29GL512T11TFIV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512T11TFIV10 FAQ
1.How can I place an order for S29GL512T11TFIV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11TFIV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11TFIV10 reliable?
The price and inventory of S29GL512T11TFIV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11TFIV10 is usually 5 days.
3.What payment methods are accepted for S29GL512T11TFIV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11TFIV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11TFIV10?
S29GL512T11TFIV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11TFIV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11TFIV10?
For technical support, including S29GL512T11TFIV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11TFIV10 requirements.
6.How does Aetrix verify that S29GL512T11TFIV10 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11TFIV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11TFIV10 meets industry standards.
7.What is the process for return or replacement of S29GL512T11TFIV10?
All S29GL512T11TFIV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11TFIV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11TFIV10 part is unused and in its original packaging.
Return procedure for S29GL512T11TFIV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T11TFIV10 Tags
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M24C02-WMN6TP
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