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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29GL512T11TFIV33

Name: S29GL512T11TFIV33
Brand: Infineon Technologies
SKU: S29GL512T11TFIV33
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S29GL512T11TFIV33

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 56-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29GL512T11TFIV33.pdf

Description:: IC FLASH 512MBIT PARALLEL 56TSOP

Quantity:: RFQ Add To RFQ list

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Inventory:3,895

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Product details

Overview

S29GL512T11TFIV33 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating at 3.0 V core with versatile I/O (1.65 V to VCC), featuring 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It is used in boot code storage for industrial microcontrollers requiring fast XIP execution and reliable non-volatile data retention.

For engineers reviewing the S29GL512T11TFIV33 datasheet, S29GL512T11TFIV33 pinout, S29GL512T11TFIV33 application, or S29GL512T11TFIV33 equivalent, key selection criteria include sector erase granularity (128 KB), OTP array size (2048 bytes with four lockable regions), and AEC-Q100 Grade 3 qualification for automotive control modules.

Technical Context

This device implements an asynchronous parallel interface with ×8/×16 data bus support and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations without external firmware intervention.

The internal hardware ECC engine performs real-time single-bit correction during read cycles, while the status register and RY/BY# pin provide deterministic device state monitoring. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods per 128-KB sector.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	512 Mb (64 MB) - supports full boot image storage for mid-range MCUs
Access Time (tACC)	100 ns at –40°C to +85°C - enables direct XIP execution without wait states
Page Access (tPACC)	15 ns - accelerates sequential instruction fetch in burst-mode reads
Programming Buffer	512 bytes - reduces effective programming time by batching writes
Erase Unit	Uniform 128-KB sectors - simplifies firmware update partitioning and wear leveling
Data Retention	20 years - ensures long-term reliability in unpowered industrial deployments
Endurance	100,000 program/erase cycles - supports frequent field firmware updates

Pinout & Package

Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AB footprint.

Pin/Terminal	Circuit Role	Design Meaning
A0–A23	Address Inputs	24-bit address bus supporting full 512 Mb linear addressing
DQ0–DQ15	Data I/O	16-bit bidirectional bus; configurable as ×8 or ×16 via BYTE# pin
CE#	Chip Enable	Active-low enable controlling device selection in multi-chip systems
OE#	Output Enable	Active-low control for read data output gating
WE#	Write Enable	Active-low signal initiating internal program/erase command execution
RY/BY#	Ready/Busy Output	Open-drain status indicator reflecting internal operation completion
VCC	Core Supply	3.0 V ±10% supply powering logic and memory array
VIO	I/O Supply	Independent 1.65 V to VCC supply enabling mixed-voltage system interfacing

Key Features

Feature	Design Value
Versatile I/O voltage range	VIO supports 1.65 V to VCC - eliminates level shifters when interfacing with 1.8 V or 3.3 V controllers
Hardware ECC engine	Single-bit error correction on every read - removes need for software-based error handling in safety-critical boot paths
OTP array with SSR locking	2048-byte one-time-programmable region with four password-protected sectors - secures cryptographic keys and calibration data
Suspend/Resume capability	Interrupts active program/erase to service high-priority reads - maintains real-time responsiveness in multitasked systems
Common Flash Interface (CFI)	Standardized parameter table accessible via read commands - enables automatic driver detection and configuration in bootloader code

Applications

Industrial PLC Firmware Storage

Automotive Body Control Module

Use Scenario: Storing boot firmware and configuration parameters in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with deterministic 100 ns access latency.

Use Value: Enables deterministic startup timing and eliminates external RAM initialization delays during cold boot sequences.

Use Scenario: Holding calibrated sensor offsets and actuator lookup tables in AEC-Q100 Grade 3 qualified body control units.

IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with extended temperature support (–40°C to +85°C) and hardware ECC for data integrity.

Use Value: Guarantees 20-year data retention and 100,000-cycle endurance under thermal cycling conditions typical of under-hood electronics.

Medical Diagnostic Imaging Boot Loader

Avionics Data Recorder

Use Scenario: Hosting secure boot loader and FPGA configuration bitstreams in portable ultrasound and MRI subsystems.

IC Role / Device Role / Timing Role: Trusted boot memory with OTP-locked security registers preventing unauthorized firmware modification.

Use Value: Meets IEC 62304 Class C software requirements through hardware-enforced write protection and tamper-evident SSR locking.

Use Scenario: Capturing and retaining flight-critical telemetry logs in certified airborne data acquisition systems.

IC Role / Device Role / Timing Role: High-reliability parallel flash with 128-KB uniform sector erase supporting cyclic overwrite of fixed-size log buffers.

Use Value: Eliminates wear-leveling firmware overhead by enabling predictable erase block management across 100,000+ operational cycles.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR flash applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29GL512S11TFIV33	Same density and package but uses older 65-nm process; slower tACC (110 ns) and no hardware ECC	Lacks integrated ECC and has reduced endurance (50,000 cycles)	Select only if cost sensitivity outweighs reliability and longevity requirements
MX29GL512FHT2I-90G	Micron 512 Mb parallel NOR with 90 ns tACC but no OTP array or ASP sector protection	No dedicated security features; requires external ECC or software mitigation	Choose when maximum read speed is critical and security features are implemented externally

Compared with S29GL512S11TFIV33 and MX29GL512FHT2I-90G, the S29GL512T11TFIV33 uniquely combines hardware ECC, OTP-based key storage, and AEC-Q100 Grade 3 qualification-making it the only option suitable for safety-critical boot memory where data integrity and tamper resistance are mandated.

Availability

S29GL512T11TFIV33 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive body control modules, medical diagnostic imaging boot loaders, and avionics data recorders requiring stable component supply and long-term lifecycle support.

Supply support for S29GL512T11TFIV33 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and memory solutions, with global R&D and manufacturing infrastructure.

The GL-T family targets high-reliability embedded systems requiring XIP-capable flash with integrated data integrity and security features-designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 or extended temperature operation.

FAQ

What is the purpose of the Versatile I/O (VIO) supply pin?

The VIO pin provides an independent I/O voltage rail (1.65 V to VCC) that decouples interface signaling from the core VCC supply. This allows direct connection to 1.8 V or 3.3 V microcontrollers without external level shifters, reducing BOM count and PCB area while maintaining signal integrity across mixed-voltage system architectures.

How does the hardware ECC function during normal read operations?

Hardware ECC operates transparently during every read cycle: the device automatically checks each 512-byte sector for single-bit errors and corrects them before presenting data on DQ pins. No software intervention or additional timing overhead is required, and corrected data is delivered within the specified tACC window-ensuring uninterrupted XIP execution.

Can the OTP array be reprogrammed after initial programming?

No-the 2048-byte OTP array is physically one-time programmable. Once any bit is set to '0', it cannot be reset to '1'. SSR0 is factory-locked and permanently write-protected; SSR3 supports password-based read protection but remains irreversible once programmed. This design enforces permanent key binding and prevents runtime credential exposure.

What distinguishes the S29GL512T from the S29GL512S in terms of embedded algorithms?

The S29GL512T implements enhanced embedded algorithms including suspend/resume for both program and erase operations, whereas the S29GL512S lacks suspend capability. Additionally, the T-series integrates automatic ECC during read, while the S-series requires external error detection-resulting in higher system-level latency and firmware complexity for data integrity assurance.

S29GL512T11TFIV33 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: GL-T

Package/Case:: 56-TFSOP (0.724", 18.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 512Mbit

Memory Organization:: 64M x 8

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 110 ns

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSOP

S29GL512T11TFIV33 FAQ

1.How can I place an order for S29GL512T11TFIV33 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29GL512T11TFIV33 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29GL512T11TFIV33 reliable?

The price and inventory of S29GL512T11TFIV33 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11TFIV33 is usually 5 days.

3.What payment methods are accepted for S29GL512T11TFIV33?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11TFIV33 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29GL512T11TFIV33?

S29GL512T11TFIV33 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29GL512T11TFIV33 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29GL512T11TFIV33?

For technical support, including S29GL512T11TFIV33 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11TFIV33 requirements.

6.How does Aetrix verify that S29GL512T11TFIV33 is sourced from the original manufacturer or authorized distributors?

All S29GL512T11TFIV33 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11TFIV33 meets industry standards.

7.What is the process for return or replacement of S29GL512T11TFIV33?

All S29GL512T11TFIV33 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11TFIV33, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29GL512T11TFIV33 part is unused and in its original packaging.

Return procedure for S29GL512T11TFIV33:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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