Infineon Technologies S29GL512T12TFN023
- Part No.:
- S29GL512T12TFN023
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512T12TFN023.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,630
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Product details
Overview
S29GL512T12TFN023 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers requiring deterministic XIP execution.
For engineers reviewing the S29GL512T12TFN023 datasheet, S29GL512T12TFN023 pinout, S29GL512T12TFN023 application, or S29GL512T12TFN023 equivalent, key selection criteria include parallel ×16 bus interface timing compliance, OTP array security configuration, sector protection volatility control, and industrial-grade thermal reliability under sustained read/write cycling.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both 8-bit and 16-bit data bus configurations. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations independently of host CPU intervention.
The internal hardware ECC operates transparently during read cycles and corrects single-bit errors without software overhead; the status register and RY/BY# pin provide real-time operation completion signaling. Sector protection uses volatile (lock bits) and non-volatile (ASP) methods per 128-KB sector.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB), enabling full firmware image storage for mid-tier embedded controllers |
| Interface Type | Asynchronous parallel ×16 bus, supporting direct memory-mapped XIP execution without translation layer |
| Access Time | 100 ns random access (tACC), meeting real-time boot latency requirements for industrial PLCs |
| Write Buffer Size | 512 bytes, allowing burst programming of up to 256 words per command to reduce effective write time |
| ECC Support | Internal single-bit error correction, eliminating need for external ECC logic in safety-critical boot paths |
| Operating Temp | –40°C to +85°C industrial grade, validated for continuous operation in enclosed control cabinet environments |
| Endurance | 100,000 program/erase cycles per sector, supporting field firmware updates over 10+ year product lifecycle |
| Data Retention | 20 years at 85°C, ensuring long-term integrity of calibration and configuration data without refresh |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm body, 0.5 mm pitch, JEDEC standard MO-142AC. Pin-compatible with legacy S29GL series for drop-in replacement in existing PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb linear addressing with byte/word boundary alignment |
| DQ0–DQ15 | Data I/O lines | 16-bit bidirectional data path; supports 8-bit mode via BYTE# control for legacy system compatibility |
| CE# | Chip enable | Active-low chip select with 100 ns setup requirement; enables partial memory mapping in multi-device systems |
| OE# | Output enable | Controls output driver state during read; decoupled from CE# to support interleaved read sequences |
| WE# | Write enable | Initiates internal program/erase algorithms when asserted with valid address/data; latches command sequence |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation; used for hardware flow control without polling overhead |
| VCC | Core supply | Single 2.7–3.6 V supply powering core logic, charge pumps, and I/O buffers-no auxiliary voltage required |
| VIO | I/O supply | Independent 1.65–VCC I/O rail enabling interfacing with 1.8 V, 2.5 V, or 3.3 V host buses |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC, enabling direct connection to mixed-voltage SoCs without level shifters |
| Hardware ECC engine | On-die single-bit error correction reduces BOM cost and improves boot reliability in EMI-prone industrial settings |
| OTP array with SSR lock | 2048-byte one-time-programmable region with four password-protected lockable sectors for secure key storage |
| Suspend/resume capability | Allows interrupting erase or program operations to service high-priority reads, critical for real-time OS coexistence |
| CFI-compliant parameter table | Standardized JEDEC CFI structure enables automatic detection and configuration by generic flash drivers |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and real-time control logic in programmable logic controllers deployed in factory automation cabinets. IC Role / Device Role / Timing Role: Primary non-volatile boot memory mapped directly into CPU address space for XIP execution. Use Value: 100 ns random access ensures deterministic boot within 50 ms; 128-KB uniform sectors simplify firmware update partitioning. | Use Scenario: Holding certified boot loader and sensor fusion firmware in automotive camera ECUs requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Secure, high-reliability code storage with OTP-protected cryptographic keys and ECC-protected runtime code. Use Value: Hardware ECC and 20-year data retention meet ISO 26262 ASIL-B functional safety requirements for boot integrity. |
| Network Router Boot Image | Medical Imaging System Configuration |
Use Scenario: Hosting compressed Linux kernel and initramfs in enterprise-grade Layer 3 switches with hot-swap power supplies. IC Role / Device Role / Timing Role: Parallel NOR flash providing low-latency instruction fetch during cold start and failover recovery. Use Value: 512-byte write buffer accelerates field firmware upgrades; sector protection prevents accidental corruption during remote updates. | Use Scenario: Storing calibrated sensor profiles and regulatory-compliant diagnostic routines in portable ultrasound devices. IC Role / Device Role / Timing Role: Non-volatile configuration store retaining calibration data across power cycles and battery swaps. Use Value: 20-year data retention at 85°C ensures accuracy over device lifetime; OTP SSR regions protect FDA-mandated calibration constants. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S12TFN020 | Same density and package, but uses older 65-nm process; 110 ns tACC vs. 100 ns | Lacks hardware ECC and OTP SSR lock; requires external error handling | Select only if legacy design reuse mandates identical command set with relaxed timing and no ECC requirement |
| MX29GL512FHI-12G | Micron equivalent with same 512 Mb density, 100 ns tACC, and CFI compliance; no OTP array | Supports only volatile sector protection; lacks password-protected SSR regions | Choose when cost sensitivity outweighs secure key storage needs and ECC is handled in software |
Compared with S29GL512S12TFN020 and MX29GL512FHI-12G, the S29GL512T12TFN023 delivers superior reliability through on-die ECC and secure OTP storage-critical for safety-certified and long-lifecycle applications where field failure risk must be minimized.
Availability
S29GL512T12TFN023 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and network router boot image applications requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T12TFN023 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for industrial and automotive markets.
The GL-T family targets high-reliability embedded systems needing fast XIP-capable flash with integrated data integrity and security features-designed specifically for boot code, firmware, and configuration storage in harsh environments.
FAQ
Is S29GL512T12TFN023 compatible with legacy S29GL01GT-based designs?
Yes-it shares identical pinout, command set, and timing parameters with the S29GL01GT family in ×16 mode, enabling drop-in replacement in existing TSOP layouts. The 512 Mb density matches the lower half of the 1 Gb variant, preserving address map compatibility for systems using partial memory mapping.
Does this device require external voltage regulators for VIO and VCC?
No-VCC operates from 2.7 V to 3.6 V and powers all internal logic including charge pumps; VIO is independently configurable from 1.65 V to VCC, allowing direct connection to host I/O rails without regulation. No auxiliary supplies or sequencing is needed.
How is the OTP array protected against unauthorized access?
The 2048-byte OTP array is divided into four lockable sectors (SSR0–SSR3); SSR0 is factory-locked and immutable, while SSR3 supports password-based read protection. Locking is performed via dedicated CFI commands and persists after power cycles-no volatile register dependency.
Can sector protection be configured dynamically during runtime?
Yes-both volatile (lock bits cleared on reset) and non-volatile (permanent until explicitly unlocked) sector protection modes are supported. Protection status is controlled per 128-KB sector using CFI-defined commands, enabling field-upgrade-safe partitioning of firmware and configuration regions.
S29GL512T12TFN023 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512T12TFN023 FAQ
1.How can I place an order for S29GL512T12TFN023 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T12TFN023 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T12TFN023 reliable?
The price and inventory of S29GL512T12TFN023 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T12TFN023 is usually 5 days.
3.What payment methods are accepted for S29GL512T12TFN023?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T12TFN023 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T12TFN023?
S29GL512T12TFN023 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T12TFN023 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T12TFN023?
For technical support, including S29GL512T12TFN023 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T12TFN023 requirements.
6.How does Aetrix verify that S29GL512T12TFN023 is sourced from the original manufacturer or authorized distributors?
All S29GL512T12TFN023 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T12TFN023 meets industry standards.
7.What is the process for return or replacement of S29GL512T12TFN023?
All S29GL512T12TFN023 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T12TFN023, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T12TFN023 part is unused and in its original packaging.
Return procedure for S29GL512T12TFN023:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T12TFN023 Tags

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