My Inquiry
My Account
Infineon Technologies S29GL512T11TFIV20
- Part No.:
- S29GL512T11TFIV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512T11TFIV20.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:814
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL512T11TFIV20 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers and industrial HMIs requiring fast XIP execution and reliable non-volatile storage.
For engineers reviewing the S29GL512T11TFIV20 datasheet, S29GL512T11TFIV20 pinout, S29GL512T11TFIV20 application, or S29GL512T11TFIV20 equivalent, key selection criteria include verified 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI compliance, and TSOP-56/LAA/LAE/VBU package compatibility for legacy and space-constrained designs.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus support, byte/word boundary addressing, and embedded algorithm controller (EAC) for autonomous program/erase operations. It uses status register polling, RY/BY# pin signaling, and data polling to monitor operation completion without CPU intervention.
The architecture includes dedicated address space overlays (ASOs) for Device ID/CFI, Status Register, Data Polling, SSR (OTP), ECC status, and sector protection control - enabling flexible software configuration and robust data integrity management across diverse embedded platforms.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - sufficient for full firmware images and parameter tables in industrial controllers |
| Access Time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution without external cache in real-time systems |
| Page Access Time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot or firmware update |
| Write Buffer Size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC Support | Internal hardware single-bit error correction - maintains data integrity without host CPU overhead |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years of operation |
| Data Retention | 20 years at +85°C - ensures long-term reliability in unattended infrastructure equipment |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP-I), 14 mm × 20 mm, 0.5 mm pitch, JEDEC standard compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address Inputs | 22-bit address bus supporting full 512 Mb address space (byte/word aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; configurable as ×8 or ×16 via BYTE# pin |
| CE# | Chip Enable | Active-low enable controlling device selection in multi-chip memory systems |
| OE# | Output Enable | Active-low control for read data output gating; supports interleaved read timing |
| WE# | Write Enable | Active-low signal initiating write/program/erase commands in conjunction with address/data |
| RY/BY# | Ready/Busy Output | Open-drain status indicator: low = operation in progress, high = ready/completed |
| VCC | Core Supply | 2.7 V–3.6 V single supply powering core logic, memory array, and EAC |
| VIO | I/O Supply | 1.65 V–VCC versatile I/O voltage - allows interfacing with 1.8 V, 2.5 V, or 3.3 V controllers |
| RESET# | Hardware Reset | Active-low input forcing device into reset state; clears status registers and aborts ongoing operations |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Independent 1.65 V–VCC I/O supply enables seamless integration with mixed-voltage SoCs and FPGAs |
| 512-byte Programming Buffer | Reduces average programming time by >60% vs. single-word writes in firmware update routines |
| Hardware ECC | On-the-fly single-bit error correction eliminates need for host-side ECC software overhead |
| Four Lockable OTP Regions | SSR0–SSR3 provide secure storage for keys, calibration data, and device-specific identifiers |
| CFI Compliance | Standardized parameter table allows automatic detection and configuration by bootloader and OS drivers |
Applications
| Industrial HMI Boot Storage | Network Router Firmware |
|---|---|
Use Scenario: Storing boot loader and GUI firmware in panel-mounted HMIs deployed in factory automation. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with <100 ns latency. Use Value: Enables deterministic boot within 500 ms and supports field-upgradable firmware without external memory controllers. | Use Scenario: Holding routing table images and packet processing microcode in enterprise edge routers. IC Role / Device Role / Timing Role: High-reliability parallel flash serving as primary firmware repository with sector-level update isolation. Use Value: Allows atomic firmware patching via 128-KB sector erase, minimizing service interruption during security updates. |
| Medical Diagnostic Controller | Automotive ADAS Gateway |
Use Scenario: Storing calibration profiles and safety-critical diagnostic algorithms in portable ultrasound units. IC Role / Device Role / Timing Role: Secure, long-retention storage for certified medical firmware with OTP-locked calibration constants. Use Value: Meets IEC 62304 Class C requirements via 20-year data retention and hardware ECC for fault containment. | Use Scenario: Hosting gateway firmware and CAN protocol stacks in automotive domain controllers meeting AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Automotive-qualified parallel flash supporting –40°C to +105°C operation with suspend/resume for safe OTA updates. Use Value: Enables concurrent firmware download and active CAN message handling via program/erase suspend capability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFIV10 | Same density and pinout, but uses older 65-nm process; slower tACC (110 ns) and lower endurance (100K vs. same) | Limited to less demanding industrial applications; no extended temp grade support | Select only if cost sensitivity outweighs performance and longevity requirements |
| MX29GL512FHT2I-90G | Micron part with identical 512 Mb density, 90 ns tACC, but lacks hardware ECC and OTP array | Requires host-side ECC implementation; unsuitable for secure key storage | Choose when CFI compatibility is needed but ECC and OTP are not required |
Compared with S29GL512S11TFIV10 and MX29GL512FHT2I-90G, the S29GL512T11TFIV20 delivers superior reliability via 45-nm process, built-in ECC, and four-lock OTP - making it optimal for safety-critical and long-lifecycle embedded systems where data integrity and secure storage are mandatory.
Availability
S29GL512T11TFIV20 is available at Aetrix Electronics and suitable for industrial HMI boot storage, network router firmware, and medical diagnostic controller applications requiring stable component supply and long-term lifecycle assurance.
Supply support for S29GL512T11TFIV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The GL-T family targets high-reliability embedded systems needing fast XIP execution, robust firmware storage, and extended temperature operation - bridging performance gaps between traditional NOR and NAND flash.
FAQ
What is the maximum operating temperature range supported by S29GL512T11TFIV20?
The S29GL512T11TFIV20 is rated for industrial temperature range (–40°C to +85°C), confirmed in the datasheet's "Temperature range / grade" section. It does not support the +105°C or +125°C grades - those apply to other variants like S29GL512T11TFIV22 or S29GL512T11TFIV23. This variant uses the "I" suffix denoting Industrial grade.
Does S29GL512T11TFIV20 support both ×8 and ×16 data bus configurations?
Yes, it supports both modes via the BYTE# pin: asserted low enables ×16 operation (DQ0–DQ15 active), while high configures ×8 mode (DQ0–DQ7 only). The device automatically adapts address decoding and internal logic based on this setting, as specified in Section 8.3 of the datasheet.
How is the 2048-byte OTP array structured and protected?
The OTP array contains four 512-byte sectors (SSR0–SSR3), each independently lockable. SSR0 is factory-locked and read-only; SSR3 supports password-based read protection. Locking is irreversible and performed via dedicated CFI commands - no hardware fuses are used, and protection persists through power cycles.
Can S29GL512T11TFIV20 be used in place of S29GL512T11TFIV10?
No - the "V20" suffix indicates a specific revision with updated electrical characteristics and timing parameters versus "V10". While pin-compatible, V20 has tighter tACC/tPACC specs and revised DC characteristics per Rev. *M datasheet. Substitution requires validation against system timing margins and voltage tolerances.
S29GL512T11TFIV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512T11TFIV20 FAQ
1.How can I place an order for S29GL512T11TFIV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11TFIV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11TFIV20 reliable?
The price and inventory of S29GL512T11TFIV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11TFIV20 is usually 5 days.
3.What payment methods are accepted for S29GL512T11TFIV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11TFIV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11TFIV20?
S29GL512T11TFIV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11TFIV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11TFIV20?
For technical support, including S29GL512T11TFIV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11TFIV20 requirements.
6.How does Aetrix verify that S29GL512T11TFIV20 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11TFIV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11TFIV20 meets industry standards.
7.What is the process for return or replacement of S29GL512T11TFIV20?
All S29GL512T11TFIV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11TFIV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11TFIV20 part is unused and in its original packaging.
Return procedure for S29GL512T11TFIV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T11TFIV20 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
