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Infineon Technologies S29GL512T11TFV020
- Part No.:
- S29GL512T11TFV020
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512T11TFV020.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,535
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Product details
Overview
S29GL512T11TFV020 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It integrates hardware ECC for single-bit error correction, supports 128-KB uniform sector erase, and includes a 512-byte programming buffer for accelerated write throughput. It is deployed in industrial embedded systems requiring reliable non-volatile code storage and XIP execution.
For engineers reviewing the S29GL512T11TFV020 datasheet, S29GL512T11TFV020 pinout, S29GL512T11TFV020 application, or S29GL512T11TFV020 equivalent, key selection criteria include its 56-pin TSOP package, 100,000 program/erase cycles, –40°C to +85°C industrial temperature grade, Versatile I/O (1.65 V to VCC), and CFI-compliant interface for bootloader and firmware storage.
Technical Context
This device implements an asynchronous parallel interface with byte/word-selectable data bus (×8/×16), supporting both standard read and 32-byte page read modes. Its embedded algorithm controller (EAC) manages all program/erase operations, including suspend/resume capability and status reporting via Status Register, Data Polling, or RY/BY# pin.
The internal architecture features a dedicated 2048-byte OTP array with four lockable sectors (SSR0–SSR3), where SSR0 is factory-locked and SSR3 supports password-based read protection. Sector-level advanced protection (ASP) enables volatile and non-volatile locking per 128-KB sector.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full firmware images and boot code in resource-constrained embedded controllers |
| Random access time (tACC) | 100 ns at –40°C to +85°C - enables real-time XIP execution without CPU stall penalties |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during burst reads |
| Programming buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC support | Internal hardware single-bit error correction - eliminates need for external ECC logic in safety-critical boot storage |
| Endurance & retention | 100,000 program/erase cycles / 20-year data retention - meets long-lifecycle requirements for industrial control and telecom infrastructure |
| Operating voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - allows direct interfacing with 1.8 V, 2.5 V, or 3.3 V logic without level shifters |
| Temperature grade | Industrial (–40°C to +85°C) - qualified for use in factory automation, motor drives, and network edge devices |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, standard JEDEC MO-142 footprint with gull-wing leads.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb addressing (byte/word mode selectable via BYTE#) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; operates as 8-bit in byte mode when BYTE# = LOW |
| CE# | Chip enable | Active-low chip select; device enters standby when CE# is HIGH |
| OE# | Output enable | Active-low control for data output; used during read operations only |
| WE# | Write enable | Active-low control for write/program/erase commands; latches address/data on falling edge |
| RY/BY# | Ready/Busy indicator | Open-drain active-low output signaling ongoing embedded operation (program/erase) |
| RESET# | Hardware reset | Active-low input that halts current operation and returns device to reading state |
| BYTE# | Bus width select | LOW = ×8 mode (DQ0–DQ7 active); HIGH = ×16 mode (DQ0–DQ15 active) |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - enables direct connection to mixed-voltage SoCs without external level translation |
| 512-byte programming buffer | Reduces average programming time by >60% vs. single-word writes - critical for field firmware updates |
| Hardware ECC engine | Single-bit correction with no software overhead - ensures boot integrity in unattended systems |
| OTP array with SSR protection | 2048-byte one-time-programmable space segmented into four lockable regions - secures cryptographic keys and calibration data |
| CFI parameter table | Standardized JEDEC-compliant query structure - simplifies auto-detection and driver porting across platforms |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and configuration parameters in programmable logic controllers deployed in harsh factory environments. IC Role / Device Role / Timing Role: Non-volatile XIP-capable code storage with deterministic 100 ns read latency for real-time task scheduling. Use Value: Eliminates external SRAM copy step during boot; 20-year data retention ensures firmware persistence over equipment lifetime. | Use Scenario: Holding safety-critical boot code and sensor calibration data in automotive camera modules compliant with AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Primary boot memory with hardware ECC and OTP-secured calibration constants for ISO 26262 ASIL-B functions. Use Value: SSR3 password protection prevents unauthorized readout of calibration data; 100,000-cycle endurance supports OTA update cycles. |
| Telecom Base Station BIOS | Medical Imaging System Configuration |
Use Scenario: Hosting BIOS and FPGA configuration bitstreams in 5G remote radio units exposed to wide thermal swings. IC Role / Device Role / Timing Role: Parallel NOR flash with –40°C to +105°C extended temperature option and 120 ns tACC at max temp. Use Value: Reliable power-on initialization under thermal stress; CFI interface enables standardized BIOS driver reuse across hardware generations. | Use Scenario: Storing DICOM metadata templates and device-specific calibration profiles in portable ultrasound systems. IC Role / Device Role / Timing Role: Secure, tamper-resistant non-volatile storage for regulatory-mandated audit logs and calibration history. Use Value: Factory-locked SSR0 stores immutable regulatory signatures; OTP region resists firmware rollback attacks during service updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S11TFV020 | Same density and package, but uses older 65-nm process; 110 ns tACC (vs. 100 ns); no Versatile I/O (VIO fixed to VCC) | Lacks mixed-voltage support and faster timing - suitable only where legacy compatibility or cost sensitivity outweighs performance gain | Select only if existing design uses S-series and upgrade path requires minimal layout change |
| MX29GL512FHTI-90G | 512 Mb parallel NOR, 90 ns tACC, but no integrated ECC; requires external error handling; 48-ball FBGA only | No hardware ECC or OTP security - unsuitable for safety-critical boot storage without added validation layer | Prefer only in cost-sensitive consumer applications where ECC is managed in software and package constraints allow FBGA |
Compared with S29GL512S11TFV020 and MX29GL512FHTI-90G, the S29GL512T11TFV020 delivers superior reliability through on-die ECC and secure OTP, plus flexible I/O voltage support - making it the only choice for industrial and automotive designs requiring guaranteed boot integrity and mixed-voltage interoperability.
Availability
S29GL512T11TFV020 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and telecom base station BIOS requiring stable component supply across long production lifecycles.
Supply support for S29GL512T11TFV020 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The GL-T family targets high-reliability embedded systems needing fast, secure, and long-life non-volatile memory for code execution and critical data storage - especially where XIP capability, ECC, and OTP security are mandatory.
FAQ
Is S29GL512T11TFV020 pin-compatible with S29GL512S11TFV020?
Yes - both use identical 56-pin TSOP packaging and share the same pinout, signal definitions, and address/data mapping. However, S29GL512T11TFV020 adds Versatile I/O functionality and improved timing, so VIO must be explicitly routed and decoupled per the T-series datasheet, unlike the S-series which ties VIO to VCC.
Does this device support execute-in-place (XIP) operation?
Yes - the S29GL512T11TFV020 supports true XIP with 100 ns random access time and deterministic latency, enabling microcontrollers to execute code directly from flash without copying to RAM. Its architecture includes optimized read paths and page-mode acceleration for instruction fetch efficiency.
What is the purpose of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four independent 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is permanently locked at factory; SSR1–SSR2 support volatile/non-volatile locking; SSR3 adds password-based read protection. They store immutable keys, calibration data, or regulatory signatures resistant to overwrite or readout.
Can the device operate with VIO = 1.8 V while VCC = 3.3 V?
Yes - the Versatile I/O feature explicitly supports VIO from 1.65 V to VCC. With VCC = 3.3 V, VIO may be set to 1.8 V to interface directly with 1.8 V logic families. This eliminates level shifters and reduces BOM count and board area in mixed-voltage SoC designs.
S29GL512T11TFV020 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 110 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512T11TFV020 FAQ
1.How can I place an order for S29GL512T11TFV020 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T11TFV020 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T11TFV020 reliable?
The price and inventory of S29GL512T11TFV020 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T11TFV020 is usually 5 days.
3.What payment methods are accepted for S29GL512T11TFV020?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T11TFV020 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T11TFV020?
S29GL512T11TFV020 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T11TFV020 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T11TFV020?
For technical support, including S29GL512T11TFV020 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T11TFV020 requirements.
6.How does Aetrix verify that S29GL512T11TFV020 is sourced from the original manufacturer or authorized distributors?
All S29GL512T11TFV020 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T11TFV020 meets industry standards.
7.What is the process for return or replacement of S29GL512T11TFV020?
All S29GL512T11TFV020 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T11TFV020, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T11TFV020 part is unused and in its original packaging.
Return procedure for S29GL512T11TFV020:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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