Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S29JL032J60BHI323

Part No.:
S29JL032J60BHI323
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixS29JL032J60BHI323.pdf
Description:
IC FLASH 32MBIT PARALLEL 48FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,938

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S29JL032J60BHI323 from Infineon Technologies (formerly Cypress) is a 32-Mb simultaneous read/write flash memory organized as 4M × 8-bit or 2M × 16-bit, operating at 3.0 V only, with 60 ns access time, four-bank architecture, and boot sector configuration. It enables zero-latency background erase/program while reading from another bank-used in industrial HMI firmware storage where real-time UI responsiveness must be maintained during field updates.

For engineers reviewing the S29JL032J60BHI323 datasheet, S29JL032J60BHI323 pinout, S29JL032J60BHI323 application, or S29JL032J60BHI323 equivalent, key selection criteria include simultaneous bank operation support, Secured Silicon Region (256-byte OTP), JEDEC CFI compliance, hardware write protection via WP#/ACC, and FBGA-48 package compatibility with high-density embedded PCB layouts.

Technical Context

The device implements a true four-bank architecture with fixed sector addresses, allowing any non-busy bank to be read during erase/program of another-enabling deterministic zero-latency interleaving. Bank switching is managed entirely by address decoding; no external arbitration logic is required.

It integrates dual power management modes: automatic sleep (200 nA) triggered by address stability, and standby mode (200 nA), both leveraging on-chip voltage regulation for 3.0 V-only operation. The Secured Silicon Region provides factory-locked 16-byte ESN plus customer-lockable 256-byte OTP space accessible only via dedicated command sequences.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 32 Mb (4,194,304 × 8-bit or 2,097,152 × 16-bit); supports byte/word mode selection via BYTE# pin.
Access Time 60 ns max (tACC); enables direct interface with 16-bit microcontrollers running at ≤16 MHz without wait states.
Banks Four independent banks; allows concurrent read from one bank while erasing/programming another-no software overhead for bank arbitration.
Power Consumption 2 mA active read current at 1 MHz; 200 nA standby/automatic sleep current-reduces system-level power budget in battery-backed controllers.
Erase Endurance 100,000 cycles per sector; validated for firmware update partitions subject to daily field upgrades over 10+ years.
Data Retention 20 years typical at 125 °C; qualified for automotive under-hood and industrial control environments.
Interface Standard JEDEC 42.4 single-power-supply command set; ensures drop-in compatibility with existing CFI-aware bootloaders and flash utilities.

Pinout & Package

Package: 48-ball Fine-pitch BGA (VBK048 footprint, 0.8 mm pitch, 7.0 mm × 9.0 mm body). RoHS-compliant, lead-free, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
A0–A20 Address Inputs 21-bit address bus supporting full 4M-byte or 2M-word addressing; A-1 used only in word mode for DQ15/A-1 multiplexing.
DQ0–DQ15 Data I/O (16-bit) Bidirectional data bus; DQ7/DQ6/DQ2 provide status polling/toggling; DQ3 indicates sector erase timer expiration.
CE#, OE#, WE# Chip/Output/Write Enable Standard asynchronous control signals; CE# gating enables low-power deselection; OE#/WE# timing defines read/write cycle boundaries.
RY/BY# Ready/Busy Output Active-low open-drain signal indicating internal program/erase completion-used for hardware flow control without polling.
RESET# Hardware Reset Input Asynchronous active-low input forcing device into read mode; resets internal state machine and aborts ongoing operations.
WP#/ACC Write Protect / Acceleration WP# permanently protects top/bottom boot sectors; ACC enables accelerated programming (6 µs/word typical).
BYTE# Byte/Word Mode Select High = 16-bit word mode (DQ15–DQ0); Low = 8-bit byte mode (DQ7–DQ0); determines data bus width and address mapping.
VCC, VSS Power Supply Single 3.0 V supply (2.7–3.6 V range); internally generates all high-voltage programming/erasure voltages-no external charge pump required.

Key Features

Feature Design Value
Erase Suspend/Resume Halts active sector erase to service read/program requests elsewhere-enables true background firmware patching without interrupt latency.
Secured Silicon Region 256-byte OTP sector with factory-locked 16-byte ESN; customer-lockable for secure bootloader keys or calibration data-verified via autoselect command.
Zero-Power Operation Automatic sleep mode draws only 200 nA after address stability; eliminates need for external power-gating circuitry in always-on edge nodes.
Hardware Sector Protection Independent lock bits per sector; WP# pin adds permanent protection for boot code regions-prevents accidental overwrite during field updates.
Simultaneous Read/Write Two-bank concurrency (max) with zero-latency handoff; sustains 100% read bandwidth during background erase-critical for real-time diagnostics logging.

Applications

Industrial PLC Firmware Storage Automotive ADAS Boot Memory

Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers with live I/O monitoring.

IC Role / Device Role / Timing Role: Nonvolatile code storage with in-system reprogrammability; serves as primary boot and application image repository.

Use Value: Simultaneous read/write allows continuous scan-cycle execution while loading new firmware-eliminates machine downtime during updates.

Use Scenario: Holding boot code and safety-critical sensor fusion algorithms in camera-based driver assistance modules.

IC Role / Device Role / Timing Role: Secure, high-reliability boot memory with Secured Silicon Region storing cryptographic keys for verified boot.

Use Value: 20-year data retention at 125 °C ensures integrity across vehicle lifetime; hardware sector protection prevents corruption during ECU reset events.

Medical Imaging Control Panel Smart Energy Meter Firmware

Use Scenario: Hosting GUI assets and real-time control firmware in portable ultrasound devices requiring instant UI response.

IC Role / Device Role / Timing Role: Dual-mode (8/16-bit) flash interfacing directly with ARM Cortex-M7 MCU; supports fast pixel buffer reads during display refresh.

Use Value: 60 ns access time and zero-latency bank interleaving prevent frame stutter during concurrent firmware validation and screen rendering.

Use Scenario: Storing metrology firmware and tariff tables in ANSI C12.22-compliant smart meters deployed in remote grid substations.

IC Role / Device Role / Timing Role: Field-upgradable code storage with hardware write protection; retains data through frequent brownout conditions.

Use Value: 200 nA automatic sleep current extends backup battery life beyond 10 years; JEDEC CFI compatibility simplifies firmware deployment across meter families.

Equivalent & Alternatives

The following parts are listed as comparable options for similar flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL032N90TFI020 45 nm process, 90 ns access, 3 V, 32 Mb; lacks Secured Silicon Region and simultaneous read/write capability. Lower performance; suitable for cost-sensitive, non-real-time firmware storage where background operation is unnecessary. Select when absolute lowest bill-of-materials cost is prioritized over zero-latency update capability.
MX29GL320EBTI-90G 32 Mb, 90 ns, 3 V; supports CFI but uses legacy command set-no erase suspend/resume or boot sector flexibility. Legacy design reuse; requires firmware modification to replace S29JL032J's advanced features like WP#/ACC acceleration. Choose only for drop-in replacement in existing designs already using Macronix command syntax and tolerating longer program times.

Compared with S29GL032N90TFI020 and MX29GL320EBTI-90G, the S29JL032J60BHI323 uniquely delivers zero-latency bank interleaving and factory-verified Secured Silicon Region-making it the only option for real-time firmware updates with cryptographic binding in safety-certified systems.

Availability

S29JL032J60BHI323 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, medical imaging control panels, and smart energy meter firmware requiring stable component supply across multi-year production cycles.

Supply support for S29JL032J60BHI323 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, connectivity, and security solutions for industrial, automotive, and IoT markets.

The S29JL032J belongs to Infineon's high-reliability parallel NOR flash product line, designed specifically for mission-critical embedded systems requiring deterministic real-time firmware updates, secure boot, and extended temperature operation.

FAQ

What is the function of the BYTE# pin on the S29JL032J60BHI323?

The BYTE# pin selects between 8-bit and 16-bit data bus operation: logic high configures the device for 16-bit word mode (DQ15–DQ0 active), while logic low enables 8-bit byte mode (DQ7–DQ0 active). This pin determines address-to-data mapping-A0–A20 in word mode accesses 2M words, whereas in byte mode the same pins address 4M bytes. It must be held stable during power-up and remains latched throughout operation.

How does the Secured Silicon Region differ from standard flash sectors?

The Secured Silicon Region is a dedicated 256-byte sector with two distinct lock states: factory-locked (16-byte ESN pre-programmed and verifiable via autoselect) and customer-lockable (one-time programmable OTP). Unlike standard sectors, it cannot be erased once locked, and access requires explicit entry/exit command sequences-not standard read/write commands. Its contents survive full chip erase and are electrically isolated from main array wear leveling.

Can the S29JL032J60BHI323 perform simultaneous read and write across all four banks?

No-only two banks may operate concurrently: one for read, one for erase or program. The four-bank architecture enables flexible partitioning (e.g., two banks for code, two for data), but hardware limits simultaneous activity to exactly two banks. Attempting concurrent operations on more than two banks results in undefined behavior or command rejection; the device status registers will not acknowledge additional pending operations.

What is the role of the WP#/ACC pin during programming?

WP# (Write Protect) disables programming/erasure of the top and bottom boot sectors regardless of software sector protection settings-providing hardware-enforced immunity against accidental overwrite of boot code. ACC (Acceleration) mode, activated by driving WP#/ACC high during programming, reduces typical word-program time from 12 µs to 6 µs using boosted internal voltages-critical for minimizing field update duration in time-constrained systems.

S29JL032J60BHI323 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
JL-J
Package/Case:
48-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
32Mbit
Memory Organization:
4M x 8, 2M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
60ns
Access Time:
60 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-FBGA (8.15x6.15)

S29JL032J60BHI323 FAQ

1.How can I place an order for S29JL032J60BHI323 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29JL032J60BHI323 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29JL032J60BHI323 reliable?

The price and inventory of S29JL032J60BHI323 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29JL032J60BHI323 is usually 5 days.

3.What payment methods are accepted for S29JL032J60BHI323?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29JL032J60BHI323 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29JL032J60BHI323?

S29JL032J60BHI323 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29JL032J60BHI323 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29JL032J60BHI323?

For technical support, including S29JL032J60BHI323 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29JL032J60BHI323 requirements.

6.How does Aetrix verify that S29JL032J60BHI323 is sourced from the original manufacturer or authorized distributors?

All S29JL032J60BHI323 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29JL032J60BHI323 meets industry standards.

7.What is the process for return or replacement of S29JL032J60BHI323?

All S29JL032J60BHI323 units undergo pre-shipment inspection (PSI). If there is an issue with S29JL032J60BHI323, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29JL032J60BHI323 part is unused and in its original packaging.

Return procedure for S29JL032J60BHI323:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S29JL032J60BHI323 Tags

  • S29JL032J60BHI323
  • S29JL032J60BHI323 PDF
  • S29JL032J60BHI323 Datasheet
  • S29JL032J60BHI323 Specifications
  • S29JL032J60BHI323 Images
  • Infineon Technologies
  • Infineon Technologies S29JL032J60BHI323
  • Buy S29JL032J60BHI323
  • S29JL032J60BHI323 Price
  • S29JL032J60BHI323 Distributor
  • S29JL032J60BHI323 Supplier
  • S29JL032J60BHI323 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER