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Infineon Technologies S29GL512T12DHN013
- Part No.:
- S29GL512T12DHN013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T12DHN013.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,848
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Product details
Overview
S29GL512T12DHN013 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL512T12DHN013 datasheet, S29GL512T12DHN013 pinout, S29GL512T12DHN013 application, or S29GL512T12DHN013 equivalent, key selection criteria include parallel ×16 bus interface, 128-KB uniform sector architecture, OTP array with four lockable SSR regions, CFI compliance, and support for suspend/resume during program/erase operations.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages all program, erase, and status monitoring functions without external microcontroller intervention.
The internal hardware ECC operates transparently during read cycles, correcting single-bit errors and flagging uncorrectable multi-bit errors via status register bits. Sector protection uses volatile (lock bits) and non-volatile (ASP) methods, while the 2048-byte OTP array includes factory-locked SSR0 and password-protected SSR3 for secure configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB), sufficient for full firmware images in industrial HMI and gateway boot storage |
| Interface type | Asynchronous parallel ×16 bus, enabling direct CPU address/data bus connection without translation logic |
| Access time | 100 ns random access (tACC), enabling real-time XIP execution in deterministic control loops |
| Write buffer size | 512 bytes, reducing effective programming time by up to 10× vs. single-word writes |
| ECC capability | Single-bit error correction with detection of multi-bit errors, ensuring data integrity over 20-year retention |
| Endurance | 100,000 program/erase cycles per sector, supporting field firmware updates in long-lifecycle equipment |
| Operating temp | –40°C to +85°C industrial grade, validated for use in enclosed control cabinets without active cooling |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm body, standard JEDEC MO-141AC footprint, compatible with automated PCB assembly and reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb decoding with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports ×8 mode via DQ0–DQ7 when BYTE# = LOW |
| CE# | Chip enable | Active-low chip select; device enters standby when CE# high, minimizing power during idle |
| OE# | Output enable | Controls data bus drivers during read; allows shared bus operation with other peripherals |
| WE# | Write enable | Initiates write/program cycles; latches command sequences on rising edge |
| RY/BY# | Ready/Busy output | Open-drain status signal indicating ongoing embedded operations (program/erase) |
| VCC | Core supply | 2.7–3.6 V single supply for read, program, and erase - eliminates need for auxiliary voltage rails |
| VIO | I/O supply | 1.65–VCC versatile I/O voltage, enabling direct interfacing with 1.8 V or 3.3 V controllers |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | On-the-fly single-bit correction with status reporting, eliminating need for software ECC overhead in safety-critical boot loaders |
| 512-byte write buffer | Enables burst programming of up to 512 bytes per command, cutting typical firmware update time by >70% vs. legacy flash |
| Uniform 128-KB sectors | Eliminates complexity of mixed-sector architectures, simplifying partitioning for bootloader, app, and config storage |
| Four-lock OTP array (SSR0–SSR3) | Provides secure storage for keys, calibration data, and MAC addresses - SSR0 factory-locked, SSR3 password-protected |
| Suspend/Resume commands | Allows interruption of long erase cycles (e.g., 128-KB sector erase ~500 ms) to service high-priority interrupts |
Applications
| Industrial PLC Boot Memory | Medical Imaging System Firmware Storage |
|---|---|
Use Scenario: Storing boot firmware and real-time control logic in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency to ensure deterministic scan cycle timing. Use Value: 100,000 erase cycles and 20-year data retention guarantee firmware integrity across 15+ year product lifecycles without replacement. | Use Scenario: Holding FPGA configuration bitstreams and diagnostic firmware in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: High-reliability firmware repository supporting secure field updates via encrypted OTA packages verified against OTP-stored public keys. Use Value: Hardware ECC and SSR-based key storage meet IEC 62304 Class C software safety requirements for medical device data integrity. |
| Automotive Gateway ECU Storage | Energy Meter Secure Configuration |
Use Scenario: Storing AUTOSAR-compliant boot software and CAN FD communication stacks in vehicle domain controllers. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified (–40°C to +105°C) parallel flash serving as primary boot device with CFI-compliant identification for bootloader auto-detection. Use Value: Versatile I/O (1.65–3.6 V) enables direct interface with 1.8 V microcontrollers, reducing level-shifter count and BOM cost. | Use Scenario: Retaining tariff tables, cryptographic keys, and tamper logs in ANSI C12.22-compliant smart electricity meters. IC Role / Device Role / Timing Role: Secure non-volatile storage with OTP lockable regions preventing unauthorized modification of billing parameters. Use Value: Factory-locked SSR0 stores immutable meter serial number; password-protected SSR3 holds AES-128 keys, satisfying ANSI C12.22 security annex requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S12DHI013 | Same density and pinout, but uses older 65-nm process; 110 ns tACC vs. 100 ns; no OTP array | Lacks SSR-based secure storage; unsuitable where cryptographic key persistence is required | Select only if cost sensitivity outweighs need for OTP security and faster access time |
| MX29GL512FHTI-90G | Macronix part; 90 ns tACC, same 512 Mb density, but requires separate VCC/VIO supplies and lacks hardware ECC | Requires external ECC implementation; not drop-in for safety-certified designs relying on internal correction | Consider only for non-safety applications where maximum speed justifies added software validation effort |
Compared with S29GL512S12DHI013 and MX29GL512FHTI-90G, the S29GL512T12DHN013 delivers superior reliability through integrated ECC and secure OTP storage, while maintaining best-in-class 100 ns access time - critical for deterministic boot and real-time interrupt response in industrial and automotive systems.
Availability
S29GL512T12DHN013 is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, and automotive gateway ECUs requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant flash memory.
Supply support for S29GL512T12DHN013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global manufacturing and R&D centers.
The GL-T family targets high-reliability embedded systems needing fast XIP execution and robust firmware storage - designed specifically for industrial control, automotive gateways, and medical devices demanding 20-year data retention and AEC-Q100 qualification.
FAQ
Does S29GL512T12DHN013 support both ×8 and ×16 data bus modes?
Yes. The device supports configurable ×8/×16 operation via the BYTE# pin: when BYTE# is LOW, DQ0–DQ7 function as an 8-bit bus; when HIGH, DQ0–DQ15 operate as a full 16-bit bus. Address lines A0–A21 remain identical in both modes, with A0 selecting byte lanes in ×8 mode.
What is the purpose of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is permanently locked at factory and stores immutable device identifiers. SSR3 supports password-based read protection for sensitive data like encryption keys. SSR1 and SSR2 are user-lockable for calibration or configuration data.
How does the suspend/resume feature improve system responsiveness during flash operations?
Suspend/resume allows halting a sector erase (typically ~500 ms) or buffer program to service urgent CPU interrupts, then resuming from the exact point. This prevents missed deadlines in real-time systems - for example, preserving motor control loop timing while updating firmware in background.
Is the 100,000 program/erase cycle rating guaranteed per sector or per device?
The 100,000 cycle endurance is specified per sector - meaning each of the 512 uniform 128-KB sectors can independently endure 100,000 erase cycles. Wear leveling must be implemented in firmware or host controller to distribute writes across sectors and achieve full device longevity.
S29GL512T12DHN013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512T12DHN013 FAQ
1.How can I place an order for S29GL512T12DHN013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T12DHN013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T12DHN013 reliable?
The price and inventory of S29GL512T12DHN013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T12DHN013 is usually 5 days.
3.What payment methods are accepted for S29GL512T12DHN013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T12DHN013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T12DHN013?
S29GL512T12DHN013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T12DHN013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T12DHN013?
For technical support, including S29GL512T12DHN013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T12DHN013 requirements.
6.How does Aetrix verify that S29GL512T12DHN013 is sourced from the original manufacturer or authorized distributors?
All S29GL512T12DHN013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T12DHN013 meets industry standards.
7.What is the process for return or replacement of S29GL512T12DHN013?
All S29GL512T12DHN013 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T12DHN013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T12DHN013 part is unused and in its original packaging.
Return procedure for S29GL512T12DHN013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T12DHN013 Tags
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