My Inquiry
My Account
Infineon Technologies S29GL512T12DHN023
- Part No.:
- S29GL512T12DHN023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T12DHN023.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,751
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL512T12DHN023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). Used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile data retention.
For engineers reviewing the S29GL512T12DHN023 datasheet, S29GL512T12DHN023 pinout, S29GL512T12DHN023 application, or S29GL512T12DHN023 equivalent, key selection factors include verified 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI-compliant interface, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 configurable data bus and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages autonomous program and erase operations, while internal hardware ECC provides real-time single-bit error correction without host intervention.
The versatile I/O feature enables independent VIO supply (1.65 V to VCC), decoupling I/O voltage from core logic. Sector protection includes volatile/non-volatile ASP modes, and the 2048-byte OTP array contains four separately lockable sectors-SSR0 factory-locked, SSR3 password-read-protected-supporting secure firmware signing and configuration storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full boot image + firmware + parameter storage in resource-constrained embedded systems |
| Random access time | 100 ns at –40°C to +85°C - enables direct XIP execution of real-time control code without external cache |
| Page access time | 15 ns - accelerates sequential instruction fetch during burst reads from contiguous memory regions |
| Write buffer size | 512 bytes - reduces effective programming time by up to 10× vs. single-word writes for firmware updates |
| ECC capability | Internal hardware single-bit correction - eliminates need for host-side error handling logic in safety-critical applications |
| Endurance | 100,000 program/erase cycles - supports field firmware upgrades over 10+ years in industrial gateways |
| Data retention | 20 years at +85°C - ensures long-term reliability in unattended infrastructure equipment |
Pinout & Package
Package: 56-pin TSOP (Type I, 400 mil width), JEDEC standard footprint compatible with legacy board layouts and automated assembly processes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb linear addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; operates in ×8 or ×16 mode per configuration register setting |
| CE# | Chip enable | Active-low chip select with 100 ns access timing; enables low-power deselection between accesses |
| OE# | Output enable | Controls output drivers during read; tOE = 25 ns ensures timing margin for 10 MHz system clocks |
| WE# | Write enable | Initiates write/program cycles; latches command sequences when asserted with valid address/data |
| RY/BY# | Ready/Busy indicator | Open-drain status pin signaling active program/erase; allows host to poll without dedicated status register reads |
| VCC | Core supply | 2.7–3.6 V single supply powers both read and embedded operations; no auxiliary voltage required |
| VIO | I/O supply | Independent 1.65–VCC input enabling interface compatibility with 1.8 V, 2.5 V, or 3.3 V host buses |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | Single-bit error correction performed autonomously during read; eliminates host CPU overhead and improves system MTBF |
| 512-byte write buffer | Enables full-page programming in one command sequence, reducing firmware update time by >80% vs. byte-by-byte writes |
| Uniform 128-KB sectors | Eliminates complex sector mapping logic; simplifies bootloader design and OTA update partitioning |
| Suspend/Resume capability | Allows interrupting erase or program operations to service high-priority reads, critical for real-time HMI responsiveness |
| Four-lock OTP array | SSR0–SSR3 provide hierarchical security: factory-locked boot key (SSR0), user-configurable keys (SSR1–SSR2), password-protected debug (SSR3) |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader, real-time OS kernel, and motion control algorithms in programmable logic controllers deployed in factory automation lines. IC Role / Device Role / Timing Role: Primary non-volatile boot memory with XIP capability; delivers 100 ns random access to meet deterministic <10 μs task scheduling deadlines. Use Value: Hardware ECC ensures firmware integrity across 20-year deployments in electrically noisy environments without periodic checksum validation. | Use Scenario: Holding certified boot code and sensor calibration data in front-camera modules compliant with AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Secure boot memory with OTP-locked signature verification keys; operates reliably under thermal cycling and ESD stress. Use Value: SSR3 password protection prevents unauthorized debug access during vehicle service, satisfying ISO 21434 cybersecurity requirements. |
| Medical Imaging System Configuration | Energy Meter Firmware Vault |
Use Scenario: Retaining DICOM protocol stacks, image processing profiles, and regulatory compliance certificates in portable ultrasound devices. IC Role / Device Role / Timing Role: Non-volatile configuration store with 20-year data retention; accessed via parallel bus during power-up initialization. Use Value: 128-KB uniform sectors simplify FDA audit-ready firmware versioning and rollback mechanisms without custom wear-leveling. | Use Scenario: Securing tariff tables, communication stack binaries, and metrology calibration constants in ANSI C12.22-compliant smart meters. IC Role / Device Role / Timing Role: Tamper-resistant firmware vault; OTP regions store cryptographic keys used in DLMS/COSEM secure boot. Use Value: Independent VIO (1.8 V) interface allows direct connection to meter's low-power microcontroller without level-shifting components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S12DHI023 | Same density and timing, but uses 64-ball LAE BGA (9 mm × 9 mm); lacks OTP array and SSR lock features | Targeted at space-constrained consumer electronics where security and long-term firmware immutability are secondary | Select only if board redesign accommodates BGA and security requirements are minimal |
| MX29GL512FHI-90G | Macronix part with 90 ns random access (slower), no hardware ECC, and no OTP lock; supports same TSOP-56 package | Used in cost-sensitive industrial HMIs where ECC and secure boot are handled externally | Choose when budget constraints outweigh reliability and security needs; verify external ECC implementation |
Compared with S29GL512S12DHI023 and MX29GL512FHI-90G, the S29GL512T12DHN023 uniquely combines TSOP-56 compatibility, on-die ECC, and four-lock OTP-making it the only option for retrofitting legacy industrial controllers with enhanced security and longevity without PCB revision.
Availability
S29GL512T12DHN023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T12DHN023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D centers and ISO/TS 16949-certified manufacturing.
The GL-T family targets high-reliability embedded systems needing fast XIP execution and robust firmware storage; designed specifically for industrial, automotive, and medical applications demanding 20-year data retention and AEC-Q100 compliance.
FAQ
What is the maximum operating temperature grade supported by S29GL512T12DHN023?
This part is rated for the Industrial temperature range (–40°C to +85°C), confirmed in the ordering information section of the datasheet (Rev. *M, p.114). It does not support Industrial Plus (+105°C) or Extended (+125°C) grades - those require different suffixes (e.g., 'I' or 'E') in the part number. The 'H' in the suffix denotes industrial grade, and 'N023' specifies TSOP-56 packaging with lead-free finish.
Does S29GL512T12DHN023 support both ×8 and ×16 data bus widths?
Yes, it supports configurable ×8/×16 operation via the configuration register (CR[1]), as documented in Section 7.1 of the datasheet. In ×16 mode, DQ15–DQ0 transfer 16-bit words; in ×8 mode, DQ7–DQ0 operate as a byte bus with DQ15–DQ8 unused. Address lines remain identical in both modes, and the device automatically detects bus width during reset based on hardware strap or software configuration.
How is the OTP array protected against accidental overwrite?
The 2048-byte OTP array is divided into four lockable sectors (SSR0–SSR3). SSR0 is permanently locked at factory; SSR1 and SSR2 can be individually locked via command sequence; SSR3 requires a password for read access. Once locked, sectors cannot be unlocked - protection is irreversible. Locking is performed using specific unlock-bypass-write commands defined in Table 7-1 (p.59), and status is verified via the SSR status register (Section 2.5).
Can S29GL512T12DHN023 be used in systems requiring AEC-Q100 qualification?
No - this specific part number is Industrial grade only. AEC-Q100 qualified versions exist (e.g., S29GL512T12DHV023 for Grade 2, –40°C to +105°C), identified by 'V' instead of 'H' in the temperature suffix. The 'H' suffix explicitly denotes industrial qualification per Infineon's ordering matrix (p.114–116). Automotive use requires requalification and traceable lot documentation not provided with the 'H' variant.
S29GL512T12DHN023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512T12DHN023 FAQ
1.How can I place an order for S29GL512T12DHN023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T12DHN023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T12DHN023 reliable?
The price and inventory of S29GL512T12DHN023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T12DHN023 is usually 5 days.
3.What payment methods are accepted for S29GL512T12DHN023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T12DHN023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T12DHN023?
S29GL512T12DHN023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T12DHN023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T12DHN023?
For technical support, including S29GL512T12DHN023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T12DHN023 requirements.
6.How does Aetrix verify that S29GL512T12DHN023 is sourced from the original manufacturer or authorized distributors?
All S29GL512T12DHN023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T12DHN023 meets industry standards.
7.What is the process for return or replacement of S29GL512T12DHN023?
All S29GL512T12DHN023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T12DHN023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T12DHN023 part is unused and in its original packaging.
Return procedure for S29GL512T12DHN023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T12DHN023 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
