My Inquiry
My Account
Infineon Technologies S29JL032J70TFI413
- Part No.:
- S29JL032J70TFI413
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
S29JL032J70TFI413.pdf
- Description:
- IC FLASH 32MBIT PARALLEL 48TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,188
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S29JL032J70TFI413 from Infineon Technologies (formerly Cypress) is a 32-Mb simultaneous read/write flash memory organized as 4M × 8-bit or 2M × 16-bit, operating at 3.0 V only, with 70 ns access time, four-bank architecture, and secured silicon region. It enables zero-latency background erase/program while reading from another bank in industrial control firmware storage and boot code execution.
For engineers reviewing the S29JL032J70TFI413 datasheet, S29JL032J70TFI413 pinout, S29JL032J70TFI413 application, or S29JL032J70TFI413 equivalent, key selection criteria include simultaneous bank operation support, JEDEC CFI compliance, hardware sector protection, 20-year data retention, and FBGA/TSOP package compatibility for legacy embedded system upgrades.
Technical Context
The device implements a true four-bank architecture with fixed sector addresses, enabling concurrent read from one bank and erase/program in another-only two banks operate simultaneously. It supports top/bottom boot sector configurations and includes a factory-locked 256-byte Secured Silicon Region with 16-byte ESN and customer one-time programmable lock capability.
Hardware features include RY/BY# status output, RESET# pin for state machine reset, WP#/ACC pin for write protection and accelerated programming, and BYTE# pin for 8-/16-bit mode selection. Power management delivers 200 nA standby current and automatic sleep mode entry after address stability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 32 Mb (4,194,304 × 8-bit or 2,097,152 × 16-bit), enabling full firmware image storage in single-device footprint. |
| Access Time | 70 ns max (tACC), ensuring deterministic timing for real-time boot code fetch in microcontroller-based systems. |
| Banks | Four independent banks, allowing true background erase/program without interrupting active read operations. |
| Data Retention | 20 years typical, validated for long-life deployment in unattended industrial equipment. |
| Cycling Endurance | 100,000 program/erase cycles per sector, supporting field firmware updates over product lifetime. |
| Supply Voltage | 3.0–3.6 V only, eliminating need for dual-voltage rails and simplifying power design in 3.3 V systems. |
| Standby Current | 200 nA typical, critical for battery-backed applications requiring ultra-low quiescent power. |
Pinout & Package
Package: 48-ball Fine-pitch BGA (VBK048), RoHS-compliant, 7 mm × 9 mm footprint, suitable for high-density PCB layouts with thermal and signal integrity advantages over TSOP.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 4M-byte or 2M-word addressing; A-1 used only in byte mode for DQ15/A-1 multiplexing. |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; DQ7–DQ0 active in byte mode, DQ15–DQ0 in word mode; toggle bits DQ6/DQ2 indicate operation status. |
| CE#, OE#, WE# | Chip/Output/Write Enable | Standard JEDEC control signals; CE# gating enables low-power deselection; OE# and WE# manage bus contention during read/write transitions. |
| RY/BY# | Ready/Busy Output | Active-low open-drain status signal indicating completion of program/erase; used for hardware flow control without polling overhead. |
| RESET# | Hardware Reset Input | Asynchronous active-low input forcing device into read mode; essential for recovery after power-up or error conditions. |
| WP#/ACC | Write Protect / Acceleration | Multi-function pin: WP# protects outer boot sectors; ACC enables faster programming when driven high during command sequences. |
| BYTE# | Bus Width Select | Active-low input selecting 8-bit (BYTE# = L) or 16-bit (BYTE# = H) data interface; determines DQ pin usage and address alignment. |
Key Features
| Feature | Design Value |
|---|---|
| Erase Suspend/Resume | Allows interruption of sector erase to read/program non-target sectors-enables true background operations without data loss. |
| Secured Silicon Region | 256-byte factory-locked sector with 16-byte ESN; customer-lockable for secure boot code or cryptographic keys with irreversible protection. |
| Zero-Power Operation | Automatic sleep mode reduces current to 200 nA after address stability; eliminates external power-gating circuitry in portable designs. |
| JEDEC CFI Compliance | Standardized query table enables OS/driver auto-detection of geometry, timing, and command set-reducing BSP integration effort. |
| Hardware Sector Protection | Dedicated WP# pin + software-controlled lock bits prevent accidental writes to boot sectors during field updates or debug sessions. |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot Memory |
|---|---|
|
Use Scenario: Storing and executing firmware images in programmable logic controllers with frequent field updates and strict uptime requirements. IC Role / Device Role / Timing Role: Non-volatile program storage with simultaneous read/execute and background erase-ensuring zero-interrupt firmware patching. Use Value: Eliminates system downtime during firmware updates by enabling live code execution while reprogramming adjacent banks. |
Use Scenario: Holding boot code and configuration data in automotive digital instrument clusters where ASIL-B functional safety applies. IC Role / Device Role / Timing Role: Secure boot memory with top/bottom boot sector and hardware write protection to prevent corruption during CAN bus firmware downloads. Use Value: WP#/ACC pin and sector protection ensure boot code integrity even during power transients or erroneous host commands. |
| Medical Diagnostic Equipment BIOS | Telecom Base Station Configuration Storage |
|
Use Scenario: Storing BIOS and calibration tables in portable ultrasound and MRI subsystems requiring 20-year data retention and low power. IC Role / Device Role / Timing Role: Long-life, low-quiescent-current flash for critical startup code and regulatory-mandated calibration data. Use Value: 200 nA standby current and 20-year retention meet IEC 62304 Class C software lifecycle requirements without backup batteries. |
Use Scenario: Holding FPGA configuration bitstreams and runtime parameters in 5G base station remote radio units exposed to wide temperature ranges. IC Role / Device Role / Timing Role: High-reliability flash with 100K endurance and -40°C to +85°C operation supporting hot-swap reconfiguration. Use Value: Four-bank architecture allows background bitstream reload while maintaining active RF signal processing-no service interruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29JL032J60TFI413 | 60 ns access time vs. 70 ns; identical pinout, bank architecture, and feature set. | Preferred for timing-critical boot paths where sub-70 ns latency is required. | Select when system clock timing budget demands faster read access; otherwise, 70 ns variant offers cost/power trade-off. |
| S29GL032N70TFI010 | GL-series successor with enhanced ECC, 1.8/3.0 V dual supply, and 133 MHz DDR interface-not pin-compatible. | Targets new designs requiring higher bandwidth and error correction; not drop-in replaceable. | Choose for next-generation platforms needing improved reliability and throughput; avoid for legacy board replacements. |
Compared with S29JL032J60TFI413, the 70 ns variant trades 10 ns latency for lower dynamic power and broader voltage margin; versus S29GL032N70TFI010, it lacks ECC and DDR but ensures direct mechanical and electrical compatibility in existing TSOP/FBGA footprints.
Availability
S29JL032J70TFI413 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot memory, and medical diagnostic equipment BIOS requiring stable component supply across extended product lifecycles.
Supply support for S29JL032J70TFI413 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and memory solutions with strong industrial and automotive focus.
The S29JL032J belongs to Infineon's legacy NOR flash portfolio-designed specifically for reliable, low-power, in-system programmable code storage in safety-critical and long-lifecycle embedded systems.
FAQ
Is S29JL032J70TFI413 pin-compatible with earlier S29JL032J variants?
Yes-S29JL032J70TFI413 uses the same 48-ball FBGA (VBK048) package and identical pin mapping as all S29JL032J speed grades. The '70' suffix denotes 70 ns access time; electrical and timing parameters differ, but mechanical and logical interfaces remain fully compatible.
Does this device support both 8-bit and 16-bit data bus configurations?
Yes-BYTE# pin selects bus width: low for 8-bit mode (DQ7–DQ0 active), high for 16-bit mode (DQ15–DQ0 active). Addressing adjusts automatically: 4M × 8-bit or 2M × 16-bit organization is fixed in silicon and transparent to host software via standard JEDEC CFI queries.
How does the Secured Silicon Region function in practice?
The 256-byte Secured Silicon Region is factory-programmed with a unique 16-byte ESN and locked. Customers may use it as general-purpose flash until locking it via OTP command-after lock, reads succeed but writes/erases are permanently disabled, verified by DQ6 status bit.
What is the role of the WP#/ACC pin during normal operation?
WP# provides hardware-level write protection for the two outermost boot sectors regardless of software sector lock status. When driven high, ACC accelerates programming timing by enabling internal voltage boost-required for 6 µs/word typical program time in accelerated mode.
S29JL032J70TFI413 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- JL-J
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 32Mbit
- Memory Organization:
- 4M x 8, 2M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
S29JL032J70TFI413 FAQ
1.How can I place an order for S29JL032J70TFI413 through Aetrix?
Please submit a Request for Quotation (RFQ) for S29JL032J70TFI413 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S29JL032J70TFI413 reliable?
The price and inventory of S29JL032J70TFI413 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S29JL032J70TFI413 is usually 5 days.
3.What payment methods are accepted for S29JL032J70TFI413?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S29JL032J70TFI413 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S29JL032J70TFI413?
S29JL032J70TFI413 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S29JL032J70TFI413 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S29JL032J70TFI413?
For technical support, including S29JL032J70TFI413 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S29JL032J70TFI413 requirements.
6.How does Aetrix verify that S29JL032J70TFI413 is sourced from the original manufacturer or authorized distributors?
All S29JL032J70TFI413 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S29JL032J70TFI413 meets industry standards.
7.What is the process for return or replacement of S29JL032J70TFI413?
All S29JL032J70TFI413 units undergo pre-shipment inspection (PSI). If there is an issue with S29JL032J70TFI413, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S29JL032J70TFI413 part is unused and in its original packaging.
Return procedure for S29JL032J70TFI413:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S29JL032J70TFI413 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
