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Infineon Technologies S29GL512T11TFIV13

Part No.:
S29GL512T11TFIV13
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
56-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixS29GL512T11TFIV13.pdf
Description:
IC FLASH 512MBIT CFI 56TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,853

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Product details

Overview

S29GL512T11TFIV13 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). Used in boot code storage for industrial controllers requiring deterministic XIP execution.

For engineers reviewing the S29GL512T11TFIV13 datasheet, S29GL512T11TFIV13 pinout, S29GL512T11TFIV13 application, or S29GL512T11TFIV13 equivalent, key selection criteria include parallel ×16 bus interface, 128-KB uniform sector architecture, OTP array with SSR lockability, CFI compliance, and AEC-Q100 grade 3 qualification for automotive control modules.

Technical Context

This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages program/erase operations with suspend/resume capability and status reporting via Status Register, Data Polling, or RY/BY# pin.

The internal hardware ECC engine corrects single-bit errors on-the-fly during read operations, while the Common Flash Interface (CFI) table enables host software to auto-configure timing and command sets. Sector protection uses volatile/non-volatile ASP methods, and the 2048-byte OTP array includes four lockable SSR regions with factory-locked SSR0 and password-protected SSR3.

Key Specifications

ParameterValue and Actual Design Meaning
Memory density512 Mb (64 MB), enabling full firmware image storage for mid-tier microcontrollers
Interface typeAsynchronous parallel ×16 bus, supporting direct CPU address/data bus connection without translation logic
Random access time100 ns at –40°C to +85°C, meeting real-time boot latency requirements for industrial PLCs
Page access time15 ns, accelerating sequential instruction fetch in XIP mode
Write buffer size512 bytes, reducing effective programming time by batching up to 256 words per operation
ECC capabilityInternal single-bit error correction, eliminating need for external ECC logic in safety-critical systems
Endurance100,000 program/erase cycles per sector, supporting field firmware updates over 10+ years
Data retention20 years at +85°C, ensuring long-term reliability in unpowered storage scenarios

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm body, standard JEDEC MO-141AC footprint, suitable for wave-soldered industrial PCBs.

Pin/TerminalCircuit RoleDesign Meaning
A0–A21Address inputs22-bit address bus supporting full 512 Mb linear addressing with byte/word boundary alignment
DQ0–DQ15Data I/O16-bit bidirectional data bus compatible with Intel-style or AMD-style command sets
CE#Chip enableActive-low chip select controlling device power state and command latching
OE#Output enableActive-low control for data bus tristate; used during read operations only
WE#Write enableActive-low signal initiating write/program/erase commands and data latching
RY/BY#Ready/Busy outputOpen-drain status indicator showing internal operation progress without polling overhead
VCCCore supply3.0 V ±10% single supply powering core logic, memory array, and ECC engine
VIOI/O supply1.65 V to VCC versatile I/O voltage, enabling interoperability with 1.8 V or 3.3 V host interfaces

Key Features

FeatureDesign Value
Versatile I/O voltage rangeVIO supports 1.65 V to VCC, allowing seamless integration with mixed-voltage SoC designs without level shifters
Hardware ECC engineOn-die single-bit error correction eliminates software overhead and improves system MTBF in harsh EMI environments
512-byte write bufferEnables burst programming of up to 256 words, cutting typical firmware update time by >4× vs. single-word writes
Uniform 128-KB sectorsSimplifies BOM management and firmware partitioning across product variants with identical sector layout
Four-lockable OTP regionsSSR0–SSR3 provide hierarchical security: factory-locked boot key (SSR0), configurable calibration data (SSR1–SSR2), password-protected IP (SSR3)

Applications

Industrial PLC Boot MemoryAutomotive ADAS Controller Firmware

Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers deployed in factory automation lines.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <100 ns latency.

Use Value: Deterministic startup within 500 ms due to fast random access and hardware ECC, avoiding field failures from bit flips in electrically noisy plants.

Use Scenario: Holding calibrated sensor fusion firmware and safety monitor code in front-camera ADAS ECUs certified to ISO 26262 ASIL-B.

IC Role / Device Role / Timing Role: AEC-Q100 grade 3 qualified firmware storage with 20-year data retention and 100K-cycle endurance.

Use Value: Eliminates need for redundant external ECC ICs while meeting automotive functional safety requirements for code integrity.

Medical Imaging System BIOSTelecom Base Station Configuration

Use Scenario: Hosting BIOS and FPGA configuration bitstreams in portable ultrasound devices requiring zero boot delay and radiation tolerance.

IC Role / Device Role / Timing Role: Non-volatile storage with 128-KB uniform sectors enabling atomic firmware updates without partial corruption risk.

Use Value: Supports field-upgradable diagnostics via secure SSR3-protected region, maintaining FDA regulatory compliance for software changes.

Use Scenario: Storing FPGA configuration, radio calibration tables, and protocol stack parameters in 5G remote radio units operating at +105°C ambient.

IC Role / Device Role / Timing Role: Industrial Plus grade (–40°C to +105°C) parallel flash with 110 ns access time under thermal stress.

Use Value: Enables reliable reconfiguration during live network operation without thermal derating or performance throttling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL512S11TFIV10Same density and package but uses older 65-nm process; 110 ns random access vs. 100 ns; no OTP arrayLacks SSR-based security features and has lower endurance (50K cycles)Select only when cost sensitivity outweighs security and longevity requirements
MX29GL512FHI-11GMicron equivalent with identical 56-pin TSOP, 100 ns access, but requires separate VCCQ for I/O and lacks CFI supportNo built-in CFI table; host must hardcode timing and command setChoose only if legacy bootloader already supports Micron-specific command set and dual-supply design exists

Compared with S29GL512S11TFIV10 and MX29GL512FHI-11G, the S29GL512T11TFIV13 delivers superior security (OTP/SSR), higher endurance, and plug-and-play CFI compatibility-critical for new designs targeting long lifecycle and functional safety certification.

Availability

S29GL512T11TFIV13 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS controllers, medical imaging BIOS, and telecom base station configuration requiring stable component supply across extended temperature grades.

Supply support for S29GL512T11TFIV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions for industrial and automotive markets.

The GL-T family was designed specifically for embedded systems demanding XIP-capable, high-endurance parallel NOR flash with integrated ECC and security features for safety-critical firmware storage.

FAQ

What temperature grades are supported by S29GL512T11TFIV13?

S29GL512T11TFIV13 is rated for the Industrial temperature range (–40°C to +85°C). The part number suffix "I" explicitly denotes this grade. It is not qualified for Industrial Plus (+105°C) or Extended (+125°C) ranges - those require different ordering codes such as "J" or "K" suffixes per Infineon's ordering matrix.

Does this device support both ×8 and ×16 data bus modes?

Yes, S29GL512T11TFIV13 supports configurable ×8/×16 operation via the BYTE# pin. When BYTE# is low, it operates in ×16 mode with DQ0–DQ15 active; when high, it operates in ×8 mode using only DQ0–DQ7. This flexibility allows reuse across 8-bit and 16-bit microcontroller platforms without redesign.

How is the 2048-byte OTP array structured and secured?

The OTP array consists of four 512-byte SSR regions (SSR0–SSR3). SSR0 is factory-locked and immutable; SSR1 and SSR2 are user-lockable via command sequence; SSR3 supports password-based read protection. All SSRs are one-time programmable and retain data for 20 years at +85°C.

Can this flash be used in place of SPI or Quad SPI flash in existing designs?

No - S29GL512T11TFIV13 uses a parallel asynchronous interface with 22 address lines and 16 data lines, requiring dedicated address/data bus routing and CE#/OE#/WE# control signals. It is not pin- or protocol-compatible with serial flash devices and cannot substitute without board-level redesign and firmware driver replacement.

S29GL512T11TFIV13 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
GL-T
Package/Case:
56-TFSOP (0.724", 18.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
CFI
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
110 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSOP

S29GL512T11TFIV13 FAQ

1.How can I place an order for S29GL512T11TFIV13 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512T11TFIV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512T11TFIV13 reliable?

The price and inventory of S29GL512T11TFIV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11TFIV13 is usually 5 days.

3.What payment methods are accepted for S29GL512T11TFIV13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11TFIV13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512T11TFIV13?

S29GL512T11TFIV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512T11TFIV13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512T11TFIV13?

For technical support, including S29GL512T11TFIV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11TFIV13 requirements.

6.How does Aetrix verify that S29GL512T11TFIV13 is sourced from the original manufacturer or authorized distributors?

All S29GL512T11TFIV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11TFIV13 meets industry standards.

7.What is the process for return or replacement of S29GL512T11TFIV13?

All S29GL512T11TFIV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11TFIV13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512T11TFIV13 part is unused and in its original packaging.

Return procedure for S29GL512T11TFIV13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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