My Inquiry
My Account
Infineon Technologies S29JL032J60TFI220
- Part No.:
- S29JL032J60TFI220
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29JL032J60TFI220.pdf
- Description:
- IC FLASH 32MBIT PARALLEL 48TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,561
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29JL032J60TFI220 from Infineon Technologies (formerly Cypress) is a 32-Mb simultaneous read/write flash memory organized as 4M × 8-bit or 2M × 16-bit, operating at 3.0 V only, with 60 ns access time, four-bank architecture, and boot sector configuration. It enables zero-latency background erase/program while reading from another bank in embedded boot code storage, firmware update partitions, and industrial HMI firmware storage.
For engineers reviewing the S29JL032J60TFI220 datasheet, S29JL032J60TFI220 pinout, S29JL032J60TFI220 application, or S29JL032J60TFI220 equivalent, key selection criteria include simultaneous bank operation support, secured silicon region (256-byte OTP), JEDEC CFI compliance, hardware write protection via WP#/ACC, and FBGA/TSOP package compatibility for space-constrained PCB layouts.
Technical Context
The S29JL032J60TFI220 implements a true dual-bank (or four-bank) flash architecture where erase/program operations in one bank occur concurrently with read operations in another, eliminating wait states. Its internal state machine supports CFI-compliant command sets, autoselect mode, and erase suspend/resume functionality.
It integrates hardware features including RY/BY# status signaling, RESET# pin for forced read-mode recovery, BYTE# control for 8-/16-bit data width selection, and WP#/ACC pin enabling both write protection and accelerated programming. Power management includes automatic sleep mode (200 nA) and zero-power standby.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mb (4,194,304 × 8-bit or 2,097,152 × 16-bit), enabling full firmware image storage for mid-tier microcontrollers. |
| Access Time (tACC) | 60 ns - guarantees deterministic timing for real-time boot code fetch in automotive and industrial controllers. |
| Banks | Four independent banks - allows concurrent read from Bank 0 while erasing Bank 2, improving system responsiveness. |
| Supply Voltage | 3.0–3.6 V single supply - eliminates need for voltage translators and simplifies power rail design. |
| Standby Current | 200 nA - meets ultra-low-power requirements for battery-backed firmware storage and always-on systems. |
| Erase Endurance | 100,000 cycles per sector - supports field firmware updates over 10+ years in deployed equipment. |
| Data Retention | 20 years typical - ensures long-term reliability of calibration data and security keys in secured silicon region. |
Pinout & Package
Package: 48-ball Fine-pitch BGA (VBK048), 0.8 mm pitch, 8 mm × 10 mm footprint, RoHS-compliant, suitable for high-density routing and thermal performance in industrial modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 4M-byte or 2M-word addressing; A-1 used only in byte mode for DQ15/A-1 multiplexing. |
| DQ0–DQ15 | Data I/O (16-bit) / DQ0–DQ7 (8-bit) | Bidirectional data bus; BYTE# pin selects 8-bit (DQ7–DQ0) or 16-bit (DQ15–DQ0) mode; supports JEDEC-standard read/write timing. |
| CE#, WE#, OE# | Chip Enable / Write Enable / Output Enable | Standard asynchronous control signals; CE# gating enables low-power deselection; OE# controls output driver enable to prevent bus contention. |
| RY/BY# | Ready/Busy Output | Active-low open-drain signal indicating ongoing program/erase; used for hardware flow control without polling overhead. |
| WP#/ACC | Write Protect / Acceleration Input | Hardware-level boot sector lock (WP#) and +5V acceleration pulse (ACC) for sub-6 µs word programming - reduces firmware update latency. |
| RESET# | Hardware Reset Input | Asynchronous active-low reset forcing device into read mode - critical for recovery after brown-out or watchdog timeout. |
| BYTE# | Bus Width Select | High = 16-bit mode (DQ15–DQ0); Low = 8-bit mode (DQ7–DQ0); enables flexible interface with 8-bit or 16-bit host processors. |
Key Features
| Feature | Design Value |
|---|---|
| Simultaneous Read/Write | Zero-latency concurrent operation across banks - eliminates CPU idle cycles during firmware updates. |
| Secured Silicon Region | 256-byte OTP sector with factory-locked ESN and customer-lockable code area - enables secure boot key storage and anti-cloning. |
| Erase Suspend/Resume | Pause erase to service urgent read/program requests in non-erasing sectors - essential for real-time interrupt handling in safety-critical firmware. |
| JEDEC CFI Compliance | Standardized query table at fixed address - enables auto-detection and generic flash driver reuse across platforms. |
| Hardware Sector Protection | Individual sector lock via WP# and command sequence - prevents accidental overwrite of bootloader or calibration data in field-deployed units. |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
|
Use Scenario: Storing and updating ladder logic firmware and I/O configuration tables in programmable logic controllers with no downtime. IC Role / Device Role / Timing Role: Non-volatile boot and application code storage with simultaneous read during background firmware patching. Use Value: Enables hot firmware updates without halting PLC scan cycle - maintains continuous process control during maintenance windows. |
Use Scenario: Hosting boot code and graphics assets for digital instrument clusters requiring fast startup and OTA updates. IC Role / Device Role / Timing Role: Primary boot flash with top-boot sector protecting bootloader and bottom sectors for updatable UI assets. Use Value: 60 ns access ensures sub-100 ms boot time; secured silicon region stores cryptographic keys for signed firmware verification. |
| Medical Device Calibration Data Archive | Smart Energy Meter Firmware Partitioning |
|
Use Scenario: Retaining sensor calibration coefficients and regulatory audit logs across device power cycles and field recalibrations. IC Role / Device Role / Timing Role: High-reliability, long-retention storage partition isolated via hardware sector protection. Use Value: 20-year data retention and 100K erase cycles ensure calibration integrity over full product lifecycle - compliant with IEC 62304. |
Use Scenario: Segregating metering firmware, tariff tables, and communication stack in utility-grade smart meters with remote update capability. IC Role / Device Role / Timing Role: Dual-bank architecture isolates active firmware (Bank 0) from update staging area (Bank 1) for atomic OTA rollouts. Use Value: Erase suspend allows immediate response to time-critical meter reading interrupts during background firmware download. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL032N90TFI010 | 65 nm process, 90 ns access, 3.0 V only, same 32 Mb density but no secured silicon region. | Lacks OTP sector and factory ESN - unsuitable for secure boot or anti-counterfeiting use cases. | Select when cost sensitivity outweighs security requirements and slower access time is acceptable. |
| MX29GL320EHT2I-90G | Micron part, 90 ns, 32 Mb, JEDEC CFI compatible, but no simultaneous read/write or erase suspend. | Single-bank architecture requires full device stall during erase - incompatible with real-time interrupt servicing. | Choose only for legacy designs where background operation is not required and Micron supply chain alignment is mandatory. |
Compared with S29GL032N90TFI010 and MX29GL320EHT2I-90G, the S29JL032J60TFI220 uniquely delivers zero-latency concurrent operation, secured silicon for cryptographic key storage, and erase suspend - making it the only viable option for safety-critical, update-capable embedded systems requiring deterministic timing and tamper resistance.
Availability
S29JL032J60TFI220 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical device calibration data archive requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for S29JL032J60TFI220 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and secure microcontrollers.
The S29JL032J belongs to Infineon's legacy Cypress flash memory portfolio, designed specifically for embedded systems requiring robust, in-system programmable non-volatile storage with real-time operational flexibility and security features.
FAQ
Does S29JL032J60TFI220 support both 8-bit and 16-bit data bus widths?
Yes. The BYTE# pin configures the device for either 8-bit (DQ7–DQ0) or 16-bit (DQ15–DQ0) operation. When BYTE# is low, only DQ7–DQ0 are active; when high, all 16 data lines function. This allows direct interfacing with both 8-bit microcontrollers and 16-bit DSPs without external glue logic.
What is the purpose of the WP#/ACC pin beyond write protection?
The WP#/ACC pin serves dual functions: as WP#, it permanently protects boot sectors from accidental erase/program; as ACC, it accepts a +5 V pulse to activate accelerated programming mode, reducing typical word program time from 12 µs to 6 µs. This acceleration is critical for minimizing firmware update duration in time-sensitive applications.
How does the Secured Silicon Region differ from standard flash sectors?
The Secured Silicon Region is a dedicated 256-byte sector with factory-programmed 16-byte electronic serial number and customer-lockable OTP capability. Once locked, its contents cannot be altered - unlike standard sectors, which support full erase/program cycles. It is accessed via specific CFI commands and verified using the DQ6 indicator bit.
Can S29JL032J60TFI220 operate reliably at 2.7 V?
No. The S29JL032J60TFI220 is rated for 3.0–3.6 V only. While some variants (e.g., S29JL032J70) support 2.7–3.6 V, this specific speed grade (60 ns) requires minimum 3.0 V for guaranteed timing and erase/program functionality. Operation below 3.0 V may result in failed writes or incomplete erases.
S29JL032J60TFI220 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- JL-J
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8, 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 60ns
- Access Time:
- 60 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
S29JL032J60TFI220 FAQ
1.How can I place an order for S29JL032J60TFI220 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29JL032J60TFI220 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29JL032J60TFI220 reliable?
The price and inventory of S29JL032J60TFI220 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29JL032J60TFI220 is usually 5 days.
3.What payment methods are accepted for S29JL032J60TFI220?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29JL032J60TFI220 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29JL032J60TFI220?
S29JL032J60TFI220 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29JL032J60TFI220 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29JL032J60TFI220?
For technical support, including S29JL032J60TFI220 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29JL032J60TFI220 requirements.
6.How does Aetrix verify that S29JL032J60TFI220 is sourced from the original manufacturer or authorized distributors?
All S29JL032J60TFI220 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29JL032J60TFI220 meets industry standards.
7.What is the process for return or replacement of S29JL032J60TFI220?
All S29JL032J60TFI220 units undergo pre-shipment inspection (PSI). If there is an issue with S29JL032J60TFI220, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29JL032J60TFI220 part is unused and in its original packaging.
Return procedure for S29JL032J60TFI220:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29JL032J60TFI220 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
