Infineon Technologies S29GL512T12TFVV20
- Part No.:
- S29GL512T12TFVV20
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512T12TFVV20.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,808
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL512T12TFVV20 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with MIRRORBIT™ technology, designed for embedded code storage and XIP execution in industrial control systems. It operates from 2.7 V to 3.6 V, delivers 100 ns random access time and 15 ns page access time at –40°C to +85°C, and integrates hardware ECC for single-bit error correction.
For engineers reviewing the S29GL512T12TFVV20 datasheet, S29GL512T12TFVV20 pinout, S29GL512T12TFVV20 application, or S29GL512T12TFVV20 equivalent, key selection criteria include its 56-ball VBU fortified BGA (9 mm × 7 mm) package, 128-KB uniform sector erase architecture, OTP array with four lockable SSR regions, and support for Versatile I/O (1.65 V to VCC).
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, suspend/resume, and automatic ECC operations without host CPU intervention.
The flash array uses 45-nm MIRRORBIT™ process technology and supports CFI-compliant identification. Sector protection includes volatile and non-volatile methods per 128-KB sector, and the 2048-byte OTP array features factory-locked SSR0 and password-protected SSR3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for boot code, firmware, and configuration storage in resource-constrained embedded hosts |
| Random access time (tACC) | 100 ns at –40°C to +85°C - enables fast instruction fetch in XIP applications |
| Page access time (tPACC) | 15 ns - accelerates sequential read of instruction blocks or lookup tables |
| Programming buffer | 512 bytes - reduces effective programming time by batching writes without host overhead |
| ECC capability | Hardware single-bit error correction - maintains data integrity without software intervention or latency penalty |
| Endurance & retention | 100,000 program/erase cycles and 20-year data retention - suitable for long-lifecycle industrial deployments |
| Operating voltage | VCC = 2.7 V to 3.6 V, VIO = 1.65 V to VCC - allows interoperability with mixed-voltage SoC interfaces |
Pinout & Package
Package: 56-ball VBU fortified BGA (9 mm × 7 mm), RoHS-compliant, lead-free, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A22 | Address inputs | 23-bit address bus supporting full 512 Mb addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; configurable as ×8 or ×16 via BYTE# pin |
| CE#, OE#, WE# | Chip Enable, Output Enable, Write Enable | Standard asynchronous control signals enabling direct connection to microcontroller memory bus |
| RY/BY# | Ready/Busy output | Open-drain status indicator for polling-based operation during program/erase |
| VCC, VIO, GND | Power supply terminals | Separate core (VCC) and I/O (VIO) supplies allow flexible voltage domain interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - eliminates level shifters when interfacing with 1.8 V or 3.3 V controllers |
| Uniform 128-KB sectors | 512 independent sectors enable fine-grained firmware updates and secure partitioning |
| Suspend/Resume commands | Allows interrupting erase or program operations to service higher-priority reads - critical for real-time response |
| CFI parameter table | Enables runtime detection of device geometry, timing, and command set - simplifies bootloader portability |
| OTP array with SSR locking | 2048-byte one-time-programmable space with four lockable regions - supports secure key storage and calibration data |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and application code for programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability and deterministic 100 ns read latency. Use Value: Eliminates external RAM copy step during boot, reducing startup time and system BOM count. | Use Scenario: Holding calibrated display drivers and safety-critical boot images in automotive digital instrument clusters rated AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with –40°C to +105°C operation and hardware ECC. Use Value: Ensures firmware integrity over vehicle lifetime without requiring periodic refresh or external error-handling logic. |
| Medical Imaging System Configuration | Telecom Base Station Field Upgrade Storage |
Use Scenario: Retaining calibration profiles, sensor compensation tables, and regulatory compliance settings across power cycles in portable ultrasound devices. IC Role / Device Role / Timing Role: Secure, long-retention storage with OTP-protected calibration data and sector-level write protection. Use Value: Prevents accidental overwrite of FDA-cleared parameters while allowing field updates to non-critical firmware sections. | Use Scenario: Hosting field-upgradable protocol stacks and feature modules in carrier-grade 5G base station radios. IC Role / Device Role / Timing Role: High-endurance (100K cycles) flash with suspend/resume for background OTA updates without service interruption. Use Value: Enables concurrent radio operation and firmware patching - no downtime required for maintenance windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S12TFVV20 | Same density and package, but GL-S generation - lacks Versatile I/O and OTP array | No SSR locking or 1.65 V I/O support; limited to fixed 3.3 V interface | Select only if cost sensitivity outweighs I/O flexibility and security requirements |
| MX29GL512FHI-12G | Micron part with identical 512 Mb density, 56-ball VBU BGA, and 100 ns tACC, but no hardware ECC | Requires external error handling or software ECC - increases host CPU load and latency | Prefer when legacy design compatibility is prioritized over built-in data integrity assurance |
Compared with S29GL512S12TFVV20 and MX29GL512FHI-12G, the S29GL512T12TFVV20 uniquely combines hardware ECC, Versatile I/O, and OTP-based security in a single industrial-grade parallel NOR flash - delivering lower system-level complexity for safety-critical and long-life applications.
Availability
S29GL512T12TFVV20 is available at Aetrix Electronics and suitable for industrial PLCs, automotive instrument clusters, medical imaging systems, and telecom base stations requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S29GL512T12TFVV20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive, industrial, and security solutions, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing fast XIP execution, robust data retention, and integrated security - optimized for industrial automation, automotive electronics, and communications infrastructure.
FAQ
What is the maximum operating temperature grade supported by S29GL512T12TFVV20?
The S29GL512T12TFVV20 is qualified for Industrial Plus (–40°C to +105°C) and Extended (–40°C to +125°C) temperature grades. The specific grade depends on ordering code suffixes; this variant's 'T' suffix indicates Industrial Plus qualification, validated per Infineon's reliability testing protocols including HTOL and ESD.
Does S29GL512T12TFVV20 require external voltage regulators for VIO and VCC?
No - VCC and VIO can be supplied from the same 3.3 V rail since VIO supports 1.65 V to VCC. However, separate decoupling capacitors are required per datasheet Section 10.5, and VIO must remain within ±5 % tolerance during active operation to ensure reliable I/O signaling.
How is the OTP array protected against unauthorized access?
The 2048-byte OTP array contains four lockable sectors (SSR0–SSR3). SSR0 is factory-locked and permanently read-only. SSR3 supports password-based read protection using a user-defined 16-byte password stored in the Status Register ASO, enforced by hardware - no software driver required for enforcement.
Can S29GL512T12TFVV20 be used with an 8-bit microcontroller bus?
Yes - the BYTE# pin configures the device for ×8 mode, mapping DQ0–DQ7 as the active data bus. In this mode, DQ8–DQ15 are tri-stated, and address bits A0–A22 remain fully functional for 512 Mb addressing, maintaining compatibility with legacy 8-bit MCU memory interfaces.
S29GL512T12TFVV20 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 120 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512T12TFVV20 FAQ
1.How can I place an order for S29GL512T12TFVV20 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T12TFVV20 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T12TFVV20 reliable?
The price and inventory of S29GL512T12TFVV20 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T12TFVV20 is usually 5 days.
3.What payment methods are accepted for S29GL512T12TFVV20?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T12TFVV20 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T12TFVV20?
S29GL512T12TFVV20 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T12TFVV20 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T12TFVV20?
For technical support, including S29GL512T12TFVV20 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T12TFVV20 requirements.
6.How does Aetrix verify that S29GL512T12TFVV20 is sourced from the original manufacturer or authorized distributors?
All S29GL512T12TFVV20 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T12TFVV20 meets industry standards.
7.What is the process for return or replacement of S29GL512T12TFVV20?
All S29GL512T12TFVV20 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T12TFVV20, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T12TFVV20 part is unused and in its original packaging.
Return procedure for S29GL512T12TFVV20:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T12TFVV20 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

