My Inquiry
My Account
Infineon Technologies S29GL512T13DHNV13
- Part No.:
- S29GL512T13DHNV13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T13DHNV13.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,209
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29GL512T13DHNV13 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers requiring fast XIP execution and reliable firmware retention.
For engineers reviewing the S29GL512T13DHNV13 datasheet, S29GL512T13DHNV13 pinout, S29GL512T13DHNV13 application, or S29GL512T13DHNV13 equivalent, key selection criteria include verified 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI-compliant interface, and support for suspend/resume during embedded operations.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, and status monitoring without external microcontroller intervention.
The versatile I/O feature enables independent VIO supply (1.65 V to VCC), allowing interoperability with mixed-voltage systems. Hardware ECC operates transparently during read cycles, correcting single-bit errors in real time using internal syndrome generation and correction logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full boot image + firmware partition in industrial gateways |
| Random access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution without cache penalty |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch in burst-read scenarios |
| Write buffer size | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC capability | Single-bit error correction - maintains data integrity without software overhead |
| Sector size | Uniform 128 KB - simplifies firmware update partitioning and wear leveling |
| Data retention | 20 years - ensures long-term reliability in unattended embedded deployments |
| Endurance | 100,000 program/erase cycles - supports field-upgradable firmware with frequent patching |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-142AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 512 Mb linear addressing (byte/word mode) |
| DQ0–DQ15 | Data I/O | Configurable ×8 or ×16 bus; DQ15 functions as BYTE# in ×8 mode |
| CE# | Chip enable | Active-low control enabling device for read/write; tCE = 100 ns max |
| OE# | Output enable | Active-low gating of data outputs during read; tOE = 25 ns max |
| WE# | Write enable | Active-low control for write operations; initiates embedded program/erase algorithms |
| RY/BY# | Ready/Busy output | Open-drain status indicator; low during active program/erase, high when ready |
| VCC | Core supply | 2.7 V to 3.6 V single supply for all operations (read/program/erase) |
| VIO | I/O supply | 1.65 V to VCC - decouples I/O voltage from core, enabling mixed-voltage interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Asynchronous page read | 32-byte burst capability - improves instruction fetch throughput over standard random reads |
| OTP array | 2048-byte one-time programmable space with four lockable SSR regions - enables secure bootloader keys and calibration data storage |
| Advanced sector protection (ASP) | Volatile and non-volatile locking per sector - prevents accidental firmware overwrite during field updates |
| Suspend/Resume | Interruptible program/erase - allows high-priority read access during long-duration erase operations |
| Common Flash Interface (CFI) | Standardized parameter table at known address - enables OS/driver auto-detection without hard-coded timing |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with deterministic 100 ns latency. Use Value: Eliminates need for external RAM copy at startup; 20-year data retention ensures firmware persistence across equipment lifecycle. | Use Scenario: Holding certified boot code and safety-critical sensor fusion firmware in automotive camera ECU modules compliant with AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Automotive-grade parallel NOR flash with –40°C to +105°C operation and hardware ECC for ASIL-B functional safety compliance. Use Value: Single-bit ECC corrects latent bit flips induced by radiation, maintaining firmware integrity without system-level intervention. |
| Network Router Boot Image | Medical Imaging System Configuration |
Use Scenario: Hosting compressed Linux kernel and initramfs in enterprise edge routers requiring rapid cold-boot recovery. IC Role / Device Role / Timing Role: High-speed parallel flash with 15 ns page access enabling fast sequential instruction loading during boot. Use Value: Reduces boot time by >35% compared to legacy 120 ns NOR devices due to optimized page-mode read performance. | Use Scenario: Storing calibrated sensor profiles and DICOM configuration parameters in portable ultrasound units with strict power budget constraints. IC Role / Device Role / Timing Role: Low-power standby mode (100 μA) and single-supply operation simplify power design in battery-backed medical subsystems. Use Value: Enables >72-hour battery hold-up during transport without firmware loss, meeting IEC 62304 Class C data integrity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S13DHIV10 | Same density and architecture but uses 64-ball LAE BGA (9 mm × 9 mm); lacks OTP array and SSR lock capability | Targeted at space-constrained consumer electronics where firmware security is secondary to footprint reduction | Select only if board layout requires BGA and OTP functionality is unused |
| MX29GL512FHT2I-90G | Macronix part with identical 512 Mb density, 90 ns random access, but no hardware ECC or suspend/resume commands | Suitable for cost-sensitive industrial HMIs where firmware update frequency is low and ECC handled in software | Choose only when ECC and interruptible erase are not required in the system architecture |
Compared with S29GL512S13DHIV10 and MX29GL512FHT2I-90G, the S29GL512T13DHNV13 uniquely combines OTP-based secure storage, hardware ECC, and suspend/resume-making it the only option for safety-critical or field-upgradable embedded systems requiring guaranteed firmware integrity and operational flexibility.
Availability
S29GL512T13DHNV13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and network router boot image applications requiring stable component supply across extended product lifecycles.
Supply support for S29GL512T13DHNV13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D centers and ISO/TS 16949-certified manufacturing.
The GL-T family targets high-reliability embedded systems requiring XIP-capable flash with robust data integrity, emphasizing industrial automation, automotive electronics, and networking infrastructure where firmware security and longevity are critical.
FAQ
What is the function of the SSR0–SSR3 regions in the OTP array?
SSR0–SSR3 are four 512-byte lockable sectors within the 2048-byte OTP array. SSR0 is factory-locked and reserved for Infineon use; SSR3 supports password-based read protection. SSR1 and SSR2 can be individually locked via command sequence to store immutable keys or calibration data, preventing overwrite after initial programming.
Does S29GL512T13DHNV13 support both ×8 and ×16 data bus modes?
Yes, it supports configurable ×8 or ×16 operation via the BYTE# pin (DQ15). In ×8 mode, DQ0–DQ7 transfer data and DQ15 acts as BYTE#; in ×16 mode, DQ0–DQ15 operate as a full 16-bit bus. Address lines A0–A21 remain unchanged, with A0 selecting byte lanes in ×8 mode.
How does the suspend/resume feature work during sector erase?
During a sector erase, issuing the Erase Suspend command halts the erase operation and places the device in read mode. Host can then read or program other sectors. Resume command restarts the suspended erase from the exact point of interruption, preserving erase progress without requiring re-initialization.
Is VIO required to be equal to VCC for proper operation?
No. VIO may be set independently between 1.65 V and VCC, enabling interface with 1.8 V or 2.5 V logic while maintaining 3.0 V core operation. This eliminates level-shifter components in mixed-voltage designs, provided setup/hold timing margins are met per AC specifications in the datasheet.
S29GL512T13DHNV13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 130 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512T13DHNV13 FAQ
1.How can I place an order for S29GL512T13DHNV13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T13DHNV13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T13DHNV13 reliable?
The price and inventory of S29GL512T13DHNV13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T13DHNV13 is usually 5 days.
3.What payment methods are accepted for S29GL512T13DHNV13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T13DHNV13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T13DHNV13?
S29GL512T13DHNV13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T13DHNV13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T13DHNV13?
For technical support, including S29GL512T13DHNV13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T13DHNV13 requirements.
6.How does Aetrix verify that S29GL512T13DHNV13 is sourced from the original manufacturer or authorized distributors?
All S29GL512T13DHNV13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T13DHNV13 meets industry standards.
7.What is the process for return or replacement of S29GL512T13DHNV13?
All S29GL512T13DHNV13 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T13DHNV13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T13DHNV13 part is unused and in its original packaging.
Return procedure for S29GL512T13DHNV13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T13DHNV13 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
