Infineon Technologies S29JL032J70BHI310
- Part No.:
- S29JL032J70BHI310
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
S29JL032J70BHI310.pdf
- Description:
- IC FLASH 32MBIT PARALLEL 48FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:566
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29JL032J70BHI310 from Infineon Technologies (formerly Cypress) is a 32-Mb simultaneous read/write flash memory organized as 4M × 8-bit or 2M × 16-bit, operating at 3.0 V only, with 70 ns access time, four-bank architecture, and secured silicon region. It enables zero-latency background erase/program while reading from another bank in industrial control firmware storage and boot code execution.
For engineers reviewing the S29JL032J70BHI310 datasheet, S29JL032J70BHI310 pinout, S29JL032J70BHI310 application, or S29JL032J70BHI310 equivalent, key selection criteria include simultaneous bank operation support, JEDEC CFI compliance, hardware sector protection, 256-byte secured silicon region, and FBGA/TSOP package compatibility for embedded system design.
Technical Context
The device implements a true four-bank architecture with fixed sector addresses, allowing concurrent read from one bank while erasing or programming another-only two banks operate simultaneously. It supports both top- and bottom-boot configurations and uses autoselect mode for factory ID and secured silicon lock verification.
Internal voltage regulation enables single 3.0 V supply operation for read, program, and erase functions. Hardware features include RY/BY# status output, RESET# pin for state machine reset, WP#/ACC pin for write protection and accelerated programming, and BYTE# pin for 8-/16-bit mode selection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mb (4M × 8-bit / 2M × 16-bit), enabling full firmware image storage in compact footprint |
| Access Time | 70 ns max tACC, supporting real-time instruction fetch in microcontroller boot sequences |
| Supply Voltage | 3.0–3.6 V single supply, eliminating need for dual-voltage rails in 3.3 V systems |
| Cycling Endurance | 100K program/erase cycles per sector, suitable for field-upgradable firmware partitions |
| Data Retention | 20 years typical, ensuring long-term reliability in unattended industrial deployments |
| Power Consumption | 200 nA standby current, minimizing quiescent draw in battery-backed or energy-sensitive applications |
| Bank Architecture | Four independent banks, permitting true background erase without interrupting active read operations |
Pinout & Package
Package: 48-ball Fine-pitch BGA (VBK048 footprint). Pinout validated per Infineon Document 002-00857 Rev. *J, Figure 4.2 and Table 5.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 4M-byte or 2M-word addressing space |
| DQ0–DQ15 | Data I/O (16-bit) / DQ0–DQ7 (8-bit) | Bidirectional data bus; BYTE# pin selects 8- or 16-bit mode |
| CE#, OE#, WE# | Chip, Output, Write Enable | Standard asynchronous control signals compatible with legacy microprocessor buses |
| RY/BY# | Ready/Busy Output | Active-low hardware status indicator for program/erase completion detection |
| RESET# | Hardware Reset Input | Forces device into read mode; required for recovery after power-on or error conditions |
| WP#/ACC | Write Protect / Acceleration Input | Hardware lock for outermost boot sectors; high-level pulse enables faster programming |
| BYTE# | Bus Width Select | Configures interface between 8-bit and 16-bit data paths without external logic |
Key Features
| Feature | Design Value |
|---|---|
| Simultaneous Read/Write | Zero-latency interleaved operation across banks eliminates CPU wait states during firmware updates |
| Secured Silicon Region | 256-byte OTP sector with factory-locked ESN and customer-lockable code storage for secure boot keys |
| Erase Suspend/Resume | Allows temporary interruption of sector erase to service urgent read/write requests in other sectors |
| Hardware Sector Protection | Independent enable/disable of program/erase per sector via WP# and command interface |
| CFI Compliance | JEDEC-standard Common Flash Interface enables OS-agnostic driver support and automatic configuration |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
|
Use Scenario: Storing and updating ladder logic programs and I/O configuration tables in programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile firmware storage with in-system reprogrammability and hardware write protection for safety-critical parameters. Use Value: Four-bank architecture allows runtime firmware validation in one bank while executing from another, preventing downtime during updates. |
Use Scenario: Holding boot code and calibration data for digital instrument clusters requiring ASIL-B compliance. IC Role / Device Role / Timing Role: Boot ROM replacement with secured silicon region storing cryptographic keys and anti-tamper identifiers. Use Value: WP#/ACC pin enables hardware-enforced protection of boot sectors while allowing field updates to application partitions. |
| Medical Diagnostic Device Configuration | Network Router Embedded Image Storage |
|
Use Scenario: Retaining device-specific calibration coefficients and regulatory-compliant operational profiles in portable ultrasound units. IC Role / Device Role / Timing Role: High-reliability parameter storage with 20-year data retention and 100K-cycle endurance for recalibration events. Use Value: Secured silicon region stores factory-calibrated sensor offsets, verifiable via autoselect mode to prevent unauthorized modification. |
Use Scenario: Hosting primary and fallback firmware images in enterprise-grade routers requiring zero-downtime upgrades. IC Role / Device Role / Timing Role: Dual-image storage with simultaneous read/write enabling atomic fail-safe firmware swaps. Use Value: Background erase in one bank while serving live traffic from another ensures uninterrupted network availability during updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29JL032J60BHI310 | 60 ns access time vs. 70 ns; otherwise identical architecture, pinout, and feature set | Preferred where tighter timing margins exist in high-speed microprocessor interfaces | Select when system clock timing budget requires sub-70 ns read latency |
| S29JL064J70BHI310 | 64 Mb density (double capacity); same 70 ns speed, 3.0 V supply, and four-bank architecture | Suitable for larger firmware images or dual-application partitioning without changing PCB layout | Choose when future firmware growth or multi-image redundancy is required |
Compared with S29JL032J60BHI310, this part trades 10 ns slower access for broader timing margin tolerance; compared with S29JL064J70BHI310, it offers proven fit in space-constrained designs where 32 Mb suffices and cost sensitivity is higher.
Availability
S29JL032J70BHI310 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical diagnostic device configuration requiring stable component supply and long-term lifecycle support.
Supply support for S29JL032J70BHI310 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, sensing, and connectivity solutions for industrial, automotive, and IoT markets.
This device belongs to Infineon's S29JL series of simultaneous-read/write NOR flash memories, designed specifically for embedded systems requiring deterministic firmware execution, secure boot, and in-field upgradability without system interruption.
FAQ
What is the function of the WP#/ACC pin on S29JL032J70BHI310?
The WP#/ACC pin serves dual roles: as WP# (active-low), it permanently protects the two outermost boot sectors from accidental program/erase; as ACC (high-level pulse), it activates accelerated programming mode, reducing word-program time to 6 µs typical. Both functions are hardware-controlled and require no software overhead.
Does S29JL032J70BHI310 support true background erase?
Yes-it supports true background erase via Erase Suspend/Erase Resume commands. While erasing one sector, the host can suspend the operation, read or program any non-erasing sector, then resume the original erase. This enables zero-interruption firmware updates and real-time data logging during maintenance windows.
How is the secured silicon region used in practice?
The 256-byte secured silicon region functions as a factory-locked, one-time-programmable (OTP) area. It contains a 16-byte factory electronic serial number and supports customer locking. Once locked, it stores immutable keys, certificates, or calibration data-verified via autoselect command without exposing contents to standard read operations.
Can S29JL032J70BHI310 be used in both 8-bit and 16-bit systems?
Yes-the BYTE# pin configures the data bus width: asserted low enables 16-bit mode (DQ15–DQ0 active), high enables 8-bit mode (DQ7–DQ0 active). Address mapping adjusts automatically (4M × 8-bit or 2M × 16-bit), and all control signals remain fully compatible with standard microprocessor buses in either configuration.
S29JL032J70BHI310 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- JL-J
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8, 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-FBGA (8.15x6.15)
S29JL032J70BHI310 FAQ
1.How can I place an order for S29JL032J70BHI310 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29JL032J70BHI310 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29JL032J70BHI310 reliable?
The price and inventory of S29JL032J70BHI310 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29JL032J70BHI310 is usually 5 days.
3.What payment methods are accepted for S29JL032J70BHI310?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29JL032J70BHI310 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29JL032J70BHI310?
S29JL032J70BHI310 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29JL032J70BHI310 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29JL032J70BHI310?
For technical support, including S29JL032J70BHI310 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29JL032J70BHI310 requirements.
6.How does Aetrix verify that S29JL032J70BHI310 is sourced from the original manufacturer or authorized distributors?
All S29JL032J70BHI310 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29JL032J70BHI310 meets industry standards.
7.What is the process for return or replacement of S29JL032J70BHI310?
All S29JL032J70BHI310 units undergo pre-shipment inspection (PSI). If there is an issue with S29JL032J70BHI310, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29JL032J70BHI310 part is unused and in its original packaging.
Return procedure for S29JL032J70BHI310:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29JL032J70BHI310 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

