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Infineon Technologies S29GL512T13DHNV10
- Part No.:
- S29GL512T13DHNV10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T13DHNV10.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,827
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Product details
Overview
S29GL512T13DHNV10 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with MIRRORBIT™ technology, designed for embedded code storage and XIP execution in microcontroller-based systems. It operates from a single 2.7–3.6 V supply, delivers 100 ns random access time at –40°C to +85°C, features a 512-byte write buffer, and supports uniform 128-KB sector erase - used in industrial PLC firmware storage and boot code retention.
For engineers reviewing the S29GL512T13DHNV10 datasheet, S29GL512T13DHNV10 pinout, S29GL512T13DHNV10 application, or S29GL512T13DHNV10 equivalent, key selection criteria include verified 128-KB uniform sector architecture, hardware ECC support for single-bit correction, Versatile I/O (1.65–3.6 V), CFI compliance, and AEC-Q100 Grade 3 qualification for automotive control modules.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, and suspend/resume operations autonomously without host intervention.
The internal hardware ECC engine performs real-time single-bit error correction during read cycles, and the Common Flash Interface (CFI) parameter table enables standardized driver initialization across toolchains. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods per 128-KB block.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full firmware images in mid-tier industrial controllers |
| Random access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution without cache penalty |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch in boot loader routines |
| Write buffer size | 512 bytes - reduces average programming time by >3× vs. single-word writes |
| ECC capability | Single-bit correction per 512-byte sector - maintains data integrity over 20-year retention |
| Endurance | 100,000 program/erase cycles - supports field firmware updates in remote telemetry units |
| Operating voltage (VCC) | 2.7 V to 3.6 V - compatible with 3.3 V logic rails and brown-out tolerant power domains |
| Temperature grade | Industrial Plus (–40°C to +105°C) - qualified for under-hood automotive ECUs and motor drives |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint. Pin-compatible with legacy S29GL series for drop-in replacement in existing PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb decoding (byte/word aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; configurable as ×8 or ×16 via BYTE# pin |
| CE#, OE#, WE# | Chip Enable, Output Enable, Write Enable | Standard asynchronous control signals for timing-critical read/write arbitration |
| RY/BY# | Ready/Busy output | Open-drain status indicator - asserts low during embedded program/erase operations |
| VCC, VIO, GND | Power supplies | VCC = core (2.7–3.6 V); VIO = I/O (1.65–VCC); independent decoupling required |
| RESET# | Hardware reset input | Asynchronous active-low signal to abort operations and return to read mode |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O voltage range | VIO supports 1.65 V to VCC - eliminates level shifters when interfacing with 1.8 V or 3.3 V SoCs |
| Uniform 128-KB sectors | 512 identical sectors enable deterministic firmware partitioning and OTA update rollback |
| Hardware ECC engine | On-the-fly single-bit correction without CPU overhead - critical for safety-critical boot ROMs |
| Suspend/Resume commands | Pause erase or program to service high-priority reads - essential for real-time HMI responsiveness |
| OTP array with SSR locking | 2048-byte one-time programmable region with four lockable sections - stores cryptographic keys and calibration data |
Applications
| Industrial PLC Firmware Storage | Automotive Engine Control Unit (ECU) |
|---|---|
Use Scenario: Storing boot code and runtime firmware in programmable logic controllers deployed in factory automation cabinets. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability and deterministic 100 ns access for real-time task scheduling. Use Value: Eliminates external SRAM requirement for instruction caching; 20-year data retention ensures firmware persistence across equipment lifecycle. | Use Scenario: Holding calibrated engine maps and diagnostic software in AEC-Q100 Grade 3 qualified powertrain ECUs. IC Role / Device Role / Timing Role: Boot ROM with hardware ECC and sector protection to prevent corruption during voltage transients. Use Value: Meets ISO 26262 ASIL-B requirements via built-in error correction and lockable OTP for calibration constants. |
| Medical Imaging System Boot Loader | Telecom Base Station Configuration Memory |
Use Scenario: Storing secure boot firmware and FPGA configuration bitstreams in portable ultrasound devices. IC Role / Device Role / Timing Role: Trusted code repository with password-protected SSR3 region for HIPAA-compliant key storage. Use Value: Prevents unauthorized firmware modification using non-volatile sector protection and factory-locked SSR0. | Use Scenario: Retaining radio parameter tables and protocol stack configurations in outdoor 4G/5G base station radios. IC Role / Device Role / Timing Role: High-reliability configuration store operating continuously at +105°C ambient. Use Value: Industrial Plus temperature rating and 100,000-cycle endurance ensure stable operation over 10+ years of field deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S13DHIV10 | Same density and package, but Industrial grade (–40°C to +85°C) only; no +105°C rating | Lacks extended temperature support - unsuitable for under-hood or high-ambient industrial enclosures | Select when cost sensitivity outweighs thermal margin requirements |
| MX29GL512FHT2I-10G | Macronix part; 100 ns tACC, but no hardware ECC and only 10,000 erase cycles | No built-in error correction - requires external SW ECC or redundant storage layers | Choose for legacy designs where CFI compatibility is sufficient and ECC is handled in software |
Compared with S29GL512S13DHIV10 and MX29GL512FHT2I-10G, the S29GL512T13DHNV10 uniquely combines AEC-Q100 Grade 3 qualification, hardware ECC, and 100,000-cycle endurance - making it the only option qualified for safety-critical automotive boot memory without external error mitigation.
Availability
S29GL512T13DHNV10 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ECU boot memory, and medical imaging system boot loaders requiring stable component supply across long production lifecycles.
Supply support for S29GL512T13DHNV10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The GL-T family targets high-reliability embedded systems requiring XIP-capable flash with robust data integrity - specifically engineered for automotive control modules and industrial edge devices demanding extended temperature operation and long-term firmware retention.
FAQ
Is S29GL512T13DHNV10 pin-compatible with earlier S29GL512P variants?
Yes - it uses the same 56-pin TSOP footprint and identical pinout as S29GL512P13DHIV10 and S29GL512P13DHNV10. The primary differences are process node (45 nm vs. 65 nm), improved tACC/tPACC, and enhanced ECC implementation. No PCB redesign is needed for migration.
Does this device support both ×8 and ×16 data bus modes?
Yes - configured via the BYTE# pin: asserted low for ×8 mode (DQ0–DQ7 active), high for ×16 mode (DQ0–DQ15 active). Address lines A0–A21 remain fully functional in both modes, with A0 ignored in ×16 mode per JEDEC specification.
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte lockable sections within the 2048-byte OTP array. SSR0 is factory-locked and immutable; SSR3 supports password-based read protection. SSR1 and SSR2 are user-lockable for storing calibration data or security keys with irreversible write-once semantics.
How does the Versatile I/O feature simplify system integration?
Versatile I/O allows VIO to operate independently from VCC across 1.65 V to VCC, enabling direct connection to 1.8 V, 2.5 V, or 3.3 V SoC I/O rails without level shifters. This reduces BOM count and signal integrity risk while maintaining full timing compliance per datasheet AC specifications.
S29GL512T13DHNV10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 130 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512T13DHNV10 FAQ
1.How can I place an order for S29GL512T13DHNV10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T13DHNV10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T13DHNV10 reliable?
The price and inventory of S29GL512T13DHNV10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T13DHNV10 is usually 5 days.
3.What payment methods are accepted for S29GL512T13DHNV10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T13DHNV10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T13DHNV10?
S29GL512T13DHNV10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T13DHNV10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T13DHNV10?
For technical support, including S29GL512T13DHNV10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T13DHNV10 requirements.
6.How does Aetrix verify that S29GL512T13DHNV10 is sourced from the original manufacturer or authorized distributors?
All S29GL512T13DHNV10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T13DHNV10 meets industry standards.
7.What is the process for return or replacement of S29GL512T13DHNV10?
All S29GL512T13DHNV10 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T13DHNV10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T13DHNV10 part is unused and in its original packaging.
Return procedure for S29GL512T13DHNV10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T13DHNV10 Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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