Infineon Technologies S29GL512T13TFNV23
- Part No.:
- S29GL512T13TFNV23
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29GL512T13TFNV23.pdf
- Description:
- IC FLASH 512MBIT PARALLEL 56TSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S29GL512T13TFNV23 from Infineon is a 512 Mb (64 MB) parallel NOR flash memory using 45-nm MIRRORBIT™ technology, operating from 2.7 V to 3.6 V with 100 ns random access time and 15 ns page access time. It features a 512-byte write buffer, hardware ECC for single-bit correction, uniform 128-KB sector erase, and supports industrial temperature range (–40°C to +85°C). It is used in boot code storage for network routers and industrial HMIs requiring fast XIP execution and reliable non-volatile storage.
For engineers reviewing the S29GL512T13TFNV23 datasheet, S29GL512T13TFNV23 pinout, S29GL512T13TFNV23 application, or S29GL512T13TFNV23 equivalent, key selection criteria include verified 100,000 program/erase cycles, OTP array with four lockable SSR regions, CFI-compliant interface, and support for suspend/resume during embedded operations - all critical for firmware-resident systems with long lifecycle requirements.
Technical Context
This device implements an asynchronous parallel interface with ×8/×16 data bus configuration and byte/word boundary addressing. Its embedded algorithm controller (EAC) manages program, erase, and status monitoring without external microcontroller intervention.
The hardware ECC engine operates transparently during read operations, correcting single-bit errors in real time while reporting uncorrectable multi-bit errors via status register flags. Sector protection uses both volatile (lock bits) and non-volatile (ASP) methods, with dedicated 2048-byte OTP array partitioned into four SSR regions - SSR0 factory-locked, SSR3 password-protected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 512 Mb (64 MB) - sufficient for full boot firmware + parameter storage in edge gateways |
| Access time (tACC) | 100 ns at –40°C to +85°C - enables direct XIP execution without cache penalty in ARM Cortex-A/M cores |
| Page access time (tPACC) | 15 ns - accelerates sequential instruction fetch during boot initialization |
| Write buffer size | 512 bytes - reduces effective programming time by up to 10× vs. single-word writes |
| ECC capability | Single-bit error correction with detection of multi-bit errors - ensures firmware integrity without software overhead |
| Endurance | 100,000 program/erase cycles - supports field firmware updates over 10+ years in industrial controllers |
| Data retention | 20 years at +85°C - meets long-term reliability requirements for sealed automotive ECUs |
Pinout & Package
Package: 56-pin TSOP (Thin Small Outline Package), 14 mm × 20 mm, standard JEDEC MO-141AC footprint, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address inputs | 21-bit address bus supporting full 512 Mb linear addressing with byte/word alignment |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional bus; configurable as ×8 or ×16 mode via BYTE# pin |
| CE# | Chip enable | Active-low enable controlling device selection in multi-chip memory subsystems |
| OE# | Output enable | Active-low control for data output gating; used with CE# for timing-critical read strobes |
| WE# | Write enable | Active-low signal initiating internal program/erase algorithms when combined with command sequences |
| RY/BY# | Ready/Busy indicator | Open-drain output signaling active embedded operation; allows host CPU to poll or interrupt on completion |
| VCC | Core supply | 2.7 V to 3.6 V single supply powering logic and memory array; no separate VIO required in full VCC mode |
| VIO | I/O supply | 1.65 V to VCC versatile I/O voltage - enables direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC engine | Real-time single-bit correction with status flag reporting - eliminates need for software-based checksum layers in safety-critical boot paths |
| 512-byte write buffer | Enables burst programming of up to 512 bytes per command - cuts typical firmware update time by >70% vs. legacy NOR devices |
| Uniform 128-KB sectors | 64 identical erase blocks simplify BOM management and reduce partitioning complexity in bootloader design |
| OTP array with SSR locking | Four independent 512-byte lockable regions (SSR0–SSR3); SSR0 factory-locked for secure root keys, SSR3 password-protected for customer secrets |
| Suspend/Resume commands | Allows interruption of erase or program operations to service high-priority reads - essential for real-time HMI responsiveness |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot loader, FPGA configuration bitstream, and runtime parameters in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: Non-volatile boot memory providing XIP-capable instruction fetch with deterministic 100 ns latency for real-time task scheduling. Use Value: 20-year data retention at +85°C ensures firmware integrity across extended maintenance cycles without recalibration or reprogramming. | Use Scenario: Holding certified boot code and sensor calibration data in front-camera modules complying with AEC-Q100 Grade 2 (–40°C to +105°C). IC Role / Device Role / Timing Role: Safety-critical boot ROM with hardware ECC and OTP-secured calibration constants for ISO 26262 ASIL-B compliance. Use Value: Factory-locked SSR0 stores immutable root-of-trust keys; password-protected SSR3 isolates customer-specific calibration data from field updates. |
| Network Edge Router Boot Flash | Medical Imaging System Parameter Storage |
Use Scenario: Hosting U-Boot, Linux kernel, and device tree binaries in carrier-grade edge routers requiring zero-downtime firmware upgrades. IC Role / Device Role / Timing Role: High-reliability parallel NOR flash enabling atomic sector updates and suspend/resume during live traffic processing. Use Value: 100,000 erase cycles support >200 firmware revisions over product lifetime; CFI table simplifies auto-detection in heterogeneous board designs. | Use Scenario: Retaining DICOM configuration profiles, gamma correction tables, and regulatory audit logs in FDA-cleared ultrasound systems. IC Role / Device Role / Timing Role: Secure, long-life parameter store with tamper-resistant OTP regions for HIPAA-compliant data persistence. Use Value: Non-volatile sector protection prevents accidental overwrite of clinical calibration data during routine service mode operations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL512S13TFIV20 | Same density and package, but rated for industrial plus (–40°C to +105°C); slightly higher tACC (110 ns) | Required for extended temperature environments like under-hood automotive or outdoor base stations | Select when ambient operating temperature exceeds +85°C but does not require AEC-Q100 qualification |
| MX29GL512FHT2I-90G | Macronix part; 90 ns tACC, no integrated ECC, requires external error handling logic | Lacks hardware ECC and OTP security features - suitable only for cost-sensitive, non-safety applications | Choose only if firmware integrity is managed in software and temperature range is strictly industrial (–40°C to +85°C) |
Compared with S29GL512S13TFIV20, this part offers tighter timing at lower temperature cost; versus MX29GL512FHT2I-90G, it delivers built-in ECC and secure OTP - eliminating design risk in safety- or security-critical deployments.
Availability
S29GL512T13TFNV23 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and network edge router boot flash requiring stable component supply across multi-year production programs.
Supply support for S29GL512T13TFNV23 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The GL-T family targets high-reliability embedded systems needing fast XIP execution and robust firmware storage - designed specifically for industrial automation, automotive ECUs, and networking infrastructure where data integrity and long-term availability are mandatory.
FAQ
What is the purpose of the SSR OTP array in S29GL512T13TFNV23?
The 2048-byte SSR (Sector Security Register) OTP array provides four lockable 512-byte regions (SSR0–SSR3) for storing immutable or protected data. SSR0 is factory-locked for root keys; SSR3 supports password-based read protection. This enables secure boot key storage and customer-specific calibration data isolation without external secure elements.
Does S29GL512T13TFNV23 support both ×8 and ×16 data bus modes?
Yes - the device supports configurable ×8 or ×16 operation via the BYTE# pin. When BYTE# is low, DQ0–DQ7 operate as an 8-bit bus; when high, DQ0–DQ15 function as a 16-bit bus. Address lines A0–A20 remain unchanged in both modes, with word-aligned addressing maintained automatically.
How does the suspend/resume feature improve system responsiveness?
Suspend/resume allows active program or erase operations to be paused mid-execution, enabling immediate servicing of high-priority read requests. After completion of the read, the suspended operation resumes from its exact state. This prevents UI freezes in HMIs or packet loss in real-time networking stacks during background flash updates.
Is the 512-byte write buffer usable across sector boundaries?
No - the 512-byte write buffer must be programmed within a single 128-KB sector. Buffer programming is limited to page-aligned addresses inside one sector; crossing sector boundaries triggers automatic termination and requires separate buffer loads per sector. This ensures erase granularity remains predictable and avoids unintended block erases.
S29GL512T13TFNV23 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- GL-T
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 130 ns
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
S29GL512T13TFNV23 FAQ
1.How can I place an order for S29GL512T13TFNV23 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29GL512T13TFNV23 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29GL512T13TFNV23 reliable?
The price and inventory of S29GL512T13TFNV23 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29GL512T13TFNV23 is usually 5 days.
3.What payment methods are accepted for S29GL512T13TFNV23?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29GL512T13TFNV23 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29GL512T13TFNV23?
S29GL512T13TFNV23 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29GL512T13TFNV23 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29GL512T13TFNV23?
For technical support, including S29GL512T13TFNV23 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29GL512T13TFNV23 requirements.
6.How does Aetrix verify that S29GL512T13TFNV23 is sourced from the original manufacturer or authorized distributors?
All S29GL512T13TFNV23 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29GL512T13TFNV23 meets industry standards.
7.What is the process for return or replacement of S29GL512T13TFNV23?
All S29GL512T13TFNV23 units undergo pre-shipment inspection (PSI). If there is an issue with S29GL512T13TFNV23, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29GL512T13TFNV23 part is unused and in its original packaging.
Return procedure for S29GL512T13TFNV23:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29GL512T13TFNV23 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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