Infineon Technologies S29JL032J70TFI010
- Part No.:
- S29JL032J70TFI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29JL032J70TFI010.pdf
- Description:
- IC FLASH 32MBIT PARALLEL 48TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:4,907
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29JL032J70TFI010 from Infineon Technologies (formerly Cypress) is a 32-Mb simultaneous read/write flash memory organized as 4M × 8-bit or 2M × 16-bit, operating at 3.0 V only, with 70 ns access time, four-bank architecture, and boot sector configuration. It enables zero-latency background erase/program in one bank while reading from another-critical for real-time firmware updates in industrial controllers.
For engineers reviewing the S29JL032J70TFI010 datasheet, S29JL032J70TFI010 pinout, S29JL032J70TFI010 application, or S29JL032J70TFI010 equivalent, key selection criteria include simultaneous bank operation support, Secured Silicon Region (256-byte OTP), JEDEC CFI compliance, hardware write protection via WP#/ACC, and FBGA/TSOP package compatibility for space-constrained embedded designs.
Technical Context
The S29JL032J70TFI010 implements a true four-bank flash architecture where each bank operates independently-enabling concurrent read and program/erase operations across non-overlapping address spaces. Bank selection is determined by A20–A19 address bits, and sector erase granularity supports flexible firmware partitioning.
It integrates dual power management modes: automatic sleep (200 nA) triggered by address stability, and standby mode (200 nA), both leveraging on-chip voltage regulation for 3.0 V-only operation. Hardware features include RY/BY# status signaling, RESET# for state machine recovery, and WP#/ACC pin with dual-function logic for write protection and accelerated programming.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mb (4,194,304 × 8-bit or 2,097,152 × 16-bit) - defines firmware image capacity and byte/word addressing flexibility. |
| Access Time | 70 ns (tACC) - determines maximum bus clock rate for deterministic read latency in real-time systems. |
| Operating Voltage | 3.0–3.6 V - single-supply operation eliminates need for separate VPP or charge pumps in embedded host interfaces. |
| Cycling Endurance | 100,000 program/erase cycles per sector - supports field-upgradable firmware with long service life. |
| Data Retention | 20 years typical - ensures firmware integrity over full product lifecycle without refresh. |
| Power Consumption | 2 mA active read @ 1 MHz; 200 nA standby - enables low-power operation in battery-backed or energy-harvested systems. |
| Bank Architecture | Four independent banks - allows true background erase/program without halting instruction fetch or data reads. |
Pinout & Package
Package: 48-ball Fine-pitch BGA (VBK048 footprint); RoHS-compliant, 7 mm × 9 mm body, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 4M-byte or 2M-word addressing; A-1 used for byte/word mode selection. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; DQ7–DQ0 active in byte mode, DQ15–DQ0 in word mode; toggle bits DQ6/DQ2 indicate operation status. |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard JEDEC control signals; CE# gating enables low-power deselection; OE# and WE# manage bus contention and timing. |
| RY/BY# | Ready/Busy Output | Active-low open-drain signal indicating completion of program/erase; used for hardware flow control without polling. |
| RESET# | Hardware Reset Input | Asynchronous reset to read mode; recovers from invalid command sequences or power-up initialization errors. |
| WP#/ACC | Write Protect / Acceleration | Active-low dual-function pin: WP# locks boot sectors; ACC enables faster programming when asserted during command sequence. |
| BYTE# | Byte/Word Mode Select | High = 16-bit word mode (DQ15–DQ0); low = 8-bit byte mode (DQ7–DQ0); configures data bus width at power-on. |
Key Features
| Feature | Design Value |
|---|---|
| Simultaneous Read/Write | Zero-latency concurrent access across banks enables real-time firmware patching without CPU stall or interrupt masking. |
| Secured Silicon Region | 256-byte OTP sector with factory-locked ESN and customer-lockable code storage-supports secure boot key binding and anti-cloning. |
| Erase Suspend/Resume | Pauses background erase to service urgent reads or writes elsewhere, then resumes-essential for deterministic response in safety-critical systems. |
| JEDEC CFI Compliance | Standardized parameter table accessible via autoselect mode-enables generic flash drivers and bootloader portability across vendors. |
| Hardware Sector Protection | Independent lock/unlock of any sector group via WP# and command interface-prevents accidental overwrite of boot code or calibration data. |
Applications
| Industrial PLC Firmware Storage | Automotive Telematics Boot Memory |
|---|---|
|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers with no downtime. IC Role / Device Role / Timing Role: Non-volatile program storage with simultaneous read/erase capability enabling hot firmware swaps during runtime. Use Value: Eliminates system reboot requirement during field updates-reducing maintenance window and increasing operational uptime. |
Use Scenario: Holding boot code and OTA update partitions in vehicle telematics gateways requiring ASIL-B aware storage. IC Role / Device Role / Timing Role: Secure, high-endurance flash for dual-image boot with verified rollback and Secured Silicon Region for cryptographic keys. Use Value: Supports certified secure boot chain and failsafe firmware recovery without external security ICs. |
| Medical Imaging System Configuration | Network Router Embedded OS Storage |
|
Use Scenario: Storing calibrated sensor profiles and DICOM metadata mapping tables in portable ultrasound devices. IC Role / Device Role / Timing Role: High-reliability parameter storage with 20-year retention and hardware write protection against EMI-induced corruption. Use Value: Ensures regulatory compliance for data integrity and eliminates recalibration drift due to bit rot or unintended writes. |
Use Scenario: Hosting Linux kernel and root filesystem in carrier-grade edge routers with frequent feature upgrades. IC Role / Device Role / Timing Role: Simultaneous read (kernel execution) and write (firmware download) across banks minimizes service interruption during upgrades. Use Value: Achieves sub-second upgrade commit time and zero-packet-loss during in-service software transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29JL032J60TFI010 | 60 ns access time vs. 70 ns; identical density, voltage, and bank architecture. | Better suited for high-speed microcontroller buses (e.g., ARM Cortex-M7 with 100+ MHz AHB). | Select when system timing budget requires tighter tACC; otherwise, 70 ns version offers same functionality at lower cost. |
| MX29LV320EBTI-70G | 32 Mb, 3.0 V, 70 ns, but two-bank architecture (not four); no Secured Silicon Region or erase suspend. | Limited to simpler boot loader + application partitioning; no background erase capability. | Choose only if simultaneous read/write is unnecessary and cost sensitivity outweighs firmware update flexibility. |
Compared with S29JL032J60TFI010, the 70 ns variant trades marginal speed for broader timing margin and thermal stability; versus MX29LV320EBTI-70G, it delivers true background operation and secure OTP-critical for upgradable, safety-certified systems.
Availability
S29JL032J70TFI010 is available at Aetrix Electronics and suitable for industrial PLCs, automotive telematics gateways, medical imaging subsystems, and network edge routers requiring stable component supply, long-term obsolescence planning, and guaranteed flash endurance.
Supply support for S29JL032J70TFI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and secure memory solutions.
The S29JL032J belongs to Infineon's legacy Cypress flash portfolio, designed specifically for embedded systems demanding reliable, in-system programmable non-volatile storage with real-time update capability and hardware-level security features.
FAQ
What boot sector configuration does S29JL032J70TFI010 support?
The S29JL032J70TFI010 supports both top-boot and bottom-boot sector configurations, selectable at power-on via hardware strapping or command sequence. Sector sizes include 8 × 8 KB, 2 × 32 KB, and 1 × 64 KB in boot regions, with full flexibility to erase any combination of sectors independently.
How is the Secured Silicon Region accessed and locked?
The 256-byte Secured Silicon Region is accessed using the Enter Secured Silicon Region command (0x80 → 0x30 → 0x80 → 0x30). Factory locking sets DQ6=1 permanently; customer locking uses the Lock Secured Silicon command (0x80 → 0x30 → 0x80 → 0x30 → 0x20), after which all writes to the region are disabled irreversibly.
Does S29JL032J70TFI010 require external VPP for programming?
No. The S29JL032J70TFI010 uses internal charge pumps to generate all required high voltages for program and erase operations. Only a single 3.0–3.6 V VCC supply is needed-eliminating external VPP circuitry and simplifying PCB layout and power design.
Can erase suspend be used during a chip erase operation?
No. Erase suspend/resume is supported only for sector erase operations-not chip erase. During chip erase, the device does not respond to suspend commands; attempting to issue them results in ignored inputs. Sector-level suspend enables safe foreground reads/writes while background erasure proceeds.
S29JL032J70TFI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- JL-J
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8, 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
S29JL032J70TFI010 FAQ
1.How can I place an order for S29JL032J70TFI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29JL032J70TFI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29JL032J70TFI010 reliable?
The price and inventory of S29JL032J70TFI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29JL032J70TFI010 is usually 5 days.
3.What payment methods are accepted for S29JL032J70TFI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29JL032J70TFI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29JL032J70TFI010?
S29JL032J70TFI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29JL032J70TFI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29JL032J70TFI010?
For technical support, including S29JL032J70TFI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29JL032J70TFI010 requirements.
6.How does Aetrix verify that S29JL032J70TFI010 is sourced from the original manufacturer or authorized distributors?
All S29JL032J70TFI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29JL032J70TFI010 meets industry standards.
7.What is the process for return or replacement of S29JL032J70TFI010?
All S29JL032J70TFI010 units undergo pre-shipment inspection (PSI). If there is an issue with S29JL032J70TFI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29JL032J70TFI010 part is unused and in its original packaging.
Return procedure for S29JL032J70TFI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29JL032J70TFI010 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

