Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S29JL032J60TFI423

Name: S29JL032J60TFI423
Brand: Infineon Technologies
SKU: S29JL032J60TFI423
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: S29JL032J60TFI423

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 48-TFSOP (0.724", 18.40mm Width)

Datasheet:: S29JL032J60TFI423.pdf

Description:: IC FLASH 32MBIT PARALLEL 48TSOP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:4,597

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

S29JL032J60TFI423 from Infineon Technologies (formerly Cypress) is a 32-Mb simultaneous read/write flash memory organized as 4M × 8-bit or 2M × 16-bit, operating at 3.0 V only, with 60 ns access time, four-bank architecture, and boot sector configuration. It enables zero-latency background erase/program while reading from another bank, supporting embedded firmware storage in industrial controllers and network edge devices.

For engineers reviewing the S29JL032J60TFI423 datasheet, S29JL032J60TFI423 pinout, S29JL032J60TFI423 application, or S29JL032J60TFI423 equivalent, key selection criteria include simultaneous bank operation support, secured silicon region (256-byte OTP), JEDEC CFI compliance, hardware write protection via WP#/ACC, and FBGA/TSOP package compatibility for space-constrained PCB layouts.

Technical Context

The S29JL032J60TFI423 implements a true four-bank flash architecture where two banks operate concurrently-one for read, one for erase or program-enabling real-time firmware updates without halting host execution. Each bank supports independent sector erase and byte/word programming under common 3.0 V supply.

It integrates JEDEC-standard Common Flash Interface (CFI) for automatic device identification, supports erase suspend/resume for interruptible background operations, and includes dual status detection: RY/BY# pin and DQ7/DQ6/DQ2 polling/toggle bits for precise cycle completion monitoring.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	32 Mb (4M × 8-bit / 2M × 16-bit); enables full bootloader + application image storage in single device
Access Time	60 ns (tACC); meets timing requirements for 16-bit microcontroller interfaces running ≤16 MHz
Banks	Four independent banks; allows concurrent read from one bank while erasing/programming another
Power Supply	3.0 V only (2.7–3.6 V range); eliminates need for dual-voltage rails in modern low-power systems
Standby Current	200 nA; enables ultra-low-power retention in battery-backed or energy-harvesting applications
Erase Endurance	100,000 cycles per sector; supports field firmware updates over 10+ years of industrial deployment
Data Retention	20 years typical; ensures long-term reliability for unattended infrastructure equipment

Pinout & Package

Package: 48-ball Fine-pitch BGA (VBK048 footprint). Pinout validated per Infineon Document 002-00857 Rev. *J, Figure 4.2 and Table 5.

Pin/Terminal	Circuit Role	Design Meaning
A0–A20	Address Inputs	21-bit address bus supporting full 4M-byte or 2M-word addressing; BYTE# selects 8-/16-bit mode
DQ0–DQ15	Data I/O	16-bit bidirectional data bus; DQ7–DQ0 used in byte mode, DQ15–DQ0 in word mode
CE#, OE#, WE#	Chip/Output/Write Enable	Standard JEDEC control signals; prevent bus contention and define read/write timing windows
RY/BY#	Ready/Busy Output	Active-low hardware status signal indicating active program/erase; enables deterministic interrupt-driven polling
WP#/ACC	Write Protect / Acceleration	Hardware lock for top/bottom boot sectors; ACC mode reduces program time to 6 µs/word
RESET#	Hardware Reset	Asynchronous reset of internal state machine to read mode; required for recovery after power-up or error
BYTE#	Bus Width Select	Configures interface as 8-bit (BYTE# = LOW) or 16-bit (BYTE# = HIGH); no external glue logic needed

Key Features

Feature	Design Value
Simultaneous Read/Write	Zero-latency interleaving across four banks enables real-time firmware patching without CPU stall
Secured Silicon Region	256-byte OTP sector with factory-locked ESN and customer-lockable code storage for secure boot keys
Erase Suspend/Resume	Pause background erase to service urgent read/write requests in unprotected sectors, then resume
Zero-Power Operation	Automatic sleep mode draws only 200 nA when addresses stable >100 µs, critical for always-on IoT nodes
Hardware Sector Protection	Independent lock/unlock of any sector group via WP# or command sequence, preventing accidental corruption

Applications

Industrial PLC Firmware Storage

Telecom Baseband Processor Code

Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers deployed in factory automation lines.

IC Role / Device Role / Timing Role: Nonvolatile code storage with in-system reprogrammability; supports hot firmware swap during runtime using bank interleaving.

Use Value: Eliminates downtime for firmware upgrades; 100K erase cycles ensure >10 years of field updates under daily maintenance schedules.

Use Scenario: Holding boot code and DSP configuration tables for LTE/5G baseband processors in remote radio units.

IC Role / Device Role / Timing Role: Boot memory mapped to processor's address space; 60 ns access satisfies tight timing budgets for cold start sequences.

Use Value: Secured Silicon Region stores cryptographic keys; hardware WP# prevents tampering during field servicing.

Medical Imaging System Bootloader

Smart Grid RTU Configuration

Use Scenario: Hosting certified bootloader and safety-critical initialization routines in MRI and CT scanner control modules.

IC Role / Device Role / Timing Role: Trusted boot source verified at power-on; CFI interface enables automatic device detection during BIOS enumeration.

Use Value: 20-year data retention meets FDA regulatory requirements for medical device lifecycle documentation integrity.

Use Scenario: Storing grid synchronization parameters and firmware patches for remote terminal units in substation automation networks.

IC Role / Device Role / Timing Role: Field-upgradable configuration store; erase suspend allows real-time parameter reads during ongoing firmware update.

Use Value: Four-bank architecture permits continuous telemetry reporting while applying security patches over cellular backhaul.

Equivalent & Alternatives

The following parts are listed as comparable options for similar flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
S29JL032J70TFI423	70 ns access time; wider voltage range (2.7–3.6 V); same pinout and command set	Lower performance margin for high-speed microcontrollers; better suited for battery-powered or wide-temp industrial use	Select when system clock <12 MHz or operating temperature exceeds –40°C to +105°C
S29GL032N90TFI010	32 Mb MirrorBit NOR flash; 90 ns access; different command set (no CFI autoselect); 48-pin TSOP only	Lacks simultaneous read/write; no secured silicon region; requires software adaptation for legacy designs	Choose only for cost-sensitive, non-security-critical replacements where bank interleaving is unused

Compared with S29JL032J70TFI423 and S29GL032N90TFI010, the S29JL032J60TFI423 uniquely delivers 60 ns speed with zero-latency bank concurrency and factory-programmed ESN-critical for secure, real-time embedded systems requiring both performance and trust anchors.

Availability

S29JL032J60TFI423 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, telecom baseband processor code, and medical imaging system bootloaders requiring stable component supply and long-term lifecycle assurance.

Supply support for S29JL032J60TFI423 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive, industrial, and security solutions.

The S29JL032J belongs to Infineon's legacy Cypress NOR Flash product line, engineered for high-reliability embedded systems requiring deterministic firmware execution, secure boot, and in-field upgradability without system interruption.

FAQ

What is the function of the WP#/ACC pin on the S29JL032J60TFI423?

The WP#/ACC pin serves dual functions: as WP# (active-low), it permanently protects the top and bottom boot sectors from accidental program/erase; as ACC (acceleration), it enables faster 6 µs/word programming when driven high during command sequences. This dual-mode pin eliminates need for external logic to manage protection and performance modes.

Does the S29JL032J60TFI423 support true background erase?

Yes-it supports true background erase via Erase Suspend/Erase Resume commands. While erasing one sector, the host can suspend the operation, read or program any non-erasing sector, then resume the original erase. This capability is enabled by its four-bank architecture and independent bank control logic, not just software polling.

How is the Secured Silicon Region accessed and locked?

The Secured Silicon Region (256-byte OTP sector) is accessed using the Enter/Exit Secured Silicon Region command sequence (0x80 → 0x90 → 0xF0). Factory locking sets DQ6=1 and provides a verifiable 16-byte ESN; customer locking is one-time programmable via standard program commands and permanently disables further writes to that sector.

Can the S29JL032J60TFI423 operate in both 8-bit and 16-bit bus configurations?

Yes-via the BYTE# pin: logic LOW configures DQ7–DQ0 as data bus for 8-bit microcontrollers; logic HIGH enables full DQ15–DQ0 for 16-bit interfaces. Address mapping remains consistent (A0–A20), and all command sequences function identically in both modes without software modification.

S29JL032J60TFI423 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: JL-J

Package/Case:: 48-TFSOP (0.724", 18.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 32Mbit

Memory Organization:: 4M x 8, 2M x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 60ns

Access Time:: 60 ns

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 48-TSOP

S29JL032J60TFI423 FAQ

1.How can I place an order for S29JL032J60TFI423 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29JL032J60TFI423 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29JL032J60TFI423 reliable?

The price and inventory of S29JL032J60TFI423 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29JL032J60TFI423 is usually 5 days.

3.What payment methods are accepted for S29JL032J60TFI423?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29JL032J60TFI423 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29JL032J60TFI423?

S29JL032J60TFI423 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29JL032J60TFI423 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29JL032J60TFI423?

For technical support, including S29JL032J60TFI423 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29JL032J60TFI423 requirements.

6.How does Aetrix verify that S29JL032J60TFI423 is sourced from the original manufacturer or authorized distributors?

All S29JL032J60TFI423 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29JL032J60TFI423 meets industry standards.

7.What is the process for return or replacement of S29JL032J60TFI423?

All S29JL032J60TFI423 units undergo pre-shipment inspection (PSI). If there is an issue with S29JL032J60TFI423, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29JL032J60TFI423 part is unused and in its original packaging.

Return procedure for S29JL032J60TFI423:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

2026-08-14 Jumper Cables: How to Use, Connect and Choose Them Safely

Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

2026-08-11 LDO Regulator: Dropout Voltage, Noise, PSRR and Power Dissipation

LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…