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Infineon Technologies S29GL512T13DHNV23
- Part No.:
- S29GL512T13DHNV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
S29GL512T13DHNV23.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 64FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,792
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Product details
Overview
S29GL512T13DHNV23 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory IC with MIRRORBIT™ technology, operating at 3.0 V core supply (2.7–3.6 V), featuring 100 ns random access time, 15 ns page access time, and integrated hardware ECC for single-bit error correction. It supports ×8/×16 data bus, 512-byte write buffer, and uniform 128-KB sector erase - deployed in automotive instrument clusters requiring fast XIP boot code execution and robust data retention.
For engineers reviewing the S29GL512T13DHNV23 datasheet, S29GL512T13DHNV23 pinout, S29GL512T13DHNV23 application, or S29GL512T13DHNV23 equivalent, key selection criteria include industrial-plus temperature grade (–40°C to +105°C), TSOP-56 or FBGA packaging options, Versatile I/O (1.65 V to VCC), AEC-Q100 Grade 2 qualification, and OTP array with four lockable SSR regions.
Technical Context
This device implements an asynchronous parallel interface with byte/word boundary addressing and supports both read and program/erase operations on a single 3.0 V supply. Its embedded algorithm controller (EAC) manages sector erase, buffer programming, suspend/resume, and automatic ECC generation/correction during writes.
The architecture includes dedicated address space overlays (ASOs) for Device ID/CFI, Status Register, Data Polling, SSR (OTP), and ECC status - enabling standardized firmware compatibility and secure one-time programmable region management with factory-locked SSR0 and password-protected SSR3.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images and parameter storage in Tier-1 automotive ECUs |
| Access Time | 100 ns random / 15 ns page - enables real-time XIP execution without CPU wait states |
| Write Buffer | 512 bytes - reduces effective programming time by batching up to 256 words per command |
| ECC | Internal hardware single-bit correction - eliminates need for external ECC logic in safety-critical systems |
| Endurance | 100,000 program/erase cycles - meets long-life requirements for telematics and ADAS log storage |
| Data Retention | 20 years at +85°C - validated for extended vehicle service life under thermal stress |
| Temp Grade | AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for powertrain and chassis control modules |
Pinout & Package
Package: 56-pin Thin Small Outline Package (TSOP), 14 mm × 20 mm, standard JEDEC MO-141AC footprint with lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus supporting full 512 Mb linear addressing (byte/word aligned) |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; configurable as ×8 or ×16 via BYTE# signal |
| CE# | Chip Enable | Active-low chip select controlling device power state and bus contention |
| OE# | Output Enable | Active-low control for data output drivers during read operations |
| WE# | Write Enable | Active-low strobe synchronizing write cycles including command latching and buffer programming |
| RY/BY# | Ready/Busy Output | Open-drain status indicator signaling ongoing embedded operations (erase/program) |
| VCC | Core Supply | 3.0 V ±10% main supply powering logic, memory array, and EAC |
| VIO | I/O Supply | Independent 1.65 V to VCC input for flexible interfacing with 1.8 V or 3.3 V controllers |
Key Features
| Feature | Design Value |
|---|---|
| Versatile I/O (VIO) | Supports mixed-voltage system integration: I/O pins operate from 1.65 V to VCC, decoupling core logic voltage from host interface voltage |
| 512-byte Write Buffer | Enables high-throughput firmware updates - achieves 1.14 MBps sustained programming rate across all temperature grades |
| Uniform 128-KB Sectors | Eliminates complexity of variable-sector architectures; simplifies bootloader partitioning and OTA update management |
| SSR OTP Array | 2048-byte one-time-programmable space with four lockable regions (SSR0–SSR3), enabling secure key storage and calibration data binding |
| CFI Compliance | Standardized Common Flash Interface table allows auto-detection and vendor-agnostic driver initialization in Linux/U-Boot environments |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot code, GUI assets, and configuration parameters in digital dashboards with AEC-Q100 compliance. IC Role / Device Role / Timing Role: Primary XIP-capable flash memory executing firmware directly from address space while supporting field-upgradable calibration tables. Use Value: 100 ns random access ensures zero-latency instruction fetch; 20-year data retention guarantees integrity over vehicle lifetime. | Use Scenario: Holding firmware images and runtime configuration in modular automation controllers exposed to wide ambient temperature swings. IC Role / Device Role / Timing Role: Non-volatile program storage with suspend/resume capability for safe power-loss recovery during field updates. Use Value: Industrial Plus grade (–40°C to +105°C) and 100,000-cycle endurance ensure reliability in uncooled cabinet environments. |
| Medical Imaging Boot Memory | Avionics Display System |
Use Scenario: Hosting certified boot ROM and diagnostic routines in FDA-regulated imaging equipment requiring traceable firmware versions. IC Role / Device Role / Timing Role: Secure, ECC-protected boot memory with OTP-locked security keys preventing unauthorized firmware modification. Use Value: Hardware ECC and SSR-based key binding satisfy IEC 62304 software lifecycle requirements for Class C devices. | Use Scenario: Providing deterministic boot code and display assets in DO-178C-certified cockpit displays where timing predictability is mandatory. IC Role / Device Role / Timing Role: Deterministic parallel interface flash with guaranteed 15 ns page access enabling fixed-latency pixel pipeline initialization. Use Value: TSOP-56 package offers proven reliability and ease of rework in high-integrity assembly lines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S13DHIV23 | Same density and pinout, but Industrial grade (–40°C to +85°C) and no AEC-Q100 qualification | Lacks automotive qualification; suitable only for non-safety-critical industrial or consumer use | Select when cost sensitivity outweighs automotive qualification requirements |
| MX29GL512FHI-90G | Macronix part with 90 ns random access, no integrated ECC, and different command set (non-CFI-compliant) | Requires custom driver development; lacks hardware error correction for safety-critical reads | Choose only if legacy design migration mandates identical timing and no ECC dependency |
Compared with S29GL512S13DHIV23 and MX29GL512FHI-90G, the S29GL512T13DHNV23 uniquely delivers AEC-Q100 Grade 2 qualification, built-in ECC, and CFI compliance - making it the only option qualified for ASIL-B-relevant boot memory in modern automotive ECUs.
Availability
S29GL512T13DHNV23 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLC firmware storage, medical imaging boot memory, and avionics display systems requiring stable component supply across extended lifecycles.
Supply support for S29GL512T13DHNV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and non-volatile memory solutions for safety-critical applications.
The GL-T family targets high-reliability embedded systems needing fast XIP performance and long-term data integrity - specifically designed for automotive, industrial, and medical applications demanding AEC-Q100 or extended temperature operation.
FAQ
Is S29GL512T13DHNV23 pin-compatible with earlier S29GL512P variants?
No. The S29GL512T uses updated 45-nm MIRRORBIT™ process and revised timing specifications, resulting in incompatible AC characteristics and command set extensions. While physical pinout matches TSOP-56 packages, firmware must be updated to support new status register bits, ECC reporting, and SSR lock mechanisms.
Does this device support synchronous burst reads?
No. S29GL512T13DHNV23 implements only asynchronous parallel interface modes: standard read, page read, and CFI query. It does not support clocked burst transfers or QSPI-like protocols. All timing is controlled by CE#, OE#, and WE# handshaking with defined tACC, tPACC, and tCE parameters.
What is the function of the SSR OTP array and how is SSR3 protected?
The 2048-byte SSR OTP array provides four lockable regions (SSR0–SSR3) for secure storage of calibration data, cryptographic keys, or device-specific identifiers. SSR0 is factory-locked; SSR3 requires password authentication before read access, enforced by internal logic that blocks output unless correct 16-bit password is written to the protection register prior to read attempt.
Can VIO and VCC be powered from different supplies during operation?
Yes. VIO may be independently supplied from 1.65 V to VCC, allowing direct interfacing with 1.8 V microcontrollers while maintaining 3.0 V core operation. However, VIO must be stable before VCC ramp-up, and both supplies must remain within specification during all operational modes - including standby, where VIO leakage current impacts total quiescent power.
S29GL512T13DHNV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 130 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-FBGA (9x9)
S29GL512T13DHNV23 FAQ
1.How can I place an order for S29GL512T13DHNV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T13DHNV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T13DHNV23 reliable?
The price and inventory of S29GL512T13DHNV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T13DHNV23 is usually 5 days.
3.What payment methods are accepted for S29GL512T13DHNV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T13DHNV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T13DHNV23?
S29GL512T13DHNV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T13DHNV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T13DHNV23?
For technical support, including S29GL512T13DHNV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T13DHNV23 requirements.
6.How does Aetrix verify that S29GL512T13DHNV23 is sourced from the original manufacturer or authorized distributors?
All S29GL512T13DHNV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T13DHNV23 meets industry standards.
7.What is the process for return or replacement of S29GL512T13DHNV23?
All S29GL512T13DHNV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T13DHNV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T13DHNV23 part is unused and in its original packaging.
Return procedure for S29GL512T13DHNV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T13DHNV23 Tags
-
M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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