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Infineon Technologies S29GL512T12DHVV20
- Part No.:
- S29GL512T12DHVV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T12DHVV20.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,498
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Product details
Overview
S29GL512T12DHVV20 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). Used in boot code storage for industrial controllers requiring fast XIP execution and reliable non-volatile firmware retention.
For engineers reviewing the S29GL512T12DHVV20 datasheet, S29GL512T12DHVV20 pinout, S29GL512T12DHVV20 application, or S29GL512T12DHVV20 equivalent, key selection criteria include verified 100,000 program/erase cycles, 20-year data retention, OTP array with four lockable SSR regions, CFI compliance, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages all program and erase operations autonomously, including automatic ECC generation and error detection during read cycles.
The versatile I/O feature enables independent VIO supply (1.65 V to VCC), allowing interoperability with mixed-voltage microcontrollers. Sector protection includes both volatile (lock bits) and non-volatile (ASP) methods, while the 2048-byte OTP array provides secure boot code storage with factory-locked SSR0 and password-protected SSR3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full firmware images and parameter tables in industrial HMI and PLCs |
| Random access time | 100 ns at –40°C to +85°C - enables direct XIP execution without external cache |
| Page access time | 15 ns - accelerates sequential instruction fetch during boot or interrupt handling |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per operation |
| ECC capability | Single-bit error correction via internal hardware - eliminates need for software ECC overhead |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years of operation |
| Data retention | 20 years at +85°C - ensures long-term reliability in unattended embedded deployments |
Pinout & Package
Package: 56-ball VBU fortified BGA (9 mm × 7 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb address space with byte/word alignment |
| DQ0–DQ15 | Data I/O | Configurable ×8 or ×16 data bus; DQ15 functions as BYTE# in ×8 mode |
| CE# | Chip enable | Active-low control enabling device for read/write; tCE = 100 ns max |
| OE# | Output enable | Active-low control gating output drivers; tOE = 25 ns max |
| WE# | Write enable | Active-low control initiating write cycles; used with CE# and OE# for command decoding |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling ongoing embedded operations; allows host polling or interrupt use |
| VCC | Core supply | 2.7 V to 3.6 V single supply powering core logic and memory array |
| VIO | I/O supply | 1.65 V to VCC - decouples I/O voltage from core, enabling interfacing with 1.8 V or 3.3 V controllers |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | On-the-fly single-bit error correction without CPU intervention or latency penalty |
| 512-byte write buffer | Enables burst programming of up to 256 words, reducing total flash programming time by >60% vs. byte-by-byte writes |
| Uniform 128-KB sectors | Eliminates complexity of variable-sector architectures; simplifies bootloader partitioning and OTA update design |
| Suspend/Resume commands | Allows interruption of long erase operations to service high-priority reads, critical for real-time response in motion control |
| Four-lock OTP array (SSR0–SSR3) | Provides layered security: factory-locked SSR0 for immutable root keys; password-protected SSR3 for customer-defined secrets |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and safety-critical firmware in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with ≤100 ns latency to meet deterministic scan cycle timing. Use Value: 20-year data retention and 100,000-cycle endurance ensure firmware integrity across decades of unattended operation without recalibration. | Use Scenario: Holding certified boot code and sensor calibration data in automotive ADAS ECUs requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Secure, high-reliability flash memory supporting cold-start boot within strict <500 ms timing budget under –40°C to +105°C conditions. Use Value: Hardware ECC and OTP lockable regions meet ISO 26262 ASIL-B requirements for fault-tolerant startup sequence validation. |
| Medical Imaging System Configuration | Telecom Base Station BIOS |
Use Scenario: Retaining modality-specific calibration profiles and regulatory-compliant configuration parameters in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Parameter storage device with guaranteed data integrity across thermal cycling and ESD events in Class II medical equipment. Use Value: 128-KB uniform sectors simplify versioned profile management; SSR-based OTP prevents unauthorized parameter tampering. | Use Scenario: Hosting BIOS and FPGA configuration bitstreams in carrier-grade 5G base station radios requiring zero-downtime field upgrades. IC Role / Device Role / Timing Role: High-density, fast-access flash enabling dual-bank firmware swapping without system reset. Use Value: 512-byte write buffer and suspend/resume allow background reprogramming while maintaining real-time RF control loop stability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S12DHVV20 | Same density and package, but uses older 65-nm process; 110 ns random access vs. 100 ns | Lacks hardware ECC and OTP SSR lock features; no CFI v1.5 support | Acceptable only where cost sensitivity outweighs ECC requirement and firmware update frequency is low |
| MX29GL512FHT2I-90G | Macronix part with identical 512 Mb density, 90 ns access, but no built-in ECC or OTP array | Requires external ECC implementation; lacks sector protection granularity and CFI compatibility | Only suitable when paired with dedicated ECC controller and where SSR-based security is not mandated |
Compared with S29GL512S12DHVV20 and MX29GL512FHT2I-90G, the S29GL512T12DHVV20 delivers measurable design value through integrated ECC, OTP security, and tighter timing-reducing BOM count, eliminating software ECC overhead, and enabling certified safety-critical boot paths.
Availability
S29GL512T12DHVV20 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across extended lifecycle programs.
Supply support for S29GL512T12DHVV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing XIP-capable flash with robust data integrity, security, and extended temperature operation-designed specifically for industrial control, automotive, and medical applications.
FAQ
Does S29GL512T12DHVV20 support both ×8 and ×16 data bus configurations?
Yes, it supports configurable ×8 or ×16 operation via the BYTE# signal (DQ15). In ×16 mode, all 16 data lines are active; in ×8 mode, DQ0–DQ7 carry data and DQ8–DQ15 are unused. Addressing remains word-aligned in both modes, and the CFI query returns correct bus width information.
What is the function of the SSR (Secure Silicon Region) and how is it protected?
The SSR is a 2048-byte OTP array divided into four lockable regions (SSR0–SSR3). SSR0 is permanently locked at factory; SSR3 supports password-based read protection. Locking is irreversible and performed via dedicated CFI commands. Once locked, SSR contents cannot be overwritten or read without valid credentials, ensuring secure boot key storage.
Can S29GL512T12DHVV20 operate with VIO = 1.8 V while VCC = 3.3 V?
Yes, the versatile I/O feature explicitly supports VIO from 1.65 V to VCC. With VCC = 3.3 V, VIO may be set to 1.8 V to interface directly with low-voltage microcontrollers or FPGAs, without level shifters. All input thresholds and output drive strengths are guaranteed across this VIO range per datasheet Section 10.4.
How does the hardware ECC work during read operations?
Hardware ECC operates transparently during every read: the device computes a Hamming code on-the-fly, compares it with stored parity bits, and automatically corrects single-bit errors before data is placed on DQ lines. No software intervention is required, and corrected reads incur no additional latency. Uncorrectable multi-bit errors trigger status register flags and RY/BY# assertion.
S29GL512T12DHVV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512T12DHVV20 FAQ
1.How can I place an order for S29GL512T12DHVV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T12DHVV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T12DHVV20 reliable?
The price and inventory of S29GL512T12DHVV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T12DHVV20 is usually 5 days.
3.What payment methods are accepted for S29GL512T12DHVV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T12DHVV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T12DHVV20?
S29GL512T12DHVV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T12DHVV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T12DHVV20?
For technical support, including S29GL512T12DHVV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T12DHVV20 requirements.
6.How does Aetrix verify that S29GL512T12DHVV20 is sourced from the original manufacturer or authorized distributors?
All S29GL512T12DHVV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T12DHVV20 meets industry standards.
7.What is the process for return or replacement of S29GL512T12DHVV20?
All S29GL512T12DHVV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T12DHVV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T12DHVV20 part is unused and in its original packaging.
Return procedure for S29GL512T12DHVV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T12DHVV20 Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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AT24C02C-SSHM-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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