Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S29JL032J70TFI323

Part No.:
S29JL032J70TFI323
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
48-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixS29JL032J70TFI323.pdf
Description:
IC FLASH 32MBIT PARALLEL 48TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,542

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S29JL032J70TFI323 from Infineon Technologies (formerly Cypress) is a 32-Mb simultaneous read/write flash memory organized as 4M × 8-bit or 2M × 16-bit, operating at 3.0 V only, with 70 ns access time, four-bank architecture, and secured silicon region. It enables zero-latency background erase/program while reading from another bank, supporting boot code storage and firmware updates in embedded controllers and industrial HMI systems.

For engineers reviewing the S29JL032J70TFI323 datasheet, S29JL032J70TFI323 pinout, S29JL032J70TFI323 application, or S29JL032J70TFI323 equivalent, key selection criteria include simultaneous bank operation support, JEDEC CFI compliance, hardware write protection via WP#/ACC, RY/BY# status signaling, and 256-byte secured silicon sector with factory-locked ESN.

Technical Context

The S29JL032J70TFI323 implements a true four-bank flash architecture where each bank operates independently-enabling concurrent read from one bank and erase/program in another. It supports top/bottom boot sector configurations, with fixed sector addresses and software-defined bank grouping.

It integrates JEDEC-standard Common Flash Interface (CFI), erase suspend/resume, data# polling (DQ7), toggle bits (DQ6/DQ2), and autoselect mode for system identification. Internal voltage regulation eliminates need for external high-voltage programming supplies.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 32 Mb (4,194,304 × 8-bit or 2,097,152 × 16-bit), enabling full firmware image storage in single device
Access Time 70 ns max tACC - defines minimum bus cycle timing for reliable 14.3 MHz read throughput
Banks Four independent banks - allows true background operations without CPU stall or latency penalty
Power Modes 200 nA standby/auto-sleep current - reduces system power budget during idle periods
Erase Endurance 100,000 cycles per sector - supports field firmware updates over 10+ years of industrial deployment
Data Retention 20 years typical - ensures long-term reliability in unpowered storage applications
Secured Silicon Region 256-byte OTP sector with factory-locked 16-byte ESN - provides traceable device identity and secure boot key storage

Pinout & Package

Package: 48-ball Fine-pitch BGA (VBK048 footprint), RoHS-compliant, 7 mm × 9 mm body size, 0.8 mm ball pitch.

Pin/Terminal Circuit Role Design Meaning
A0–A20 Address Inputs 21-bit address bus supporting full 4M×8/2M×16 addressing; A-1 used only in byte mode for DQ15/A-1 multiplexing
DQ0–DQ15 Data I/O (16-bit) / DQ0–DQ7 (8-bit) Bidirectional data bus; BYTE# pin selects 8-bit vs 16-bit mode; DQ15 doubles as A-1 in byte mode
CE#, OE#, WE# Chip, Output, Write Enable Standard asynchronous control signals; enable bus contention avoidance and standard microprocessor interface timing
RY/BY# Ready/Busy Output Active-low open-drain status signal indicating active program/erase completion - enables hardware-driven polling
RESET# Hardware Reset Input Asynchronous reset to read mode; required for recovery after power-up or command timeout errors
WP#/ACC Write Protect / Acceleration Input WP# permanently protects outer boot sectors; ACC enables accelerated programming when pulled high during write sequences
BYTE# Bus Width Select High = 16-bit mode (DQ15–DQ0); Low = 8-bit mode (DQ7–DQ0) - configures data path at power-on

Key Features

Feature Design Value
Simultaneous Read/Write Zero-latency concurrent access across banks - eliminates CPU wait states during firmware update
Boot Sector Flexibility Configurable top or bottom boot layout with programmable sector protection - supports dual-image boot schemes
Secured Silicon Region 256-byte OTP area with factory-locked ESN and customer-lockable code - enables secure device authentication
Erase Suspend/Resume Pause ongoing sector erase to service urgent reads/writes elsewhere - guarantees real-time system responsiveness
JEDEC CFI Compliance Standardized query table accessible via autoselect - enables OS/driver auto-detection without hard-coded parameters

Applications

Industrial PLC Firmware Storage Automotive Instrument Cluster Boot Memory

Use Scenario: Storing and updating ladder logic firmware in programmable logic controllers with runtime validation requirements.

IC Role / Device Role / Timing Role: Nonvolatile boot and application code storage with in-system reprogrammability and sector-level protection.

Use Value: Four-bank architecture allows background firmware download while maintaining real-time I/O scan execution - no operational interruption.

Use Scenario: Holding calibrated gauge graphics, driver firmware, and safety-critical boot code in digital instrument clusters.

IC Role / Device Role / Timing Role: Primary boot flash with top-boot configuration and hardware write protection on critical sectors.

Use Value: Secured Silicon Region stores factory-calibrated display offsets and cryptographic keys - tamper-resistant and verifiable via autoselect.

Medical Diagnostic Device Configuration Network Router Boot Image Storage

Use Scenario: Storing FDA-approved calibration profiles, sensor compensation tables, and UI language packs in portable ultrasound units.

IC Role / Device Role / Timing Role: Field-upgradable parameter storage with sector-level erase isolation to preserve validated settings.

Use Value: Erase suspend allows immediate retrieval of active calibration data during background profile update - maintains diagnostic continuity.

Use Scenario: Hosting primary and fallback bootloader images in enterprise-grade routers requiring fail-safe firmware recovery.

IC Role / Device Role / Timing Role: Dual-boot flash with bottom-boot layout and hardware sector protection on boot sectors.

Use Value: WP#/ACC pin enables permanent lock of bootloader sectors while allowing dynamic update of application firmware - prevents bricking.

Equivalent & Alternatives

The following parts are listed as comparable options for similar flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29JL032J60TFI323 60 ns access time (vs. 70 ns); identical bank architecture, package, and feature set Higher-speed requirement in timing-critical boot paths (e.g., automotive ADAS ECUs) Select when system bus timing margin is ≤14 ns; otherwise, 70 ns variant offers better noise immunity and lower power
S29GL032N90TFI020 90 ns access, 3.0–3.6 V supply, mirror-bit architecture, no secured silicon region Lacks OTP sector and factory ESN; supports larger block erase but no simultaneous bank operation Choose for cost-sensitive designs where background operation is unnecessary and secure identity not required

Compared with S29JL032J60TFI323, the 70 ns variant trades 10 ns speed for improved noise margin and lower active current; versus S29GL032N90TFI020, it adds simultaneous operation and secured silicon at higher cost and tighter timing constraints.

Availability

S29JL032J70TFI323 is available at Aetrix Electronics and suitable for industrial PLCs, automotive instrument clusters, medical diagnostic devices, and network infrastructure requiring stable component supply, long-life firmware storage, and secure boot capability.

Supply support for S29JL032J70TFI323 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and secure memory solutions.

The S29JL032J belongs to Infineon's Simultaneous Read/Write Flash product line, designed specifically for embedded systems requiring zero-latency firmware updates, secure boot integrity, and long-term data retention in harsh environments.

FAQ

What does "simultaneous read/write" mean for the S29JL032J70TFI323?

It means the device divides its memory into four independent banks, allowing read operations from one bank while erase or program operations execute in another-without any latency or CPU wait states. This is implemented in hardware with dedicated address/data paths per bank and requires no special controller logic beyond standard flash command sequencing.

How is the secured silicon region used in practice?

The 256-byte secured silicon region contains a factory-programmed 16-byte electronic serial number and supports one-time customer programming. Once locked, its contents cannot be altered. It is accessed via specific CFI commands and verified using the autoselect function-commonly used to store cryptographic keys or device-specific calibration data that must remain immutable.

Can the S29JL032J70TFI323 operate in both 8-bit and 16-bit modes?

Yes-configured by the BYTE# pin at power-on: high enables 16-bit mode (DQ15–DQ0), low enables 8-bit mode (DQ7–DQ0). In 8-bit mode, DQ15 functions as A-1 for extended addressing. The device internally manages bus width alignment, and all command sequences remain identical regardless of mode.

What is the role of the WP#/ACC pin beyond write protection?

WP# provides hardware-level protection for the two outermost boot sectors, independent of software sector locks. When driven high, ACC activates accelerated programming-reducing word-program time from 12 µs to 6 µs typical. Both functions share the same pin but are activated under different voltage and timing conditions, preventing accidental activation.

S29JL032J70TFI323 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
JL-J
Package/Case:
48-TFSOP (0.724", 18.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
32Mbit
Memory Organization:
4M x 8, 2M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
70ns
Access Time:
70 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TSOP

S29JL032J70TFI323 FAQ

1.How can I place an order for S29JL032J70TFI323 through Aetrix?

Please submit a Request for Quotation (RFQ) for S29JL032J70TFI323 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S29JL032J70TFI323 reliable?

The price and inventory of S29JL032J70TFI323 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29JL032J70TFI323 is usually 5 days.

3.What payment methods are accepted for S29JL032J70TFI323?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29JL032J70TFI323 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S29JL032J70TFI323?

S29JL032J70TFI323 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S29JL032J70TFI323 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S29JL032J70TFI323?

For technical support, including S29JL032J70TFI323 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29JL032J70TFI323 requirements.

6.How does Aetrix verify that S29JL032J70TFI323 is sourced from the original manufacturer or authorized distributors?

All S29JL032J70TFI323 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29JL032J70TFI323 meets industry standards.

7.What is the process for return or replacement of S29JL032J70TFI323?

All S29JL032J70TFI323 units undergo pre-shipment inspection (PSI). If there is an issue with S29JL032J70TFI323, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S29JL032J70TFI323 part is unused and in its original packaging.

Return procedure for S29JL032J70TFI323:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S29JL032J70TFI323 Tags

  • S29JL032J70TFI323
  • S29JL032J70TFI323 PDF
  • S29JL032J70TFI323 Datasheet
  • S29JL032J70TFI323 Specifications
  • S29JL032J70TFI323 Images
  • Infineon Technologies
  • Infineon Technologies S29JL032J70TFI323
  • Buy S29JL032J70TFI323
  • S29JL032J70TFI323 Price
  • S29JL032J70TFI323 Distributor
  • S29JL032J70TFI323 Supplier
  • S29JL032J70TFI323 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER