Infineon Technologies S29JL032J70TFI213
- Part No.:
- S29JL032J70TFI213
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29JL032J70TFI213.pdf
- Description:
- IC FLASH 32MBIT PARALLEL 48TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:900
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29JL032J70TFI213 from Infineon Technologies (formerly Cypress) is a 32-Mb simultaneous read/write flash memory organized as 4M × 8-bit or 2M × 16-bit, operating at 3.0 V only, with 70 ns access time, four-bank architecture, and secured silicon region. It enables zero-latency background erase/program while reading from another bank in industrial control firmware storage and boot code execution.
For engineers reviewing the S29JL032J70TFI213 datasheet, S29JL032J70TFI213 pinout, S29JL032J70TFI213 application, or S29JL032J70TFI213 equivalent, key selection criteria include simultaneous bank operation support, JEDEC CFI compliance, hardware sector protection, boot sector configuration flexibility, and 20-year data retention under industrial temperature conditions.
Technical Context
The device implements a true four-bank architecture where each bank operates independently-enabling concurrent read from one bank and program/erase in another. Bank boundaries are fixed, and sector addresses remain static across configurations, allowing deterministic memory mapping for real-time firmware updates.
It supports both top- and bottom-boot sector configurations with hardware write protection (WP#) for outermost sectors and temporary unprotect capability. The Secured Silicon Region provides 256-byte OTP space with factory-locked ESN and customer-lockable code storage verified via autoselect.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mb (4,194,304 × 8-bit or 2,097,152 × 16-bit), enabling full bootloader + application image storage in single device |
| Access Time | 70 ns max (tACC), ensuring compatibility with 14 MHz bus timing in legacy microcontroller interfaces |
| Banks | Four independent banks, permitting true background erase/program without halting host read operations |
| Data Retention | 20 years typical at Tj = 55 °C, validated for long-life industrial deployments without refresh cycles |
| Cycling Endurance | 100,000 program/erase cycles per sector, supporting field firmware update routines over product lifetime |
| Power Modes | 200 nA standby/automatic sleep current, reducing system-level quiescent power in always-on edge nodes |
| Interface Standard | JEDEC 42.4-compliant command set and CFI support, enabling drop-in replacement in existing flash-aware BIOS/bootloader stacks |
Pinout & Package
Package: 48-ball Fine-pitch BGA (VBK048 footprint), RoHS-compliant, 7 mm × 9 mm body size, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 4M-byte or 2M-word addressing; A-1 used only in byte mode for DQ15/A-1 multiplexing |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; DQ7–DQ0 active in byte mode, DQ15–DQ0 in word mode; toggle bits DQ2/DQ6 indicate operation status |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard asynchronous control signals; CE# gating enables low-power deselection; OE#/WE# timing defines read/write cycle boundaries |
| RY/BY# | Ready/Busy Output | Active-low open-drain status signal indicating internal program/erase completion; used for hardware flow control without polling |
| RESET# | Hardware Reset Input | Asynchronous active-low input forcing device into read mode; required for recovery after power-up or error states |
| WP#/ACC | Write Protect / Acceleration | WP# permanently protects boot sectors; ACC enables accelerated programming (6 µs/word) when driven high during write sequences |
| BYTE# | Byte/Word Mode Select | High = byte mode (DQ7–DQ0 active); low = word mode (DQ15–DQ0 active); determines data bus width and address alignment |
| VCC, VSS | Power Supply | Single 3.0 V ±0.3 V supply; internal charge pumps generate all high-voltage programming/erase potentials-no external VPP needed |
Key Features
| Feature | Design Value |
|---|---|
| Erase Suspend/Resume | Allows interruption of sector erase to read/program non-target sectors-enabling real-time response during firmware updates |
| Secured Silicon Region | 256-byte OTP area with factory-locked 16-byte ESN and customer-lockable code; verifiable via autoselect command |
| Zero-Power Operation | 200 nA standby/sleep current achieved via internal clock gating and voltage detector-eliminates need for external power switches |
| Hardware Sector Protection | Independent lock bits per sector prevent accidental writes/erases; temporary unprotect allows in-system reconfiguration without full unlock |
| Simultaneous Read/Write | Two-bank concurrency (one read, one program/erase) with zero latency handoff-reducing firmware update downtime by >90% vs. single-bank flash |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
|
Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers with runtime validation requirements. IC Role / Device Role / Timing Role: Nonvolatile program storage with background erase capability to enable hot firmware patching without controller reset. Use Value: Four-bank architecture allows continuous I/O scanning during firmware update, maintaining deterministic 10 ms scan cycles. |
Use Scenario: Holding boot code and graphics assets for digital instrument clusters requiring fast cold-start (<500 ms) and secure OTA updates. IC Role / Device Role / Timing Role: Boot ROM with top/bottom sector configuration and WP#-protected boot loader region. Use Value: Secured Silicon Region stores cryptographic keys; 70 ns access ensures boot code fetch meets automotive ASIL-B timing budgets. |
| Medical Diagnostic Device Configuration | Energy Meter Firmware & Calibration Data |
|
Use Scenario: Storing FDA-mandated calibration tables and safety-critical configuration parameters in portable ultrasound systems. IC Role / Device Role / Timing Role: Dual-mode (8/16-bit) interface matches legacy ARM7 and modern Cortex-M4 bus widths. Use Value: 100K endurance and 20-year retention meet IEC 62304 Class C software lifecycle requirements without backup SRAM. |
Use Scenario: Retaining metrology firmware, tariff tables, and tamper logs in ANSI C12.20-certified smart electricity meters. IC Role / Device Role / Timing Role: Hardware sector protection prevents unauthorized modification of revenue-grade calibration constants. Use Value: WP#/ACC pin enables field-programmable acceleration during meter firmware upgrades while locking critical sectors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29JL032J60TFI213 | 60 ns access time (vs. 70 ns); identical pinout, bank architecture, and feature set | Required for systems with tighter 16 MHz bus timing; higher active current (10 mA @ 5 MHz) | Select when system timing margin is <5 ns and thermal budget permits higher active power |
| S29JL064J70TFI213 | 64 Mb density (2× capacity); same 70 ns speed, package, and command set | Needed for larger firmware images or dual-application partitioning (e.g., primary + fallback OS) | Choose when future-proofing for firmware growth or implementing A/B update schemes |
Compared with S29JL032J60TFI213, this 70 ns variant trades 10 ns latency for lower active power and thermal output; versus S29JL064J70TFI213, it offers cost and board space savings where 32 Mb suffices-making it optimal for cost-sensitive, thermally constrained industrial designs.
Availability
S29JL032J70TFI213 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical diagnostic device configuration requiring stable component supply and long-term lifecycle support.
Supply support for S29JL032J70TFI213 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive ICs, and memory solutions with emphasis on reliability and industrial longevity.
This device belongs to Infineon's S29JL series of simultaneous read/write NOR flash, designed specifically for deterministic firmware execution and secure in-field updates in harsh-environment embedded systems.
FAQ
What package type does S29JL032J70TFI213 use?
S29JL032J70TFI213 uses a 48-ball Fine-pitch BGA (VBK048) package with 7 mm × 9 mm body size and 0.8 mm ball pitch. It is RoHS-compliant and pin-compatible with the 48-pin TSOP variant, though PCB layout differs significantly due to ball grid vs. gull-wing lead structure.
Does S29JL032J70TFI213 support both 8-bit and 16-bit data bus modes?
Yes-BYTE# pin selects mode: high enables 8-bit operation (DQ7–DQ0 active), low enables 16-bit operation (DQ15–DQ0 active). Addressing adjusts accordingly: 4M × 8-bit or 2M × 16-bit organization, with A-1 multiplexed on DQ15 in byte mode per JEDEC specification.
How is hardware write protection implemented on this device?
WP# pin provides hardware write protection for the two outermost boot sectors regardless of software sector lock status. When WP# is asserted low, program and erase operations are blocked in those sectors-even if unlocked via command sequence-ensuring immutable boot code integrity.
Can S29JL032J70TFI213 perform erase operations while reading from another bank?
Yes-its four-bank architecture allows simultaneous read from one bank and erase/program in another, with zero latency between operations. Only two banks operate concurrently, and sector addresses are fixed per bank, enabling predictable timing for real-time systems requiring uninterrupted data access.
S29JL032J70TFI213 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- JL-J
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8, 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
S29JL032J70TFI213 FAQ
1.How can I place an order for S29JL032J70TFI213 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29JL032J70TFI213 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29JL032J70TFI213 reliable?
The price and inventory of S29JL032J70TFI213 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29JL032J70TFI213 is usually 5 days.
3.What payment methods are accepted for S29JL032J70TFI213?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29JL032J70TFI213 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29JL032J70TFI213?
S29JL032J70TFI213 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29JL032J70TFI213 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29JL032J70TFI213?
For technical support, including S29JL032J70TFI213 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29JL032J70TFI213 requirements.
6.How does Aetrix verify that S29JL032J70TFI213 is sourced from the original manufacturer or authorized distributors?
All S29JL032J70TFI213 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29JL032J70TFI213 meets industry standards.
7.What is the process for return or replacement of S29JL032J70TFI213?
All S29JL032J70TFI213 units undergo pre-shipment inspection (PSI). If there is an issue with S29JL032J70TFI213, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29JL032J70TFI213 part is unused and in its original packaging.
Return procedure for S29JL032J70TFI213:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29JL032J70TFI213 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

