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Infineon Technologies S29GL512T12DHVV10
- Part No.:
- S29GL512T12DHVV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T12DHVV10.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,669
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Product details
Overview
S29GL512T12DHVV10 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for industrial controllers requiring deterministic XIP execution.
For engineers reviewing the S29GL512T12DHVV10 datasheet, S29GL512T12DHVV10 pinout, S29GL512T12DHVV10 application, or S29GL512T12DHVV10 equivalent, key selection criteria include asynchronous parallel interface timing, OTP array configuration, sector protection granularity, and AEC-Q100 grade compatibility for automotive control modules.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus support and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations without external microcontroller intervention.
The internal hardware ECC engine corrects single-bit errors on-the-fly during read operations, and the Common Flash Interface (CFI) table enables host firmware to auto-detect device geometry and command set. Sector protection uses both volatile (SR bits) and non-volatile (SSR registers) methods.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB), sufficient for full boot firmware + parameter storage in PLCs |
| Random access time | 100 ns at –40°C to +85°C, enabling direct XIP execution from flash without cache penalty |
| Page access time | 15 ns, accelerating sequential instruction fetch in burst-mode applications |
| Write buffer size | 512 bytes, reducing average programming time per sector by >60% vs. single-word writes |
| ECC capability | Single-bit error correction per 512-byte sector, eliminating need for external error-handling logic |
| Endurance | 100,000 program/erase cycles, supporting field firmware updates over 10+ years |
| Data retention | 20 years at +85°C, meeting long-lifecycle requirements for industrial infrastructure |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, surface-mount, JEDEC standard MO-142AC.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb linear addressing (byte/word mode) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; operates as ×8 or ×16 depending on BYTE# state |
| CE# | Chip enable | Active-low chip select; controls device power state and command latching |
| OE# | Output enable | Active-low read strobe; gates output drivers during read cycles |
| WE# | Write enable | Active-low write strobe; initiates program/erase commands when CE# and OE# are high |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation (low = busy) |
| BYTE# | Bus width select | Low = ×16 mode; high = ×8 mode with DQ0–DQ7 only active |
| VCC | Core supply | 2.7–3.6 V single supply powering core logic and memory array |
| VIO | I/O supply | 1.65–VCC versatile I/O voltage, enabling interface to mixed-voltage SoCs |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC, allowing direct connection to 1.8 V, 2.5 V, or 3.3 V host processors without level shifters |
| 512-byte programming buffer | Enables full-sector (128 KB) programming in ≤250 ms, critical for fast field firmware updates |
| Hardware ECC engine | Corrects single-bit errors transparently during read, eliminating software overhead and improving system MTBF |
| Four-lockable OTP regions | SSR0–SSR3 provide secure storage for keys, calibration data, and bootloader signatures with factory lock (SSR0) and password protection (SSR3) |
| Uniform 128-KB sectors | Eliminates complexity of variable-sector devices; simplifies partitioning for dual-bank firmware and OTA rollback |
Applications
| Industrial PLC Boot Memory | Automotive ADAS ECU Firmware |
|---|---|
Use Scenario: Storing boot loader and real-time OS kernel in programmable logic controllers with no external RAM cache. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency. Use Value: Eliminates need for external SRAM shadowing, reducing BOM cost and PCB area while maintaining deterministic startup timing. | Use Scenario: Holding safety-critical firmware images in radar processing ECUs requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Certified flash storage for ASIL-B firmware partitions with hardware ECC and sector lock protection. Use Value: Meets ISO 26262 requirements via built-in error correction and OTP-based secure boot key storage. |
| Medical Imaging System Parameter Storage | Telecom Base Station Configuration |
Use Scenario: Retaining calibration coefficients and user-configurable imaging parameters across power cycles in MRI subsystems. IC Role / Device Role / Timing Role: High-reliability parameter store with 20-year data retention at +85°C ambient. Use Value: Guarantees parameter integrity over equipment lifetime without battery-backed SRAM or periodic refresh. | Use Scenario: Storing FPGA configuration bitstreams and protocol stack binaries in 5G remote radio units. IC Role / Device Role / Timing Role: Parallel interface flash enabling fast reconfiguration during network handover events. Use Value: 15 ns page access supports sub-100 μs FPGA reload, minimizing service interruption during dynamic spectrum allocation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S12DHVV10 | Same density and package, but uses older 65-nm process; 110 ns tACC vs. 100 ns | Lacks OTP array and advanced sector protection; no SSR lock capability | Select only if legacy design reuse is required and OTP security is not needed |
| MX29GL512FHI-12G | Macronix part with identical 56-pin TSOP, 100 ns tACC, but no hardware ECC or CFI compliance | Requires external error handling; lacks standardized ID query mechanism for firmware portability | Choose only for cost-sensitive applications where ECC and CFI are managed in software |
Compared with S29GL512S12DHVV10 and MX29GL512FHI-12G, the S29GL512T12DHVV10 uniquely combines 45-nm density efficiency, on-die ECC, and four-region OTP security-making it the only option qualified for ASIL-B firmware storage without external error mitigation.
Availability
S29GL512T12DHVV10 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging systems, and telecom base stations requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T12DHVV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The GL-T family targets high-reliability embedded systems needing deterministic XIP performance, robust data integrity, and long-term firmware update support-especially where AEC-Q100 qualification and hardware security are mandatory.
FAQ
What is the purpose of the SSR0–SSR3 OTP regions?
SSR0–SSR3 are four separate 2048-byte one-time-programmable arrays. SSR0 is factory-locked and stores immutable device identifiers; SSR3 supports password-protected reads for secure key storage. SSR1 and SSR2 are user-programmable for calibration data or firmware signatures, with individual lock bits preventing overwrite after programming.
Does S29GL512T12DHVV10 support both ×8 and ×16 data bus modes?
Yes. The BYTE# pin selects bus width: low enables ×16 mode using DQ0–DQ15; high enables ×8 mode using DQ0–DQ7 only. Address lines A0–A21 remain fully functional in both modes, with A0 ignored in ×16 mode to maintain word-aligned addressing.
How does the hardware ECC operate during read cycles?
The ECC engine automatically checks each 512-byte sector during read access. If a single-bit error is detected, it is corrected before data is driven onto DQ pins; no CPU intervention or additional timing overhead is required. Uncorrectable multi-bit errors trigger status register flags and RY/BY# assertion.
Is the 56-pin TSOP package RoHS-compliant and lead-free?
Yes. The S29GL512T12DHVV10 TSOP package meets RoHS Directive 2011/65/EU and is lead-free, with matte tin (Sn) termination finish. It is rated for reflow soldering per IPC/JEDEC J-STD-020D.2, peak temperature 260°C, 30 seconds maximum.
S29GL512T12DHVV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512T12DHVV10 FAQ
1.How can I place an order for S29GL512T12DHVV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T12DHVV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T12DHVV10 reliable?
The price and inventory of S29GL512T12DHVV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T12DHVV10 is usually 5 days.
3.What payment methods are accepted for S29GL512T12DHVV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T12DHVV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T12DHVV10?
S29GL512T12DHVV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T12DHVV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T12DHVV10?
For technical support, including S29GL512T12DHVV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T12DHVV10 requirements.
6.How does Aetrix verify that S29GL512T12DHVV10 is sourced from the original manufacturer or authorized distributors?
All S29GL512T12DHVV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T12DHVV10 meets industry standards.
7.What is the process for return or replacement of S29GL512T12DHVV10?
All S29GL512T12DHVV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T12DHVV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T12DHVV10 part is unused and in its original packaging.
Return procedure for S29GL512T12DHVV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T12DHVV10 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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Microchip Technology
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Microchip Technology
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M24C02-FMC6TG
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Microchip Technology
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